{"title":"混合银颗粒膏对cu - cu接头强度的影响","authors":"H. Nishikawa, K. Niwa","doi":"10.2207/QJJWS.33.75S","DOIUrl":null,"url":null,"abstract":"The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, mixed Ag particle pastes were experimentally applied and the effect of the addition of Ag nanoparticles into micro-sized Ag particles on the joint strength has been studied to improve joint strength using Ag particle paste. Then, the effect of joining atmosphere on the joint strength of Cu-to-Cu joint using mixed Ag particle paste has been investigated.","PeriodicalId":338701,"journal":{"name":"2013 Eurpoean Microelectronics Packaging Conference (EMPC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Joint strength of Cu-to-Cu joint using mixed Ag particle paste\",\"authors\":\"H. Nishikawa, K. Niwa\",\"doi\":\"10.2207/QJJWS.33.75S\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, mixed Ag particle pastes were experimentally applied and the effect of the addition of Ag nanoparticles into micro-sized Ag particles on the joint strength has been studied to improve joint strength using Ag particle paste. Then, the effect of joining atmosphere on the joint strength of Cu-to-Cu joint using mixed Ag particle paste has been investigated.\",\"PeriodicalId\":338701,\"journal\":{\"name\":\"2013 Eurpoean Microelectronics Packaging Conference (EMPC)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 Eurpoean Microelectronics Packaging Conference (EMPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2207/QJJWS.33.75S\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Eurpoean Microelectronics Packaging Conference (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2207/QJJWS.33.75S","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Joint strength of Cu-to-Cu joint using mixed Ag particle paste
The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, mixed Ag particle pastes were experimentally applied and the effect of the addition of Ag nanoparticles into micro-sized Ag particles on the joint strength has been studied to improve joint strength using Ag particle paste. Then, the effect of joining atmosphere on the joint strength of Cu-to-Cu joint using mixed Ag particle paste has been investigated.