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2021 Smart Systems Integration (SSI)最新文献

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Simple and Powerful encapsulation through Hybrid Packaging for Electrochemical Transducers 电化学换能器的混合封装简单而强大
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9466968
M. Steinmaßl, J. Boudaden, W. Hell, C. Kutter
{"title":"Simple and Powerful encapsulation through Hybrid Packaging for Electrochemical Transducers","authors":"M. Steinmaßl, J. Boudaden, W. Hell, C. Kutter","doi":"10.1109/SSI52265.2021.9466968","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9466968","url":null,"abstract":"We present a simple and reliable hybrid packaging of rigid electrochemical transducers and flexible foil having electrical connections. Among a large number of biochemical transducers, we target in this work two types of transducers: 3-electrode systems and ion selective field effect transistors (ISFET). The hybrid packaging ensures several requirements such as: biocompatibility to biological analytes, precise tight encapsulation, protection of transducers surface, mechanical stability, reliable electrical contact and light shielding of sensitive parts. The proposed hybrid packaging of biochemical transducers is based on a flip-chip bonding process, which necessitates low-cost materials, a reduced number of processing steps as well as compatibility to common roll-to-roll (R2R) processes.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130641997","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies 混合技术的先进封装和系统集成的规模
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9467004
Ramsey Selim, R. Hoofman, R. Labie, Veda Sandeep, T. Drischel, K. Torki
{"title":"Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies","authors":"Ramsey Selim, R. Hoofman, R. Labie, Veda Sandeep, T. Drischel, K. Torki","doi":"10.1109/SSI52265.2021.9467004","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9467004","url":null,"abstract":"This paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including copackaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need true advanced packaging and system integration to realize their complex multi-technology devices. This is done by means of a virtual demonstrator that include both 2.5D/3D assemblies of ASICs and integrated photonic devices, as well as MEMS and microfluidics devices. It also addresses lowering the cost barrier for users accessing these technologies for their products, such that it will enable an increased uptake of system integration by the industry at large.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129691533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DNA origami for biosensor applications 生物传感器应用的DNA折纸
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9467014
Julia Hann, A. Morschhauser, Andreas Heerwig, J. Erben, D. Reuter, Valery Pavlov, M. L. de la Chapelle, M. Mertig, T. Otto
{"title":"DNA origami for biosensor applications","authors":"Julia Hann, A. Morschhauser, Andreas Heerwig, J. Erben, D. Reuter, Valery Pavlov, M. L. de la Chapelle, M. Mertig, T. Otto","doi":"10.1109/SSI52265.2021.9467014","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9467014","url":null,"abstract":"Novel biosensors are incorporating aspects of nanotechnologies, such as the use of functional nanoparticles, in order to increase performance. For the integration of leading edge sensor principles based on nanoparticles, often the precise arrangement of nanostructures is an essential technology. One approach that has been pursued with great success is the template based DNA origami method [1, 2]. The DNA origami can serve as an individual inter-und intramolecular programmable nano-breadboard with a binding point resolution of ~ 5 nm. Our novel, innovative approach uses the DNA origami template to integrate a biological recognition element (DNA aptamer/antibody) centrically in a nanoparticle array to enable an optical detection by surface-enhanced Raman spectroscopy. For high sensor sensitivity despite complex probes, a sufficient signal accumulation is necessary, done by a selective surface immobilization of the biosensor platform. In this way, a high structure density could be realized without overlapping or agglomeration, which would lead to functional damage of the sensor. We introduce a topography supported thin-film system for the selective surface immobilization of the DNA origami and validate them by a parameter variation of a tablet DNA origami structure, which will be the later template of the biosensor platform.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117156473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrochemically Deposited Aluminum for MEMS Thermal Actuator 用于MEMS热致动器的电化学沉积铝
