发布求助
文献互助 智能选刊 最新文献

ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis最新文献

筛选
英文 中文
Failure Analysis Challenges for Chip Scale Packages 芯片级封装的失效分析挑战
ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis Pub Date : 2013-05-01 DOI: 10.31399/asm.cp.istfa2021tpl1
Susan X. Li
{"title":"Failure Analysis Challenges for Chip Scale Packages","authors":"Susan X. Li","doi":"10.31399/asm.cp.istfa2021tpl1","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2021tpl1","url":null,"abstract":"\u0000 Presentation slides from the ISTFA 2021 tutorial, “[Failure Analysis Challenges for Chip Scale Packages].”","PeriodicalId":390794,"journal":{"name":"ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133066759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信