ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis最新文献

筛选
英文 中文
Failure Analysis Techniques for 3-D Technology 三维技术失效分析技术
I. De Wolf, K. Jacobs
{"title":"Failure Analysis Techniques for 3-D Technology","authors":"I. De Wolf, K. Jacobs","doi":"10.31399/asm.cp.istfa2021tpi1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpi1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Failure Analysis Techniques for 3D Technology].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124494800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Failure Analysis for Hardware Security 硬件安全故障分析
N. Asadi
{"title":"Failure Analysis for Hardware Security","authors":"N. Asadi","doi":"10.31399/asm.cp.istfa2021tpm1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpm1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Failure Analysis for Hardware Security].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116958549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine Learning Based Data and Signal Analysis Methods for the Application in Failure Analysis 基于机器学习的数据和信号分析方法在故障分析中的应用
M. Kögel, S. Brand, F. Altmann
{"title":"Machine Learning Based Data and Signal Analysis Methods for the Application in Failure Analysis","authors":"M. Kögel, S. Brand, F. Altmann","doi":"10.31399/asm.cp.istfa2021tpb1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpb1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Machine Learning Based Data and Signal Analysis Methods for the Application in Failure Analysis].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133982280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Basics and Current Aspects of Scanning Electron Microscopy 扫描电子显微镜的基础和当前方面
H. Stegmann
{"title":"Basics and Current Aspects of Scanning Electron Microscopy","authors":"H. Stegmann","doi":"10.31399/asm.cp.istfa2021tpk1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpk1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Basics and Current Aspects of Scanning Electron Microscopy].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124814363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Charged Particle Systems: Fundamentals and Opportunities 带电粒子系统:基本原理和机会
E. Principe
{"title":"Charged Particle Systems: Fundamentals and Opportunities","authors":"E. Principe","doi":"10.31399/asm.cp.istfa2021tpn1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpn1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Charged Particle Systems: Fundamentals and Opportunities].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132181932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Focused Ion Beam (FIB) for Chip Circuit Edit and Fault Isolation 聚焦离子束(FIB)用于芯片电路编辑和故障隔离
Steven B. Herschbein
{"title":"Focused Ion Beam (FIB) for Chip Circuit Edit and Fault Isolation","authors":"Steven B. Herschbein","doi":"10.31399/asm.cp.istfa2021tph1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tph1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Focused Ion Beam for Chip Circuit Edit and Fault Isolation].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115076280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
STEM-in-SEM: From Basic Imaging to Rigorous Quantitative Analysis STEM-in-SEM:从基本成像到严格定量分析
Jason Holm
{"title":"STEM-in-SEM: From Basic Imaging to Rigorous Quantitative Analysis","authors":"Jason Holm","doi":"10.31399/asm.cp.istfa2021tpj1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpj1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[STEM-in-SEM: From Basic Imaging to Rigorous Quantitative Analysis].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114328215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Technique Selection for Front End of Line Defect Localization in Bulk Si FA 体硅FA线前端缺陷定位技术选择
Gregory M. Johnson
{"title":"Technique Selection for Front End of Line Defect Localization in Bulk Si FA","authors":"Gregory M. Johnson","doi":"10.31399/asm.cp.istfa2021tpf1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpf1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Technique Selection for Front End of Line Defect Localization in Bulk Semiconductor Failure Analysis].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"478 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133712562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Photonic Localization Techniques 光子定位技术
C. Boit
{"title":"Photonic Localization Techniques","authors":"C. Boit","doi":"10.31399/asm.cp.istfa2021tpd1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpd1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Photonic Localization Techniques].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127177850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Yield Basics for Failure Analysts 失效分析的良率基础
D. Albert
{"title":"Yield Basics for Failure Analysts","authors":"D. Albert","doi":"10.31399/asm.cp.istfa2021tpc1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpc1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Yield Basics for Failure Analysis].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122195552","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信