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9466952
Muhammad Salman Al Farisi, T. Tsukamoto, Shuji Tanaka
{"title":"Electrochemically Deposited Aluminum for MEMS Thermal Actuator","authors":"Muhammad Salman Al Farisi, T. Tsukamoto, Shuji Tanaka","doi":"10.1109/SSI52265.2021.9466952","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9466952","url":null,"abstract":"In this study, a micro electro mechanical system (MEMS) thermal actuator using an electrochemically deposited thick Al is reported for the first time. Due to the fine columnar shape of the grain, the electrical resistivity of the Al film was as high as 100–150 n/m, which is an order of magnitude higher than the bulk value. Such a high resistivity benefits to facilitate the Joule heating during the operation of the thermal actuator. Meanwhile, the coefficient of thermal expansion (CTE) of the electrochemically deposited Al film was experimentally evaluated to be 20–27 ppm/K, which is consistent with the previous reports. With such a large CTE, the material has a potential to enhance the working displacement and force of a thermal actuator. The suspended structure was fabricated using a tetraethyl orthosilicate (TEOS) chemical vapor deposition (CVD) SiO2 as a sacrificial layer. The tip displacement of the fabricated v-shape thermal actuator was around 10 μm at 3 V actuation voltage. The demonstration can open up a new class of MEMS thermal actuator using electroplated Al films as the structural material.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133813599","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel Pin-fin Based Cooling Device for Autonomous Driving High-performance Computers 一种新型的基于引脚鳍的自动驾驶高性能计算机冷却装置
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9467028
S. Nazemi, Antonio Pappaterra, Willem Verleysen, B. Vandevelde, Fabian Neugebauer, Michel Janssens
{"title":"A Novel Pin-fin Based Cooling Device for Autonomous Driving High-performance Computers","authors":"S. Nazemi, Antonio Pappaterra, Willem Verleysen, B. Vandevelde, Fabian Neugebauer, Michel Janssens","doi":"10.1109/SSI52265.2021.9467028","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9467028","url":null,"abstract":"in this study, a novel design for a liquid cooler is presented to control the temperature in high-performance processors. Experiments are performed to show the superior performance of the 3D metal printed cooler compared to existing fan heat sinks. A computational fluid dynamics model is additionally developed and validated in this study by experiments. The model is aimed at providing a low cost and fast platform to optimize the presented cooler design in future in order to reach the lowest chip temperature with as low pressure drop as possible.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125003613","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Soft large area FBG tactile sensors for exteroception and proprioception in a collaborative robotic manipulator 柔性大面积光纤光栅触觉传感器在协作机器人机械臂的外感受和本体感受
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9466957
Federica Durini, Giuseppe Terruso, Jessica D'Abbraccio, M. Filosa, Giulia Fransvea, D. Camboni, A. Aliperta, E. Palermo, Luca Massari, C. Oddo
{"title":"Soft large area FBG tactile sensors for exteroception and proprioception in a collaborative robotic manipulator","authors":"Federica Durini, Giuseppe Terruso, Jessica D'Abbraccio, M. Filosa, Giulia Fransvea, D. Camboni, A. Aliperta, E. Palermo, Luca Massari, C. Oddo","doi":"10.1109/SSI52265.2021.9466957","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9466957","url":null,"abstract":"Interest in tactile sensing technologies is advancing due to the growing adoption of robots in daily life activities. Human-machine interaction has thus to be safe, and collaborative robotics is becoming increasingly important. The present work features the design, development and preliminary validation of a soft large area sensor for tactile and proprioceptive sensing in a collaborative robotic manipulator. Such a manipulator is shaped to resemble the human hand and within this paper we focused on the index finger. The finger architecture has a design which allows setting up a structured 3D model, with flexible parametrization and fast prototyping. An optical fiber embedding 12 Fiber Bragg Gratings (FBGs) has been integrated in a soft polymeric matrix to mimic human sense of touch abilities of a whole finger. In order to assess the sensorized robotic manipulator, a mechatronic validation platform has been developed and employed. Preliminary results show a mechanical decoupling between exteroceptive and proprioceptive functions, and among the spatially distributed outputs of the sensor array. These results demonstrate the potential of the proposed approach towards achieving dexterous and fine capabilities in the manipulation of objects.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121177415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Data-Driven Prediction of the Remaining useful Life of QFN Components Mounted on Printed Circuit Boards 印制电路板上QFN元件剩余使用寿命的数据驱动预测
