薄金电镀板上扩散物质的表面积累速率

Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts Pub Date : 1900-01-01 DOI:10.1109/33.180053

L. Revay

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引用次数: 2

摘要

对共硬化金电镀板表面的沉积物质进行了分析。样品在85、125和150摄氏度的普通地下室空气环境中陈化1至12个月。不同的金涂层厚度:0.3和1.0 μ m在磷青铜基片上，有或没有5 μ m的镍基片。采用接触电阻探针法测定了表面膜的积累速率。利用俄歇电子能谱对表面物质进行了表征。所记录的接触电阻(CR)值与抛物线生长动力学一致，并已用于根据CR增加到20、50和100 m ω水平的失效标准推断估计的寿命。

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Surface accumulation rate of diffusing species on thin gold electroplates

An analysis of the accumulated species on the surface of Co-hardened gold electroplates has been carried out. The samples were aged in a common basement air environment at 85, 125, and 150 degrees C for periods of 1 to 12 months. Different gold coating thicknesses were used: 0.3 and 1.0 mu m on phosphor bronze substrate with or without 5 mu m nickel underplates. The accumulation rates of surface films were evaluated using contact resistance probing. Auger electron spectroscopy was employed to characterize the surface species. The values of contact resistance (CR) recorded are consistent with parabolic growth kinetics and have been utilized to extrapolate estimated lifetimes based on the failure criteria of increases in CR to 20, 50, and 100 m Omega levels.<>

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Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts

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