Proceedings of Electro/International 1995最新文献_第3页

The next generation: CAD/CAM/CAE 下一代:CAD/CAM/CAE

Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471051

H. Cohen

{"title":"The next generation: CAD/CAM/CAE","authors":"H. Cohen","doi":"10.1109/ELECTR.1995.471051","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471051","url":null,"abstract":"CAD became better when we added other software specialities to our drafting tools. We added word processing, and coupled notes to our drawings. Today you have to add a spell checker, or you'll be embarrassed. We added spread sheets and got bills of materials. We added data bases and evolved huge libraries of component parts. So what is reasonably next. One answer in multimedia. Let's add video to our drawings so we can SHOW the assembler how to put the parts together. Let's use sound bites to instruct a service tech working on a new product. Let's use animation and rendering for both better understanding our mechanisms and illustrating them. Let's take the next step and integrate virtual reality so the user has control of what he or she will look at and explore. What a boon to technical training, either future engineers or service personnel, if they could travel around inside an engine and see how things work. One writer called this 'teaching in the first person'. Rather than our old, traditional 3rd person style. Then there is the use of the Client-Server. How many companies have yet to handle drafting room documents on a distributed system? After putting Administration, Accounting, Marketing and Personnel on line, let's put Engineering, Purchasing, Manufacturing, Materials Management, and the Service Department on the same network. Let's create the data modalities so new designs (CAD drawings) can easily assist manufacturing to better define their processes and controls, Materials Management can begin its procurement process and start to plan inventory control. And in turn these activities can create feedback to Engineering to fine tune details of design. Then integrate your animated releases and VR training files.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129849311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Who is going to buy the darn thing? [marketing] 谁会买这该死的东西?(营销)

Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471046

R. E. Grabowski

引用次数: 0

New IC stacking process ideal for high-density memory module and hybrid applications 新的IC堆叠工艺是高密度存储模块和混合应用的理想选择

Proceedings of Electro/International 1995 Pub Date : 1995-06-21 DOI: 10.1109/ELECTR.1995.471053

C. Brown

{"title":"New IC stacking process ideal for high-density memory module and hybrid applications","authors":"C. Brown","doi":"10.1109/ELECTR.1995.471053","DOIUrl":"https://doi.org/10.1109/ELECTR.1995.471053","url":null,"abstract":"A patented assembly technology for stacking integrated circuits, developed by Cubic Memory, Inc. (CMI), offers immediate applications for significantly increasing memory density and secondary storage capacity in PCMCIA, SIMM (Single in-line Memory Module), DIMM (Dual In-line Memory Module) and other small form factors while simultaneously reducing power consumption. The technology can also be used to combine microprocessors, memory and other ICs in very small spaces, opening new opportunities for new or more powerful types of PCMCIA cards and multi-chip modules. CMI has developed the first cost-effective process for vertical and horizontal interconnection of bare (unpackaged) semiconductor memory wafer segments or individual die. By thinning and vertically interconnecting the wafer segments, CMI has been able to achieve unparalleled storage densities. As a result, much higher density, small-form factor memory and mass storage products can be produced than have previously been available. Furthermore, the close physical proximity of the chips significantly reduces the system delay associated with interconnect capacitance and printed circuit board trace length. Performance is increased and power requirements and operating temperature are reduced. This new vertical interconnection technology opens up many new opportunities for powerful memory, secondary storage and custom applications in PCMCIA, SIMM, DLMM, multi-chip modules and other small form factors. In addition to previously unattainable densities of DRAM, SRAM and Flash memory, the technology can be used to stack custom combinations of processors, memory and other ICs to create new solutions that have not previously been possible due to space and power limitations.<<ETX>>","PeriodicalId":397146,"journal":{"name":"Proceedings of Electro/International 1995","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126290908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Career advancement and survival for engineers 工程师的职业发展与生存

Proceedings of Electro/International 1995 Pub Date : 1994-06-27 DOI: 10.1109/electr.1995.471042

J. Hoschette

引用次数: 5

Designing, developing, and prototyping devices and systems: the University option 设计，开发和原型设备和系统:大学选项

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471049

B. Goodhue, M. Fiddy

引用次数: 0

Material and device characterization to improve yield and performance 材料和器件特性，以提高良率和性能

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471022

C. Sung

引用次数: 21

The application of advanced economic analysis techniques to the evaluation of network expansion alternatives 先进经济分析技术在网络扩容方案评价中的应用

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471041

B.D. Huntley

引用次数: 0

How agile manufacturing can improve your manufacturing productivity and quality 敏捷制造如何提高生产效率和质量

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471039

J. Buford, P. Krolak

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引用次数: 1

Novel polymeric materials for electronic and electro-optic applications 用于电子和电光应用的新型聚合物材料

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471038

J. Kumar

引用次数: 0

The next generation: CAD/CAM/CAE 下一代:CAD/CAM/CAE

Proceedings of Electro/International 1995 Pub Date : 1900-01-01 DOI: 10.1109/ELECTR.1995.471029

K. Spenser

引用次数: 0