2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)最新文献_第10页

Electromagnetic pickups by long heliax cables in lightning environments 雷电环境中长螺旋电缆的电磁拾音器

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236608

J. C. Chai, E. Dressel, A. Britting, J.L. Montegut

引用次数: 0

The current element is not a Hertzian dipole 当前元素不是赫兹偶极子

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236579

W. Bennett

引用次数: 3

Evaluation of longitudinal conversion loss (LCL) for indoor AC mains line 室内交流干线纵向转换损耗的评价

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236705

A.K.M. Mahbub Ar Rashid, N. Kuwabara, M. Maki, Y. Akiyama, H. Yamane

引用次数: 12

Equivalent circuit models for the analysis of coaxial cables immunity 同轴电缆抗扰度分析的等效电路模型

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236725

S. Caniggia, F. Maradei

引用次数: 26

SAR testing and approval requirement for Australia 澳大利亚的SAR测试和批准要求

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236605

C. Zombolas

引用次数: 1

Selection of cables and connectors for 100BaseTX Ethernet for defense/aerospace environment EMI compliance 为100BaseTX以太网选择电缆和连接器，以满足国防/航空航天环境的EMI要求

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236648

J. G. Kraemer

引用次数: 2

Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB 多层PCB中通孔信号经电源/地谐振耦合及边缘辐射激励

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236597

J. Pak, Jingook Kim, Jung-gun Byun, Heejae Lee, Joungho Kim

{"title":"Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB","authors":"J. Pak, Jingook Kim, Jung-gun Byun, Heejae Lee, Joungho Kim","doi":"10.1109/ISEMC.2003.1236597","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236597","url":null,"abstract":"This paper describes the edge radiation of signal power at multi-layer PCB mostly depends on coupling of through-hole signal via to power/ground plane, and the coupling mechanism is the loading effects of power/ground plane impedance on signal return current. It is well known that the variation of power/ground impedance comes from power/ground resonance, and the variation range is up to several tens ohm (/spl Omega/). In 50/spl Omega/ system, this range impedance makes signal input matching worse. Moreover, the transmitted signal is divided into two parts, load and power/ground plane. Finally, the assimilated signal power by power/ground plane is emitted from PCB open edge, which is a good radiation structure. Above analysis is shown in this paper by Spice modeling of through-hole signal via and power/ground plane and measuring the near field strength at PCB edge with/without through-hole signal via cases. The loading effects are seen in S-parameters and input impedance of signal traces and PCB edge radiation in |S21| between signal trace and near field probe. The trace with through-hole signal via case has the larger radiated emission at PCB edge than without case by more than 20dB.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129642653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Potential damage to flight hardware from MIL-STD-462 CS02 setup MIL-STD-462 CS02设置对飞行硬件的潜在损害

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236671

Patrick K. Harris, Nce, Nathan F. Block

引用次数: 4

Characterization of the cumulative effects of ultrawideband technology on the electromagnetic environment 超宽带技术对电磁环境累积效应的表征

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236601

Q. Zeng, A. Chubukjian

引用次数: 1

Methods to reduce radiated emissions from optical transceivers 减少光收发器辐射发射的方法

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) Pub Date : 2003-10-14 DOI: 10.1109/ISEMC.2003.1236629

D. Moongilan

{"title":"Methods to reduce radiated emissions from optical transceivers","authors":"D. Moongilan","doi":"10.1109/ISEMC.2003.1236629","DOIUrl":"https://doi.org/10.1109/ISEMC.2003.1236629","url":null,"abstract":"Telecommunication network equipment extensively uses optical transceivers to convert electrical signals into lightwave and vice-versa. The aperture (ferrule) of the transceiver where fiber will be attached cannot be completely RF shielded to prevent radiation in the frequency range of 8 to 40 GHz. Most telecommunication equipment is designed to operate in a frame without doors or covers and therefore, radiation must be stopped at circuit pack level in order to meet the regulatory and customer imposed radiated emission requirements. The radiation levels from optical transceivers increase with data-rate, transmit optical power-level, and fiber impedance. Transceivers of different manufacturers may be used in optical network platforms to increase the data throughput and rate. The radiated emissions emanating from transceivers are found to be different depending on their type and manufacturer. This paper discusses downward angular installation methods to reduce radiated emission levels from transceivers so that equipment has extra margin to compensate for increased radiated emission levels from certain transceivers. A theoretical calculation of transceiver placement angle to lower radiated emissions is presented. Also presented and results discussed is experimental data for different downward angular placement for a simulated transceiver and for transceivers installed in network equipment.","PeriodicalId":359422,"journal":{"name":"2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128967271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0