Optical Measurement Systems for Industrial Inspection XI最新文献

{"title":"Approaches for a destructive measurement method of subsurface damages (Conference Presentation)","authors":"M. Seiler","doi":"10.1117/12.2537877","DOIUrl":"https://doi.org/10.1117/12.2537877","url":null,"abstract":"","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133451968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Deflectometry (Conference Presentation)","authors":"J. Burke","doi":"10.1117/12.2531869","DOIUrl":"https://doi.org/10.1117/12.2531869","url":null,"abstract":"","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116381183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of non-uniformity of classically polished fused silica surfaces via laser-induced breakdown spectroscopy (Conference Presentation)","authors":"C. Gerhard","doi":"10.1117/12.2537878","DOIUrl":"https://doi.org/10.1117/12.2537878","url":null,"abstract":"In this contribution, the surface uniformity of classically-manufactured fused silica windows was investigated via laser-induced breakdown spectroscopy. It is shown that for all investigated samples a comparatively high aluminium content was found at the edge of the surface with respect to its centre. This contamination can be attributed to residues from lapping and polishing agents and leads to a mentionable non-uniformity of the surface in terms of chemical composition and optical properties, respectively.","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114345740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Advanced methods for optical nanometrology (Conference Presentation)","authors":"B. Bodermann","doi":"10.1117/12.2531868","DOIUrl":"https://doi.org/10.1117/12.2531868","url":null,"abstract":"","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"153 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127160038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Front Matter: Volume 11056","authors":"","doi":"10.1117/12.2539839","DOIUrl":"https://doi.org/10.1117/12.2539839","url":null,"abstract":"","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127021313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Roundness measurement by employing laser Doppler distance sensor and error separation techniques (Conference Presentation)","authors":"Shi Shengyu, Haoyang Zhang, J. Qu, G. Jin, R. Kuschmierz, J. Czarske","doi":"10.1117/12.2524969","DOIUrl":"https://doi.org/10.1117/12.2524969","url":null,"abstract":"Between 50 to 60% of tasks in manufacturing metrology are measurements of cylindrical parts. The tasks are accomplished by roundness testers, which feature high-precision displacement sensors and rotary tables. This paper describes a high-precision method for evaluating roundness and diameter of the cylindrical parts, where a novel laser Doppler sensor and error separation techniques are employed.\u0000Nowadays, the most commonly employed sensors in the roundness testers are still contact stylus, which might damage the machined surface. Non-contact capacitive sensors offer sub-nanometer accuracy, but suffer from low lateral resolution. Therefore, we employ a multi-functional optical sensor, the laser Doppler distance sensor with phase evaluation (P-LDD sensor), for the roundness measurement. The P-LDD sensor offers a high lateral resolution, low uncertainty, and also, can determine the diameter simultaneously.\u0000Apart from the distance sensor, the rotary table also plays a critical role in the roundness measurement. Its error motion, always leads to systematic deviations. Error separation technique (EST) can separate the spindle error motion from the roundness, thus, cancelling the systematic deviation. Regarding this technique, substantial research effort has been paid, especially into the harmonic suppression problem, which has long been regarded as the dominant factor affecting the measurement accuracy. Nevertheless, even today the ESTs are only sparsely represented in industry and still under research and development. We suspect that a shift of the research focus from the harmonic suppression problem to the measurement uncertainty propagation will yield the foundation for an eventual solution to the measurement accuracy problem, and thus, bring a new paradigm for the EST. Therefore, by means of the stochastic spectral method, we analytically derive the propagation law of the measurement uncertainty within the two-step error separation method (TSM), which is subsequently validated by Monte Carlo simulation. Based on the propagation law, three improved TSMs are further put forward for reducing the uncertainty propagation: the angle-optimized TSM, the hybrid TSM, and the fusion TSM. In the angle-optimized TSM, the angle is optimized to minimize the measurement uncertainty. In the hybrid and the fusion TSMs, two measurements are performed first under different angles; then, the two obtained estimations are hybridized or fused in the harmonic domain, which decreases the measurement uncertainty significantly. Finally, by using the P-LDD sensor and the improved TSMs, test measurements are performed and the results are discussed.","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117202556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Digital holography for quantification of semiconductor structures (Conference Presentation)","authors":"V. Trivedi, N. Patel, M. Joglekar, V. Chhaniwal, Seonoh Lee, A. Anand","doi":"10.1117/12.2525684","DOIUrl":"https://doi.org/10.1117/12.2525684","url":null,"abstract":"Digital holography interferometry (DHI) and digital holographic interference microscopy (DHIM) are tools that provide whole field information of the wavefront interacting with the object. This imaging modality can be an ideal tool for quantitative phase imaging of technical objects such as semiconductor samples. The phase information numerically reconstructed from the holograms can lead to extraction of the thickness/height of the sample. Usually DHI and