Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts最新文献

The study of the simulation control and test system for relay contacts operation with microcomputer 基于微机的继电器触点动作仿真控制与测试系统的研究

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170810

H. Fang, J. Jiang

引用次数: 1

Copper-graphite brushes lined with porous metals 内衬多孔金属的铜石墨刷

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170816

K. Okada, M. Yoshida

引用次数: 2

Fretting behavior of gold flashed palladium, palladium nickel and palladium silver contact materials 金闪钯、钯镍和钯银接触材料的微动行为

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170826

P. Lees, D.W.M. Williams

{"title":"Fretting behavior of gold flashed palladium, palladium nickel and palladium silver contact materials","authors":"P. Lees, D.W.M. Williams","doi":"10.1109/HOLM.1991.170826","DOIUrl":"https://doi.org/10.1109/HOLM.1991.170826","url":null,"abstract":"Palladium and palladium-alloy contact materials manufactured by both electroplating and skive inlay cladding technologies were evaluated for adhesive and abrasive wear behavior. The contact materials were coated with 0.1- mu m-thick hard gold electroplate and tested again to determine the effect of the coating on wear behavior. Selected contact finishes with the gold flash were subjected to fretting conditions in the presence of organic vapors to determine susceptibility to frictional polymer formation. It was found that, in general, palladium and palladium-alloy 'flats' cause rider wear, and the durability of wrought Pd-Ag was significantly improved by alloying with small amounts of Ni. The gold flash altered the wear behavior of plated Pd-Ni and clad Pd-Ag but not plated Pd-Ag and clad Pd-Ag-Ni. Type-I frictional polymers were produced on the gold flashed Pd-Ag electroplates and gold flashed Pd-Ag-Ni inlays but not on the gold flashed Pd-Ni electroplates. It was determined that the wear mechanism and therefore the resultant contact surface materials controlled the formation of frictional polymer. The increase in contact resistance at end of test was attributed to rider wear and the exposure of the nickel underplate.<<ETX>>","PeriodicalId":368900,"journal":{"name":"Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129138019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Description and test results of a current collection system for continuous duty HPG 一种连续工作高压pg电流采集系统的描述和测试结果

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170815

A. Challita, B. K. Ahrens, D. Bauer

{"title":"Description and test results of a current collection system for continuous duty HPG","authors":"A. Challita, B. K. Ahrens, D. Bauer","doi":"10.1109/HOLM.1991.170815","DOIUrl":"https://doi.org/10.1109/HOLM.1991.170815","url":null,"abstract":"A current collection system which includes a cooling system capable of operating at high velocities and current densities is needed before a continuous-duty compact HPG (homopolar generator) can be designed and built. The authors developed a current collection system that is capable of continuous operation at current densities of 40 MA/m/sup 2/ and a tip speed of 250 m/s. The current collection system is an integrated current collection/actuation/cooling system. The current collectors are solid copper leaves, 0.33 mm thick, that are mounted on a circular holder. The actuation system is a piston that actuates the collectors onto the slipring axially. Thin film evaporation cooling, at the interface between the collector and slipring, is used to remove the heat generated. Thin coolant films are wiped on the slipring. A slipring current density of 13 MA/m/sup 2/ at 175 m/s for 20 s was demonstrated. The system reaches steady state operation in 4 s. A heat removal capability of 15 MW/m/sup 2/ with the thin film evaporation technique was demonstrated. The contact resistance density was about 20n Omega -m/sup 2/.<<ETX>>","PeriodicalId":368900,"journal":{"name":"Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114238965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Surface accumulation rate of diffusing species on thin gold electroplates 薄金电镀板上扩散物质的表面积累速率

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/33.180053

L. Revay

引用次数: 2

Vickers microhardness evaluation of multilayer platings for electrical contacts 电触点用多层镀层的维氏显微硬度评定

