2013 Eurpoean Microelectronics Packaging Conference (EMPC)最新文献

Multi beam low-k grooving evaluation of various removal principals 不同去除原理的多束低k开槽评价

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2014-01-06 DOI: 10.4071/ISOM-2013-WA53

Richard van der Stam, Jeroen van Borkulo, P. Dijkstra

引用次数: 3

Cleaning in electronics: Understanding today's needs 电子清洁:了解当今的需求

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2013-09-01 DOI: 10.4071/isom-Poster1

P. Duchi, Anne-Marie Laügt, Marie Verdier

{"title":"Cleaning in electronics: Understanding today's needs","authors":"P. Duchi, Anne-Marie Laügt, Marie Verdier","doi":"10.4071/isom-Poster1","DOIUrl":"https://doi.org/10.4071/isom-Poster1","url":null,"abstract":"Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, low residue No-Clean, and very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices. Traditional chemicals like CFC's, HCFC's, brominated solvents, detergents and glycols cannot do a good cleaning job anymore because most flux formulations have changed. Also, assembly processes have been modified due to smaller components and more compact board assemblies. The world is composed of two main things: organics and inorganics. Organics are made of resins and activators, whereas inorganics are made of salts, metallic salts and fillers. Cleaning performance is affected by three main criteria. The first involves the Hansen Parameters which is a characterization of a contaminant to be dissolved and can be simplified by the solvency power of a product also known as the Kauri Butanol Index (KB Index). The second is surface tension, expressed in mN/m. This parameter must be considered because when the cleaning product cannot make contact with the contaminants under or around components, the contaminants cannot be dissolved. The third criteria are the physical parameters like temperature, mechanical activities, and the process cyle. The mastery to manage all of these parameters while facing high-tech miniaturization and environmental regulations, like ROHS, REACH, etc. brings innovation to cleaning in this electronic world.","PeriodicalId":338701,"journal":{"name":"2013 Eurpoean Microelectronics Packaging Conference (EMPC)","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122630695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Highly flexible die attach adhesives for MEMS packages 用于MEMS封装的高柔性模贴胶

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2013-09-01 DOI: 10.4071/ISOM-2012-THP51

Tobias Koniger

{"title":"Highly flexible die attach adhesives for MEMS packages","authors":"Tobias Koniger","doi":"10.4071/ISOM-2012-THP51","DOIUrl":"https://doi.org/10.4071/ISOM-2012-THP51","url":null,"abstract":"Key requirements on die attach materials for most MEMS packages include high flexibility. The reason for this is that temperature changes during the assembly process and application may lead to thermo-mechanical stress as a consequence of thermal mismatch (dissimilar coefficients of thermal expansion of substrate, chip and adhesive). Distortion of the signal characteristics of the extremely stress-sensitive MEMS device is the consequence of this thermo-mechanical stress. The newly developed adhesives provide an outstanding combination of high flexibility and high die shear strength, giving them a competitive edge over the currently used MEMS die attach adhesives. This paper describes highly flexible heat-curing adhesives on the basis of acrylates and the patented mCD chemistry with a Young's modulus down to 5 MPa at room temperature. DMTA measurements show that temperature storage at +120 °C does not cause adhesive embrittlement, which would have a negative effect on the MEMS package's reliability. The curing temperatures of these adhesives are extremely low down to +100 °C, which reduces stress development during the assembly process. In addition, the adhesives have very process-friendly properties with processing times of one week. The option of dual curing enables preliminary light fixation of the chip within just seconds.","PeriodicalId":338701,"journal":{"name":"2013 Eurpoean Microelectronics Packaging Conference (EMPC)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121581043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Direct integration of Carbon Nanotubes in Si microsystems — Towards truly integrated micro/nano systems 碳纳米管在硅微系统中的直接集成——迈向真正集成的微/纳米系统

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2013-09-01 DOI: 10.1007/978-3-319-21194-7_4

K. Aasmundtveit, B. Q. Ta, Quoc Nguyen, Tormod B. Haugen, N. Hoivik, E. Halvorsen

引用次数: 2

Joint strength of Cu-to-Cu joint using mixed Ag particle paste 混合银颗粒膏对cu - cu接头强度的影响

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2013-09-01 DOI: 10.2207/QJJWS.33.75S

H. Nishikawa, K. Niwa

引用次数: 1

Non-destructive fault localization in advanced IC packages using electro optical terahertz pulse reflectometry 利用电光太赫兹脉冲反射计在先进IC封装中进行无损故障定位

2013 Eurpoean Microelectronics Packaging Conference (EMPC) Pub Date : 2013-09-01 DOI: 10.31399/asm.cp.istfa2019p0009

J. Alton, M. Igarashi

{"title":"Non-destructive fault localization in advanced IC packages using electro optical terahertz pulse reflectometry","authors":"J. Alton, M. Igarashi","doi":"10.31399/asm.cp.istfa2019p0009","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2019p0009","url":null,"abstract":"Traditional, all electronic, microwave time domain reflectometry (TDR) is a well established fault isolation technique within the semiconductor industry and can typically localize an open or short fault to within 500μm of the defect. This level of fault localization is not sufficient in advanced IC packages due to the increased complexity and the reduction in physical package size, hence, the ability to isolate the exact fault location is essential to shorten the failure analysis cycle time. Electro optical terahertz pulse reflectometry (EOTPR) is a novel and innovative technique which offers the ability to quickly and non-destructively isolate faults in advanced IC packages to an accuracy of 20μm or better. The EOTPR system uses photoconductive terahertz pulse generation and detection technology, resulting in a system with: (i) high measurement bandwidth, (ii) extremely low time base jitter, and (iii) high time base resolution and range with greater sensitivity. Here, an EOTPR system is used to non-destructively isolate faults in a series of state-of-the-art IC packages. We present results which demonstrate the superior accuracy and sensitivity of EOTPR compared to traditional TDR.","PeriodicalId":338701,"journal":{"name":"2013 Eurpoean Microelectronics Packaging Conference (EMPC)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128016759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5