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2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)最新文献

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IC Test Quality Enhancement by Introducing Machine Learning 引入机器学习提高集成电路测试质量
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052135
B. Wu
{"title":"IC Test Quality Enhancement by Introducing Machine Learning","authors":"B. Wu","doi":"10.23919/eMDC/ISSM48219.2019.9052135","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052135","url":null,"abstract":"“Big data” is a popular term everywhere. However, it becomes another topic how to take advantage of data and induction/deduction effective conclusions to support quality enhancement. In industry, big data accompanies with big effort due to manufacture complex architectures. People still frequently fine tune rules by manual, either most of academic researches not able to fit complicated semiconductors process due to exceptions. Data is correct but lack of industrial knowledge base. In this paper, we pointed out IC test quality bottlenecks in data confuse which influences machine learning analysis and embedded adaptive model from die, lot and product levels on simple workable mechanism by vertical and horizontal two machine learning dimensions to make system “like live” in automatically ways to enhance test quality.","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121670112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical failure analysis using SEM Automated Process Inspection (API) System 使用SEM自动化过程检测(API)系统进行电气故障分析
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052084
Yu-Chi Chen, Shih-Ping Lee, B. Tsai, Chun-I Chan
{"title":"Electrical failure analysis using SEM Automated Process Inspection (API) System","authors":"Yu-Chi Chen, Shih-Ping Lee, B. Tsai, Chun-I Chan","doi":"10.23919/eMDC/ISSM48219.2019.9052084","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052084","url":null,"abstract":"The introduction of automated process inspection (API) system using in-line SEMVision was applied to monitor the contact process of the inter layer dielectric (ILD). The conventional optical inspection systems do not have enough resolution to monitor ILD contact etching when the technology has scaled down to the deep submicron node from the submicron. In semiconductor process, the contact process of the ILD is one of the most critical processes. Usually, in-line E-beam system is used in monitoring the contact process or to detect device leakage. The Off-line uses TEM to check contact etching with a physical failure analysis [1]. Low throughput is the main disadvantage in both E-beam and TEM inspections, especially the physical analysis of TEM, which needs more than 2~3 days due to the complex sample preparation. In order to shorten the inspection time of the E-beam, we developed a novel mode of a rapid auto process inspection system using inline SEMVision, this can effectively detect contact processing issues.","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126990266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mining Factors Impact Wafer Circuit Probing Via Neural Network and Statistics for Semiconductor Device Fabrication 基于神经网络和统计的半导体器件制造晶圆电路探测挖掘因素
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052131
J. Kung, Yung Chien Kung, Jing Pei Lin, Ming Wei Chen, Te Hsuan Chen, Hsiao Ying Yang, Pei Wen Chen
{"title":"Mining Factors Impact Wafer Circuit Probing Via Neural Network and Statistics for Semiconductor Device Fabrication","authors":"J. Kung, Yung Chien Kung, Jing Pei Lin, Ming Wei Chen, Te Hsuan Chen, Hsiao Ying Yang, Pei Wen Chen","doi":"10.23919/eMDC/ISSM48219.2019.9052131","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052131","url":null,"abstract":"Wafer circuit probing (CP) testing is one of the most important processes for semiconductor manufacturing to ensure the wafers are of good quality. However, the outcomes of CP measurements are not always as good as expected. Engineers take lots of efforts to diagnose CP measurement and classify the features so that make the root cause more evident. In searching the root cause for low yield wafers, gathering the bad wafers and finding their correlation between yields and stages for each process is a common procedure to check whether the stage or the corresponding equipment is the one of the factors that lowers the yield significantly. A system was developed to realize the procedure that defines wafer status and points out the problems that make the yield lower. Once a wafer was inputted into this system, a diagnosis for the wafer will be made automatically. And hence this system was named auto commonality, which means grouping the bad wafers and finding the root cause then making decisions without any manpower.","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126563331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Applications of Hybrid flowshop schedulings under dynamic constraints of queue time and capacities 队列时间和容量动态约束下混合流水车间调度的应用