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170805

P. Engel

引用次数: 7

Enhanced sulfur segregation in plastically deformed OFHC Cu and the effect of surface segregated sulfur on electric contact resistance 塑性变形OFHC Cu中硫偏析增强及表面偏析硫对接触电阻的影响

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/95.296377

R. Kothari, R. Vook

引用次数: 5

Comparison of sulfide films formed on copper by surface segregation and wet H2S exposure 表面偏析与湿式H2S暴露在铜表面形成硫化物膜的比较

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170828

J.G. Zhang, D. Zhai, M.D. Zhu, L. Chen, R. Vook, R. Kothari

{"title":"Comparison of sulfide films formed on copper by surface segregation and wet H2S exposure","authors":"J.G. Zhang, D. Zhai, M.D. Zhu, L. Chen, R. Vook, R. Kothari","doi":"10.1109/HOLM.1991.170828","DOIUrl":"https://doi.org/10.1109/HOLM.1991.170828","url":null,"abstract":"It is shown that the sulfide films formed in a technical vacuum on copper are composed mainly of Cu/sub 2/O and Cu/sub 2/S, and have a composition slightly different from films formed by an H/sub 2/S exposure. AES (Auger electron spectroscopy) depth profiles and ESCA (electron spectroscopy for chemical analysis) experiments showed that surface segregated sulfide films formed in ultrahigh vacuum as well as those formed in a technical vacuum disappeared on air exposure of approximately 5 to 7 days. At the same time the characteristic oxygen photoemission lines from Cu/sub 2/O and CuO increased significantly. It is concluded that the sulfur was entirely replaced by oxygen and that the resulting free sulfur, which has a high vapor pressure at room temperature, simply evaporated. A similar tendency was observed for the sulfide film formed on wet H/sub 2/S exposure (1.5-2 p.p.m.) after a 7 day air exposure. An AES depth profile showed that part of the sulfide film was buried by oxide and part of it vanished. The polarity effect on thick films formed by wet H/sub 2/S was significant; it decreased with decreasing film thickness. A polarity effect was also found on a sulfur segregated surface formed in technical vacuum; however, it degraded rapidly with time.<<ETX>>","PeriodicalId":368900,"journal":{"name":"Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121313386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Glowing contact areas in loose copper wire connections 在松动的铜线连接的发光接触区域

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170830

I. Sletbak, R. Kristensen, H. Sundklakk, G. Nåvik, M. Runde

{"title":"Glowing contact areas in loose copper wire connections","authors":"I. Sletbak, R. Kristensen, H. Sundklakk, G. Nåvik, M. Runde","doi":"10.1109/HOLM.1991.170830","DOIUrl":"https://doi.org/10.1109/HOLM.1991.170830","url":null,"abstract":"Laboratory experiments have shown that, when a current-carrying, loose copper wire connection is exposed to mechanical vibrations, a layer of Cu/sub 2/O grows to form a bridge between the contact members, bonding them to one another. Due to the strongly negative temperature coefficient of Cu/sub 2/O at high temperatures, the current is concentrated in a thin, glowing filament at or near the surface of the oxide bridge. The maximum temperature of this filament was found to be 1200-1300 degrees C. Under the action of this hot filament a rapid oxidation of the copper continues until, in the end, most of the circumference of the copper wires has been converted to Cu/sub 2/O to a depth of a few tenths of a mm. As the corrosion proceeds the power dissipation increases to values which can cause fire hazards if a similar situation occurs in electrical apparatus or installations. According to statistics, loose connections or broken wires are known to be the cause of many fires. The phenomenon described explains how a temperature high enough to initiate a fire can arise even when the current through the connection is limited by the load impedance to values of less than 1 ampere.<<ETX>>","PeriodicalId":368900,"journal":{"name":"Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131131541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 38

Electrical contact phenomena during impact 冲击时的电接触现象

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI: 10.1109/HOLM.1991.170814

J. McBride, S. Sharkh

引用次数: 37