{"title":"Internal feedback bridging faults in combinational CMOS circuits: analysis and testing","authors":"Y. Miura, S. Seno","doi":"10.1109/ETW.2001.946655","DOIUrl":"https://doi.org/10.1109/ETW.2001.946655","url":null,"abstract":"We analyze fault behaviors of intemal feedback bridging faults by using a simple circuit model consisting of 2-input NAND gate and NOT gate. From analysis results we find that they are more complex than those associated with extemal feedback bridging faults. We expose that they cause intemal oscillation and IDDQ-only failure as well as latch and oscillation behavior. We also discuss methods for detecting this kind of fault.","PeriodicalId":339694,"journal":{"name":"IEEE European Test Workshop, 2001.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129386821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A packet switching communication-based test access mechanism for system chips","authors":"M. Nahvi, A. Ivanov","doi":"10.1109/ETW.2001.946668","DOIUrl":"https://doi.org/10.1109/ETW.2001.946668","url":null,"abstract":"In this paper, a Test Access Mechanism (TAM) architecture based on a packet switching communication network is presented. The basic goal is to develop a modular, generic, and configurable TAM.The proposed architecture provides a modular TAM that provides two levels of scalability, i.e., design-version scalability and multi-level scalability. Core access time and interconnect length models and simulation results for the proposed architecture are presented and compared to that of a bus- based TAM.","PeriodicalId":339694,"journal":{"name":"IEEE European Test Workshop, 2001.","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125120517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Oliver Niese, T. Margaria, A. Hagerer, B. Steffen, Georg Brune, Werner Goerigk, H. Ide
{"title":"Automated regression testing of CTI-systems","authors":"Oliver Niese, T. Margaria, A. Hagerer, B. Steffen, Georg Brune, Werner Goerigk, H. Ide","doi":"10.1109/ETW.2001.946662","DOIUrl":"https://doi.org/10.1109/ETW.2001.946662","url":null,"abstract":"In this paper we present an integrated testing environment for the automated regression test of Computer Telephony Integrated applications.Its novelty consists of a coordinative test management layer that instantiates a general-purpose environment for the specification and verification of workflows in the testing domain.This results in a test environment that controls not only the individual test tools,but also the whole life-cycle of functional system- level tests, comprising test design, test generation, test execution, test evaluation and test reporting.Special attention is devoted to the simplification of the test case design and the checking f admissibility criteria, of interdependencies between the actions of test cases, and of assumptions about the state of the system's resources.We discuss the key features of our testing environment along a concrete industrial application, which illustrates in particular the coarse grain, workflow-like test case representation and the validation and formal verification capabilities. Field results document an efficiency improvement of factors during the test execution phase.","PeriodicalId":339694,"journal":{"name":"IEEE European Test Workshop, 2001.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126060173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Analyzing bridging faults impact on EEPROM cell array","authors":"J. Portal, A. Pérez","doi":"10.1109/ETW.2001.946653","DOIUrl":"https://doi.org/10.1109/ETW.2001.946653","url":null,"abstract":"The objective of this paper is to present a specific EEPROM functional fault model related to the impact of bridging faults in the array of cells. Moreover, the evolution of these functional faults throughout the useful life of the memory is established. In this aim, a hierarchical overview from the array structure down to the floating gate transistor simulation model is given. A set of bridging faults is defined with their corresponding stimuli. Finally, a representative simulation example is detailed.","PeriodicalId":339694,"journal":{"name":"IEEE European Test Workshop, 2001.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115236174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"System-level DFT for consumer products","authors":"D.C.L. van Geest, Febe de Jong","doi":"10.1109/ETW.2001.946656","DOIUrl":"https://doi.org/10.1109/ETW.2001.946656","url":null,"abstract":"Consumer products like TV, VCR and CD have long been tested with raditional test methods like bed-of-nails and functional testing.The last couple of years this has been extended with JTAG Boundary Scan (IEEE Std 1149.1) because of the growing digital design content. However, Boundary Scan does not cover all pins and therefore will be insufficient in the very near future. An overview will be given of new test solutions that are being developed to deal with this trend.The main strategy is to build test solutions into silicon (DfT). This way, costs scale down with every silicon generation, making it cost-effective in the competitive market of consumer products. At the same time, test access can be kept standard and simple. The test solutions that will be discussed are: testing power & ground connections; testing analogue connections; testing connections to complex memories like DDR SDRAM; testing connections to Flash memories. This set of DfT solutions will significantly increase the test coverage of consumer products without relying on (long) functional tests or expensive test equipment.","PeriodicalId":339694,"journal":{"name":"IEEE European Test Workshop, 2001.","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127707436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}