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Bi-Based Interconnect Systems and Applications 基于bi的互连系统与应用
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH9
Manifa Noor, A. Sharif
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引用次数: 0
Study of Zn-Mg-Ag High-Temperature Solder Alloys Zn-Mg-Ag高温钎料合金的研究
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH6
R. Galib, Md. Ashif Anwar, A. Sharif
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引用次数: 0
Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders 作为含铅钎料潜在替代品的Zn-Mo和Zn-Cr无铅复合钎料的表征
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH7
Khairul Islam, A. Sharif
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引用次数: 0
Wide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications 用于高温和恶劣环境应用的宽带隙半导体器件技术
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH1
M. R. Islam, R. Galib, Montajar Sarkar, S. Chowdhury
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引用次数: 2
Reliability Study of Solder Joints in Electronic Packaging Technology 电子封装技术中焊点可靠性研究
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH16
A. Sharif, Sushmita Majumder
{"title":"Reliability Study of Solder Joints in Electronic Packaging Technology","authors":"A. Sharif, Sushmita Majumder","doi":"10.1002/9783527813964.CH16","DOIUrl":"https://doi.org/10.1002/9783527813964.CH16","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123408112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Transient Liquid Phase Bonding 瞬态液相键合
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH12
Tariq Islam, A. Sharif
{"title":"Transient Liquid Phase Bonding","authors":"Tariq Islam, A. Sharif","doi":"10.1002/9783527813964.CH12","DOIUrl":"https://doi.org/10.1002/9783527813964.CH12","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"99 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122583566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-Temperature Lead-free Solder Materials and Applications 高温无铅焊料材料及应用
Harsh Environment Electronics Pub Date : 2019-03-29 DOI: 10.1002/9783527813964.CH2
M. Sabri, Bakhtiar Ali, S. Said
{"title":"High-Temperature Lead-free Solder Materials and Applications","authors":"M. Sabri, Bakhtiar Ali, S. Said","doi":"10.1002/9783527813964.CH2","DOIUrl":"https://doi.org/10.1002/9783527813964.CH2","url":null,"abstract":"","PeriodicalId":412936,"journal":{"name":"Harsh Environment Electronics","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125511471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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