First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献_第2页

Characterisation of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive 各向异性导电胶粘剂用金属包覆聚合物球的力学性能表征

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973307

H. Kristiansen, Yuanliang Shen, J. Liu

引用次数: 7

Silicone materials for IC packaging and opto-electronics 集成电路封装和光电用硅树脂材料

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973303

E. Vanlathem, E. Oellers

引用次数: 3

The study of self-alignment capability of electrically conductive adhesives (ECAs) using low melting point alloy for flip-chip application 倒装用低熔点合金导电胶粘剂自对准性能的研究

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973267

C. Wong, K. Moon

{"title":"The study of self-alignment capability of electrically conductive adhesives (ECAs) using low melting point alloy for flip-chip application","authors":"C. Wong, K. Moon","doi":"10.1109/POLYTR.2001.973267","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973267","url":null,"abstract":"A feasibility study of the self-alignment capability of electrically conductive adhesives (ECAs) for a flip-chip interconnection application was carried out. The effect of the low melting alloy (LMA) filler on the self-alignment capability of ECAs was investigated. The surface energy of the epoxy resin was studied in terms of the various additives and their loading level using a goniometer with a built-in environmental chamber. The curing profile of the epoxy resin and the melting point of the LMA filler were measured using a differential scanning calorimeter (DSC). The ECAs filled with the LMA over 85 wt% showed self-alignment during the heating process. However, when silver flakes were added to the ECA formulation, self-alignment did not take place. We concluded that the LMA filler depleted into the silver flakes can adversely affect the self-alignment of ECAs. The key parameters required for ECA self-alignment capability are presented. This paper discusses the feasibility of the application of ECA with self-alignment capability for flip-chip interconnection. Initial results from these series studies indicate that incorporation of the LMA into ECAs is an efficient way to make ECAs with self-alignment capability.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121624751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Semiconductor nanoparticles: new building blocks for polymer-microelectronics? 半导体纳米颗粒:聚合物微电子学的新基石?

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973255

T. Nann

引用次数: 0

Laser via generation into flexible substrates 激光通过产生成柔性基板

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973286

Z. Illyefalvi-Vitéz, R. Berényi, P. Gordon, J. Pinkola, M. Ruszinkó, J. Vanfleteren

{"title":"Laser via generation into flexible substrates","authors":"Z. Illyefalvi-Vitéz, R. Berényi, P. Gordon, J. Pinkola, M. Ruszinkó, J. Vanfleteren","doi":"10.1109/POLYTR.2001.973286","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973286","url":null,"abstract":"The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymeric materials for the insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well. An advanced technology for the fabrication of very high density interconnects applies microvia flexible substrates. This technology has particular significance for the interposers of chip scale packages. Laser processing of polymeric materials applied for via generation, image transfer, contour cutting, etc. has proved to be an efficient tool for the fabrication of interconnect substrates. The paper describes some results of a research project that aims at the application of CO/sub 2/ and frequency multiplied Nd:YAG lasers for drilling via holes into copper clad flexible laminates of polyimide, epoxy and polyester base materials. The effect of the application of an interfacing (adhesive) layer is also the topic of the investigations. The physics of processing using a wavelength range from the far infrared radiation of the CO/sub 2/ laser till the UV wavelengths of frequency quadrupled Nd:YAG lasers are considered to be modeled, examined and evaluated.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126845405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Printed polymer transistors 印刷聚合物晶体管

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973262

A. Knobloch, A. Bernds, W. Clemens

{"title":"Printed polymer transistors","authors":"A. Knobloch, A. Bernds, W. Clemens","doi":"10.1109/POLYTR.2001.973262","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973262","url":null,"abstract":"Integrated plastic circuits (IPCs) based on organic field-effect transistors (OFETs) have many advantages. One potential is the use for commercial applications such as low cost ident-tags or electronic barcodes. In order to achieve low production cost, the transistors must be prepared by printing processes. In this paper, we present OFETs and organic inverters based on functional polymers with single layers applied by pad and screen printing. The pad printing technique is an efficient method for patterning the electrodes of an OFET. With this technique, dimensions of 20 /spl mu/m were reached. Source-drain and gate electrodes consisting of either polyaniline, carbon black conductive ink, gold, or silver filled ink were printed. With these structures, OFETs were assembled, in which poly(3-alkylthiophene) served as the semiconductor, and poly(4-hydroxystyrene) as the insulator. These polymers were deposited homogeneously by screen printing or spin coating. In addition, a gate dielectric for an OFET was also pad printed. A full organic inverter with all electrodes printed is introduced. As the production speed of the presented printing techniques has the ability to be scaled up, the potential for high volume printing of organic electronics is proven.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116098640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

An improvement of conductive adhesives on high temperature endurance by using Ag-Sn alloy powder 银锡合金粉末对导电胶粘剂耐高温性能的改善

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973292

M. Yamashita, K. Suganuma, M. Komagata, Y. Shirai

{"title":"An improvement of conductive adhesives on high temperature endurance by using Ag-Sn alloy powder","authors":"M. Yamashita, K. Suganuma, M. Komagata, Y. Shirai","doi":"10.1109/POLYTR.2001.973292","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973292","url":null,"abstract":"Ag-epoxy isotropic conductive adhesives are expected to be one of the alternatives to solder. One of the fatal drawbacks is, however, the poor compatibility between Ag fillers and Sn plating on components at elevated temperature. In the present work, the Ag-Sn alloy fillers were examined for replacing Ag filler to prevent this degradation. Two types of joints of Cu/adhesive/Cu with or without Sn plating on Cu were exposed at 150/spl deg/C. The initial strength of both joints was about 40 MPa and those increased about 65 MPa after 100 h exposure. Beyond 100 h exposure, the strength of the Sn plated joint decreased gradually as increasing exposure time. However, even after 1000 h exposure, the joint maintained high strength of 45 MPa. Thus, the Ag-Sn alloy fillers can be good replacement fillers compared with Ag fillers. On the other hand, the joint without any plating decreased strength to 25 MPa after 1000 h exposure. The interface reaction has a key role for such degradation mechanisms.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117224915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Improved reliability with underfilled area array packages 改进了未填充区域阵列封装的可靠性

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973269

J. Schneider

引用次数: 1

UV cationic systems for smart card/tag applications 用于智能卡/标签应用的UV阳离子系统

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973300

H. Murray, T. Ledwidge

引用次数: 2

Effects of HDI material for laser via hole forming HDI材料对激光通孔成形的影响

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973283

Y. Mikado

引用次数: 2