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International Conference on Extreme Ultraviolet Lithography 2022最新文献

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Actinic EUV reflectometry and scatterometry: from national lab to commercial applications 光化EUV反射和散射测量:从国家实验室到商业应用
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2643550
Stuart Sherwin
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引用次数: 0
EUVL characteristics of indium-oxide-infiltrated PMMA hybrid photoresist synthesized by vapor-phase infiltration 气相浸润法制备氧化铟- PMMA杂化光刻胶的EUVL特性
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2643226
Ashwanth Subramanian, Nikhil Tiwale, Wonmoo Lee, K. Kisslinger, Ming Lu, A. Stein, Jiyoung Kim, C. Nam
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引用次数: 0
EUV interference lithography: impact of mask roughness on feature patterning 极紫外干涉光刻:掩膜粗糙度对特征图案的影响
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2641835
T. Allenet, I. Mochi
{"title":"EUV interference lithography: impact of mask roughness on feature patterning","authors":"T. Allenet, I. Mochi","doi":"10.1117/12.2641835","DOIUrl":"https://doi.org/10.1117/12.2641835","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"554 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130482441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-transparency pellicles for high-power EUV lithography 用于大功率EUV光刻的高透明度薄膜
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2641778
M. Lima, T. Ueda, Takeshi Kondo, T. Harada
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引用次数: 0
Full size EUV pellicle development for high power 大功率全尺寸EUV膜的开发
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2641755
Juhee Hong, Hae-Bang Lee, Yesong Kim, Donghoi Kim, Munsu Choi, Seungjo Lee, Byeong Sung Yu, Chul-Hee Park, Min Wook Jung, Chang Hoon Lee, Byoung Hoon Seung, C. Shin
{"title":"Full size EUV pellicle development for high power","authors":"Juhee Hong, Hae-Bang Lee, Yesong Kim, Donghoi Kim, Munsu Choi, Seungjo Lee, Byeong Sung Yu, Chul-Hee Park, Min Wook Jung, Chang Hoon Lee, Byoung Hoon Seung, C. Shin","doi":"10.1117/12.2641755","DOIUrl":"https://doi.org/10.1117/12.2641755","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125830533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Evaluation of LS printing and general understanding of imaging with DF low-n mask LS打印的评价和DF低n掩模成像的一般认识
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2644701
T. Kovalevich, L. van Look, J. Franke, V. Philipsen
{"title":"Evaluation of LS printing and general understanding of imaging with DF low-n mask","authors":"T. Kovalevich, L. van Look, J. Franke, V. Philipsen","doi":"10.1117/12.2644701","DOIUrl":"https://doi.org/10.1117/12.2644701","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116827125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Holistic litho-etch development to address patterning challenges towards high NA EUV 全面的光刻开发，以解决高NA EUV的模式挑战
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2642941
S. Nagahara, Arnaud Dauendorffer, Xiang Liu, T. Onitsuka, H. Genjima, Noriaki Nagamine, Yuhei Kuwahara, Y. Kamei, S. Kawakami, M. Muramatsu, S. Shimura, K. Nafus, N. Oikawa, Y. Feurprier, M. Demand, S. Thibaut, Alexandra Krawicz, Steven Grzeskowiak, Katie Lutker-Lee, E. Liu, C. Catano, J. LaRose, Jeffrery C. Shearer, L. Huli, P. Foubert, D. De Simone
{"title":"Holistic litho-etch development to address patterning challenges towards high NA EUV","authors":"S. Nagahara, Arnaud Dauendorffer, Xiang Liu, T. Onitsuka, H. Genjima, Noriaki Nagamine, Yuhei Kuwahara, Y. Kamei, S. Kawakami, M. Muramatsu, S. Shimura, K. Nafus, N. Oikawa, Y. Feurprier, M. Demand, S. Thibaut, Alexandra Krawicz, Steven Grzeskowiak, Katie Lutker-Lee, E. Liu, C. Catano, J. LaRose, Jeffrery C. Shearer, L. Huli, P. Foubert, D. De Simone","doi":"10.1117/12.2642941","DOIUrl":"https://doi.org/10.1117/12.2642941","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115957041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Berkeley MET5 enters mature phase of research Berkeley MET5进入成熟研究阶段
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2643076
Christopher N. Anderson
{"title":"Berkeley MET5 enters mature phase of research","authors":"Christopher N. Anderson","doi":"10.1117/12.2643076","DOIUrl":"https://doi.org/10.1117/12.2643076","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134644551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-energy electron exposure and reactive ion etching characteristics of hybrid EUV photoresist synthesized by molecular atomic layer deposition 分子原子层沉积合成的杂化EUV光刻胶的低能电子暴露和反应离子刻蚀特性
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2641794
Wonmoo Lee, Ashwanth Subramanian, Nikhil Tiwale, Dan N. Le, S. Hwang, Jiyoung Kim, C. Nam
{"title":"Low-energy electron exposure and reactive ion etching characteristics of hybrid EUV photoresist synthesized by molecular atomic layer deposition","authors":"Wonmoo Lee, Ashwanth Subramanian, Nikhil Tiwale, Dan N. Le, S. Hwang, Jiyoung Kim, C. Nam","doi":"10.1117/12.2641794","DOIUrl":"https://doi.org/10.1117/12.2641794","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130537353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Feasibility of nanometer-thickness molybdenum carbide film for extreme ultraviolet lithography pellicle 极紫外光刻膜用纳米厚度碳化钼薄膜的可行性
International Conference on Extreme Ultraviolet Lithography 2022 Pub Date : 2022-11-11 DOI: 10.1117/12.2643003
Yongkyun Kim, Kihun Seong, Donggi Lee, Seungchan Moon, Hyun-Mi Kim, Hyeongkeun Kim, Seul-Gi Kim, Jinho Ahn
{"title":"Feasibility of nanometer-thickness molybdenum carbide film for extreme ultraviolet lithography pellicle","authors":"Yongkyun Kim, Kihun Seong, Donggi Lee, Seungchan Moon, Hyun-Mi Kim, Hyeongkeun Kim, Seul-Gi Kim, Jinho Ahn","doi":"10.1117/12.2643003","DOIUrl":"https://doi.org/10.1117/12.2643003","url":null,"abstract":"","PeriodicalId":374992,"journal":{"name":"International Conference on Extreme Ultraviolet Lithography 2022","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130923343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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