{"title":"Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy","authors":"R. Mahmudi, D. Farasheh, Seyyed S. Biriaie","doi":"10.1002/9783527813964.CH4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"114 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Harsh Environment Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527813964.CH4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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