Joint strength of Cu-to-Cu joint using mixed Ag particle paste

Abstract

The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, mixed Ag particle pastes were experimentally applied and the effect of the addition of Ag nanoparticles into micro-sized Ag particles on the joint strength has been studied to improve joint strength using Ag particle paste. Then, the effect of joining atmosphere on the joint strength of Cu-to-Cu joint using mixed Ag particle paste has been investigated.