Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.最新文献_第2页

A framework for environmental impact assessment tools: comparison validation and application using case study of electronic products 环境影响评估工具的框架:电子产品案例研究的比较验证与应用

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437027

R. Kulkarni, H. Zhang, Jianzhi Li, Junning Sun

引用次数: 5

Case study for high volume lead-free wave soldering process with environmental benefits 具有环境效益的大批量无铅波峰焊工艺案例研究

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437002

I. Baylakoğlu, S. Hamarat, H. Gokmen, E. Meriç

{"title":"Case study for high volume lead-free wave soldering process with environmental benefits","authors":"I. Baylakoğlu, S. Hamarat, H. Gokmen, E. Meriç","doi":"10.1109/ISEE.2005.1437002","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437002","url":null,"abstract":"This paper discusses case study of Sn/Ag/Cu lead free wave soldering process for high volume production with benefits of environment. Key variables in a lead-free solder wave soldering process are alloy cost, solder pot temperature, dross forming characteristics of the alloy, nitrogen use or air atmosphere, flux selection and activator, flux application system and volume, alloy contaminant effects, alloy elemental concentration control, recycling of spent solder, board/lead finishes, process control changes. In this study, commercially available 99.999% purity nitrogen use in wave soldering was examined and the significance of it in dross rate reduction, product quality and process success was discussed. Dross formation of Sn/Ag/Cu with nitrogen environment was compared with eutectic Sn/Pb bath with air atmosphere and solder bath dross maintenance depending on lot size was evaluated. The effect of no clean VOC free flux on the board quality was also evaluated, recommendations are presented for the improvement of lead free application soldering performance (bridging, wetting and hole filling). For successful process steps in lead-free wave soldering implementation was described. The cost and environmental benefits of nitrogen usage was also presented for high volume single sided lead free assembly.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116643162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Exploring options for individual producer responsibility for waste from private households for the Waste Electrical and Electronic Equipment Directive 根据《废弃电气和电子设备指令》，探讨个人生产者对私人家庭废物的责任

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1436992

L. Hicks

引用次数: 16

Disassembly analysis, material composition analysis and environmental impact analysis for computer drives 计算机驱动器的拆卸分析、材料成分分析和环境影响分析

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437028

S. Mohite, Hongchao Zhang

{"title":"Disassembly analysis, material composition analysis and environmental impact analysis for computer drives","authors":"S. Mohite, Hongchao Zhang","doi":"10.1109/ISEE.2005.1437028","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1437028","url":null,"abstract":"The main objective of this paper is to i) provide the results of disassembly analysis of the computer drives such as hard disk drive of desktop, floppy disk drive and CD-ROM drive of server and floppy disk drive of laptop ii) to identify the components and material and iii) determine the environmental impact of these material and product as a whole. For the disassembly analysis the computer drives were first disassembled to the component level and disassembly time was recorded. The best disassembly sequence is presented in this paper to indicate the least amount of disassembly time for these drives. Material assessment was conducted as another part of this study and the results are presented here in detail for the drives analyzed. Printed circuit boards (PCB's) from the computer drives were analytical tested for determining precious and hazardous metal content. All plastics and few other components are identified by the plastic label or from the available results in the literature. Environmental impact assessment was done by using eco-indicator 99 methodology. Environmental impact caused by components and materials of the drive was calculated and environmental impact of the computer drive as a whole was also calculated. This paper presents the above data with respect to the computer drives and can be used as a base to conduct further advancement in the studies involving the design modification and alternate material selection for making the computer drives less burden some for the environment.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133124212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Simulation of household factor X in Japan 日本家庭因素X的模拟

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437018

T. Aoe

引用次数: 0

Design for active disassembly (DfAD): an outline for future research 主动拆卸设计(DfAD):未来研究概述

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437007

B. Willems, W. Dewulf, J. Duflou

引用次数: 22

Information architecture for electronics recycling National Coordinating Entity 电子回收国家协调实体的信息体系结构

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1436989

J. Linnell, J. Tucker, T. Linger, S. Smith, W. Alcorn

引用次数: 7

Electronic data exchange standards and technology developments to support eco-compliance 电子数据交换标准和技术发展，以支持生态合规

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437015

R. Kubin

引用次数: 4

Business approaches to environmental policies 环境政策的商业方法

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1436994

J. Dietrich

{"title":"Business approaches to environmental policies","authors":"J. Dietrich","doi":"10.1109/ISEE.2005.1436994","DOIUrl":"https://doi.org/10.1109/ISEE.2005.1436994","url":null,"abstract":"The management of materials in electronic products has become a critical business issue for electronics manufacturers; one which is requiring new business process and business management approaches. Where in the past, environmental regulations were focused on managing and reducing the environmental impacts of manufacturing facilities, the regulatory focus has expanded to include reducing manufacturing and product end of life impacts through the regulation of the materials present in products. The most immediate manifestation of this push is the European Parliament and the Council of the European Union jointly enacted Directive 2002/95/EC pertaining to the restriction of the use of certain hazardous substances in electrical and electronic equipment (more usually referred to as the \"RoHS Directive\"), with regulations and initiatives underway in Japan, China, and individual states within the United States. The requirements of these initiatives have demanded a business response in several areas: acknowledgement of the business impacts of these requirements, management of material data for components and end-products, integration of material requirements into existing quality control processes, and development of business processes to track and update product material properties and respond to customer requests for material information.","PeriodicalId":397078,"journal":{"name":"Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129429276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

New microprocessor features for lower power and increased performance: doing "Moore's" with less 新的微处理器功能，更低的功耗和更高的性能:做“摩尔”更少

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI: 10.1109/ISEE.2005.1437011

Donna Sadowy

引用次数: 3