DHIM are used in transmission mode for determination of optical thickness of the sample under investigation. In reflection mode this imaging techniques provide height of the sample. \u0000For the semiconductor industry determination of height/thickness of object structures as well as the quantification of defects in the object structures is an important issue. The thickness and defect determination can be that of semiconductor thin films, micro/nano-pillars, LED displays, liquid crystal panels, the cover glasses used for protection of these structures etc. Digital holographic interferometric method (both reflection and transmission) can be used to design devices that can act as a fast, single shot technique for quantitative phase imaging of such samples. Such devices can provide more information about the sample compared to intensity based measurement systems. Also compact the digital holographic interferometric systems can be deployed in the manufacturing line of such devices to provide real time information. \u0000We are involved in the design and development of digital holographic devices for inspection of semi-conductor wafers, thin films, displays and glass plates covering such samples. We have implemented digital holographic devices in the lens-less mode (in the case of DHI) and also with the use of an imaging lens (in the case of DHIM) both in reflection and transmission mode. DHI provides field of view equivalent to the sensor size, while DHIM technique was implemented with different magnifications, thereby providing varying field of views of the sample. Also in the case of DHI a propagation from the hologram plane (the plane at which the digital array for recording the hologram was situated) to the best focus plane (object plane) was realized by numerical implementation of diffraction integral. In DHIM, the digital array used for recording the hologram was at the image plane of the magnifying/de-magnifying lens. So the whole numerical reconstruction process reduced to Fourier fringe analysis, making the technique less computationally exhaustive, fast and quasi real-time. The developed devices were calibrated using known objects and then tested on different samples. The obtained results are found to be encouraging. In this paper, we describe our efforts in design, development and fabrication of digital holographic devices for the inspection of semiconductor samples.","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121887502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Compact dual-wavelength digital holography using VCSEL technology (Conference Presentation)","authors":"D. Claus, I. Alekseenko, R. Hibst","doi":"10.1117/12.2526290","DOIUrl":"https://doi.org/10.1117/12.2526290","url":null,"abstract":"The high-speed topography of both specular reflective and diffuse reflective surfaces with one single instrument represents a major challenge in optical metrology. Surface metrology techniques exist, which can cope with both types of surfaces, such as white light interference microscopy (WLI) and confocal microscopy (CM). However, the measurement is very time-consuming ranging from multiple seconds to minutes depending on the field of view and resolution. This is due to the fact, that WLI and CM are highly informative, revealing all surface parameters such as roughness, waviness, and shape. Structured illumination, on the other hand, recovers the shape only, but is restricted to the inspection of rough scattering surfaces. Moreover, a projection device, often implemented via a spatial light modulator, and a certain angle between projection and observation direction are necessary to enable the application of triangulation. In that manner, it is not only limited by the type of surface but also is quite bulky and heavy.\u0000\u0000Dual wavelength holography can overcome the aforementioned shortcomings. It can be applied on rough scattering and specular reflective surfaces. In addition, the measurement range and the axial resolution can be adjusted via the choice of the dual wavelength pairs. Moreover, a flexible and light weight setup can be enabled, without the necessity to employ imaging lenses due to the recovery of complex information (amplitude and phase) and numerically refocusing the recorded wavefield to the object plane. \u0000In the last years, Vertical Cavity Surface Emitting Lasers (VCSEL) have attained more and more attraction. Commonly they are used in the form of multimode VCSEL arrays and have for instance been applied for face recognition in smartphones. However, single mode VCSELs do likewise exist. They offer excellent coherent properties, with a coherence length of a few tens of cm, an isotropic angular radiation profile and dimensions < mm, allowing a very compact and lightweight setup arrangement. Moreover, the wavelength can be tuned within a few nm via changing the current applied to the VCSEL or the temperature, which makes them extremely attractive for dual wavelength optical metrology. The only downside of single mode VCSEL is the limited power of not more than a few mW, which restricts the investigated field of view to a few mms. \u0000In this paper, we describe the application of VCSEL for the dual wavelength digital holography. The surfaces investigated range from diffuse scattering to specular reflective. At first, the spectral response of the VCSEL is determined in a calibration process. A wavemeter with sub-Angstrom spectral resolution has been employed to investigated stability and repeatability of the wavelength. For the sake of a compact and lightweight setup and in order to take advantage of the little power of the VCSEL, an off-axis arrangement has been chosen. The shape measurements are taking on referenced surfaces. The measureme","PeriodicalId":334783,"journal":{"name":"Optical Measurement Systems for Industrial Inspection XI","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124179391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}