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9467005
Daniel Riegel, P. Gromala, S. Rzepka
{"title":"Data-Driven Prediction of the Remaining useful Life of QFN Components Mounted on Printed Circuit Boards","authors":"Daniel Riegel, P. Gromala, S. Rzepka","doi":"10.1109/SSI52265.2021.9467005","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9467005","url":null,"abstract":"Prognostics and Health Management (PHM) introduces in-situ monitoring of health parameters to the reliability of electronics. In this paper we adopt a data-driven PHM approach to predict delamination in QFN components. The signal of on-chip stress sensors reacts to thermal and mechanical loads and alters under degradation processes. We track the sensor signal in an accelerated life test, which combines thermal cycling and four-point bending. The obtained run-to-failure data-sets reveal correlation to delamination and furthermore solder joint fatigue.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117039105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Complementary Inverter Circuits on Flexible Substrates 柔性基板上的互补逆变电路
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9466966
Julia Reker, T. Meyers, F. Vidor, T. Joubert, U. Hilleringmann
{"title":"Complementary Inverter Circuits on Flexible Substrates","authors":"Julia Reker, T. Meyers, F. Vidor, T. Joubert, U. Hilleringmann","doi":"10.1109/SSI52265.2021.9466966","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9466966","url":null,"abstract":"Flexible electronics requires the integration of thin-film transistors (TFTs) at much lower temperatures than traditional Si technology. Here we present an integration routine for complementary inverter structures on a flexible polyethylene terephthalate (PET) substrate, which provides a high degree of freedom in the choice of the individual contact metals for the p-and n-type TFTs. It is therefore suitable for organic, inorganic or hybrid semiconductor systems. The developed integration process enables two different metallization layers to be structured into contact electrodes (drain and source) for thin film transistors on a common flexible substrate. This enables the adaptation of the work function of metals and semiconductors, and thus the performance of the individual TFTs can be optimized. The TFTs are integrated in bottom-gate bottom-contact setup.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132552709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Towards a Miniaturized Version of the Hanbury-Brown-Twiss Configuration 迈向汉伯里-布朗-特维斯结构的小型化版本
2021 Smart Systems Integration (SSI) Pub Date : 2021-04-27 DOI: 10.1109/SSI52265.2021.9467025
M. Jahn, Christian Möller, M. Bähr, T. Ortlepp
{"title":"Towards a Miniaturized Version of the Hanbury-Brown-Twiss Configuration","authors":"M. Jahn, Christian Möller, M. Bähr, T. Ortlepp","doi":"10.1109/SSI52265.2021.9467025","DOIUrl":"https://doi.org/10.1109/SSI52265.2021.9467025","url":null,"abstract":"An important step towards the commercialization of quantum technology is the miniaturization of nowadays tabletop setups. The Hanbury Brown-Twiss (HBT) configuration is an important building block in many quantum optics experiments. Within this contribution, we present and compare different concepts for realizing a miniaturized, fiber-coupled HBT configuration, which will be robust and adjustment free. The design process is based on ray tracing simulations, with the aim of finding the best compromise regarding the level of miniaturization and detection efficiency. As an application example, the detection of the luminescence of two different charge states of nitrogen vacancy (NV) centers in diamond is used. For this reason, in contrast to the actual HBT experiment, a dichroic beam splitter is used.","PeriodicalId":382081,"journal":{"name":"2021 Smart Systems Integration (SSI)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127746778","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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