2011 International Conference on Devices and Communications (ICDeCom)最新文献_第4页

A Survey on Selective Forwarding Attack in Wireless Sensor Networks 无线传感器网络中选择性转发攻击研究进展

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738547

Leela Krishna Bysani, A. K. Turuk

引用次数: 90

Performance Measures of Mobile Communication in a Hierarchical Cellular System 分层蜂窝系统中移动通信的性能度量

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738560

Kashish Parwani, G. Purohit

引用次数: 6

A High Gain Low Noise Amplifier for 0.9-6 GHz Wireless Applications 一种用于0.9-6 GHz无线应用的高增益低噪声放大器

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738525

A. Baishya, P. Sahu, M. K. Naskar

引用次数: 0

M-Shaped Dielectric Resonator Antenna for WLAN Applications 用于WLAN应用的m形介质谐振器天线

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738502

K. Parmar, R. Kumari, S. Behera

引用次数: 8

Investigation on Cavity Based Bandpass Filter Using 2D Photonic Crystal 基于二维光子晶体的腔型带通滤波器研究

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738514

S. Robinson, R. Nakkeeran

引用次数: 8

Effects of Capacitive and Inductive Coupling on Interconnects at RF Frequencies 电容耦合和电感耦合对射频互连的影响

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738504

Harpreet Parashar, G. Singh

{"title":"Effects of Capacitive and Inductive Coupling on Interconnects at RF Frequencies","authors":"Harpreet Parashar, G. Singh","doi":"10.1109/ICDECOM.2011.5738504","DOIUrl":"https://doi.org/10.1109/ICDECOM.2011.5738504","url":null,"abstract":"In this paper, we have investigated a circuit model of the on-wafer interconnects for high-speed CMOS integrated circuits (ICs). Along with increasing the operating frequency, there are various factors like chip size, circuit density, complexity, cost and delay which make interconnects an important issue that has to be considered while designing ICs. At GHz frequencies, long interconnect wires exhibit transmission line behaviour and also traditional lumped and distributed RC models of interconnects are no longer accurate and result in substantial errors in predicting delay and crosstalk. Therefore, a RLC circuit model of interconnects is consider in this work, which takes into account the effects inductance also. Two coupled interconnects are used to show the effects of both capacitive and inductive coupling. The coupled circuit model is studied in terms of S-parameters namely, S11 and S21, which gives return loss and insertion loss, respectively. The proposed circuit model is simulated by using the Advanced Design System 2005A (ADS) by Agilent Technologies. These parameters are obtained for different cases considering both types of coupling collectively and individually.","PeriodicalId":290448,"journal":{"name":"2011 International Conference on Devices and Communications (ICDeCom)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116050472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Variability Immune FinFET-Based Full Adder Design in Subthreshold Region 基于可变免疫finfet的亚阈值区域全加法器设计

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738477

A. Islam, M. W. Akram, M. Hasan

引用次数: 15

A WSN Based Framework for Human Health Monitoring 基于WSN的人体健康监测框架

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738453

K. Janani, V. R. Sarma Dhulipala, R. Chandrasekaran

引用次数: 13

Bandwidth Modelling for Distributed On-Chip RLCG Interconnect Considering Coupling Effects 考虑耦合效应的分布式片上RLCG互连带宽建模

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738481

Madhumanti Datta, Susmita Sahoo, R. Kar

{"title":"Bandwidth Modelling for Distributed On-Chip RLCG Interconnect Considering Coupling Effects","authors":"Madhumanti Datta, Susmita Sahoo, R. Kar","doi":"10.1109/ICDECOM.2011.5738481","DOIUrl":"https://doi.org/10.1109/ICDECOM.2011.5738481","url":null,"abstract":"With the increase in the levels of on-chip integration, the number of functional units integrated onto a single chip is rapidly increasing and as a result, the logic delays are decreasing due to faster transistors. At the same time, the local interconnect delays improve because the physical size of the circuit blocks decrease and the local interconnect spans shorter distances. On the other hand, the global interconnect delay increases with the technology scaling. Multiple design criteria are considered during the interconnect design process, such as delay, power, bandwidth and noise. Performance of any VLSI circuit depends on the bandwidth, as it decreases with the increase in the length of interconnects. Depending on the frequency range of operation, on-chip interconnect can be modelled as lumped and/or distributed RC line for low frequency and as a distributed RLC segments for high frequency. At even higher frequency, of the order of above 10GHz, the shunt conductance needs to be considered for accurate interconnect modelling. In this paper, on-chip interconnect has been modelled as distributed RLCG transmission lines, based on which a crosstalk aware bandwidth estimation method has been proposed in the transform domain in the presence of both inductive as well as capacitive coupling. First, the amount of crosstalk noise that would be induced on the victim line due to the transiting aggressor line has been analytically derived and then from the crosstalk noise voltage, a closed form expression for bandwidth has been proposed for distributed RLCG VLSI interconnects. The calculated bandwidth has been compared with the results obtained from that of SPICE simulation. The simulation shows that the proposed model could result an average error of as low as 15% when compared to the SPICE simulation.","PeriodicalId":290448,"journal":{"name":"2011 International Conference on Devices and Communications (ICDeCom)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125492872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Effect of Angle of Incidence on Shielding Effectiveness of Wire Mesh Electromagnetic Screens 入射角对丝网电磁屏蔽效果的影响

2011 International Conference on Devices and Communications (ICDeCom) Pub Date : 2011-03-24 DOI: 10.1109/ICDECOM.2011.5738508

C. D. Raj, V. S. Kumar, M. RamyaSree, K. Pradeep Vinaik

引用次数: 0