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052109
Motoharu Tanaka, Keita Nishizawa, Tomoki Ohno, Y. Ogawa, S. Arima
{"title":"Applications of Hybrid flowshop schedulings under dynamic constraints of queue time and capacities","authors":"Motoharu Tanaka, Keita Nishizawa, Tomoki Ohno, Y. Ogawa, S. Arima","doi":"10.23919/eMDC/ISSM48219.2019.9052109","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052109","url":null,"abstract":"This paper introduced the hybrid flowshop scheduling (HFS) for a production system including Q-time restrictions or products with individual due-dates such as Make-to-Order products. Two of Gupta's algorithms for 2-step and for n-step hybrid flowshop problem (2010) were extended to consider with the restrictions of queueing time. Those are denoted by Extended-Gupta (2) and Extended-Gupta (n) here. As the result of performance evaluations using actual conditions of target production systems, Both of the Extended algorithms much improved the utilization of machines without deterioration of the due-date satisfaction rate, though ordinal dispatching rules or the original Gupta algorithm results lower utilization or lower due-date satisfaction rate. Extended-Gupta (n) performs better than Extended-Gupta (2) because of its total optimization ability","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124804966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Analysis for Dynamic Statistical Process Control with Interventions 带有干预的动态统计过程控制分析
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052108
Lingyen Yeh, Zhewu Zheng, Shutao Huang
{"title":"Analysis for Dynamic Statistical Process Control with Interventions","authors":"Lingyen Yeh, Zhewu Zheng, Shutao Huang","doi":"10.23919/eMDC/ISSM48219.2019.9052108","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052108","url":null,"abstract":"The assumption of normal distribution is questionable in Shewhart and Hotelling T2 statistical process control mainly because of the process dynamics. The method of analyzing the process dynamics in the statistical process is reported. The statistical process data are separated to the dynamic and static series in a chemical-mechanical polishing process. The dynamic series is the time series with interventions. The dynamic series is applied to fit the statistical process data and the mean average percentage errors are about 4.5 % in the univariate analysis and 3 % in the multivariate one. The static series is normal distribution taking the p-value of 0.05 as the criteria in the null hypothesis of Shapiro-Wilk test, which suggests the autocorrelation is mostly covered in the dynamic series.","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114766022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Measurement System Analysis Research Framework for Measurement System and Empirical Study with Automation Time-Domain Measurements 测量系统分析研究框架及自动化时域测量的实证研究
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2019-09-01 DOI: 10.23919/eMDC/ISSM48219.2019.9052134
Y. Ling, Ying-Jen Chen, C. Chien
{"title":"A Measurement System Analysis Research Framework for Measurement System and Empirical Study with Automation Time-Domain Measurements","authors":"Y. Ling, Ying-Jen Chen, C. Chien","doi":"10.23919/eMDC/ISSM48219.2019.9052134","DOIUrl":"https://doi.org/10.23919/eMDC/ISSM48219.2019.9052134","url":null,"abstract":"We target the problem of providing 5G network connectivity in rural zones by means of Base Stations (BSs) carried by Unmanned Aerial Vehicles (UAVs). Our goal is to schedule the UAVs missions to: i) limit the amount of energy consumed by each UAV, ii) ensure the coverage of selected zones over the territory, ii) decide where and when each UAV has to be recharged in a ground site, iii) deal with the amount of energy provided by Solar Panels (SPs) and batteries installed in each ground site. We then formulate the RURALPLAN optimization problem, a variant of the unsplittable multicommodity flow problem defined on a multiperiod graph. After detailing the objective function and the constraints, we solve RURALPLAN in a realistic scenario. Results show that RURALPLAN is able to outperform a solution ensuring coverage but not considering the energy management of the UAVs.","PeriodicalId":398770,"journal":{"name":"2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116805623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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