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Recent Advancement of Research in Silver-Based Solder Alloys 银基钎料合金的研究进展
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH10
A. Sharif
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引用次数: 0
Gold-Based Interconnect Systems for High-Temperature and Harsh Environments 用于高温和恶劣环境的金基互连系统
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH8
A. Akter, A. Sharif, R. Mahbub
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引用次数: 0
Index 指数
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.index
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引用次数: 0
Development of Zn-Al-xNi Lead-Free Solders for High-Temperature Applications 高温应用Zn-Al-xNi无铅焊料的研制
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH5
Sanjoy Mallick, Sharear Kabir, A. Sharif
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引用次数: 0
Role of Alloying Addition in Zn-Based Pb-Free Solders 合金添加在锌基无铅钎料中的作用
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH3
Khairul Islam, A. Sharif
{"title":"Role of Alloying Addition in Zn-Based Pb-Free Solders","authors":"Khairul Islam, A. Sharif","doi":"10.1002/9783527813964.CH3","DOIUrl":"https://doi.org/10.1002/9783527813964.CH3","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130506854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy 冷却速率对铸造Zn-Al-Mg高温无铅钎料合金组织、力学性能和抗蠕变性能的影响
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH4
R. Mahmudi, D. Farasheh, Seyyed S. Biriaie
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引用次数: 0
Glass-Frit-Based Die-Attach Solution for Harsh Environments 适用于恶劣环境的玻璃片贴片解决方案
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH14
A. Sharif
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引用次数: 1
Silver Nanoparticles as Interconnect Materials 纳米银互连材料
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH11
Md. Ashif Anwar, R. Galib, A. Sharif
{"title":"Silver Nanoparticles as Interconnect Materials","authors":"Md. Ashif Anwar, R. Galib, A. Sharif","doi":"10.1002/9783527813964.CH11","DOIUrl":"https://doi.org/10.1002/9783527813964.CH11","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121802483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials 碳纳米管增强焊料作为热界面材料
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH15
M. Billah
{"title":"Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials","authors":"M. Billah","doi":"10.1002/9783527813964.CH15","DOIUrl":"https://doi.org/10.1002/9783527813964.CH15","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122795911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
All-Copper Interconnects for High-Temperature Applications 用于高温应用的全铜互连
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH13
A. Sharif
{"title":"All-Copper Interconnects for High-Temperature Applications","authors":"A. Sharif","doi":"10.1002/9783527813964.CH13","DOIUrl":"https://doi.org/10.1002/9783527813964.CH13","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121264642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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