Characterisation of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI:10.1109/POLYTR.2001.973307

H. Kristiansen, Yuanliang Shen, J. Liu

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引用次数: 7

Abstract

Packaging and interconnection of integrated circuits have been a steadily increasing bottleneck, as the pattern dimensions on the silicon die continues to shrinks much more rapidly than the pattern on a typical printed circuit board. The search for more dense as well as cheaper interconnect, without compromise the reliability, is therefore of high priority. A program to characterise the mechanical properties of metal-coated plastic spheres has been going on at Chalmers, sponsored by Dyno Specialty Polymers AS as well as Hitachi Chemical. Mechanical properties have been obtained by measuring the stress-strain relationship for a number of different particles, both made by Dyno Specialty Polymers as well as other vendors. The properties have been tested both at room-temperature as well as 150/spl deg/C, to see the effect of elevated temperature. The results show clearly that the deformation of particles shows a significant hysteresis behaviour.

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各向异性导电胶粘剂用金属包覆聚合物球的力学性能表征

集成电路的封装和互连一直是一个稳步增长的瓶颈，因为硅芯片上的图案尺寸比典型印刷电路板上的图案尺寸缩小得更快。因此，在不影响可靠性的情况下，寻找更密集、更便宜的互连是当务之急。由Dyno Specialty Polymers和日立化学(Hitachi Chemical)赞助的一个项目正在查尔默斯进行，目的是表征金属涂层塑料球体的机械性能。通过测量许多不同颗粒的应力应变关系，获得了机械性能，这些颗粒都是由Dyno Specialty Polymers和其他供应商制造的。在室温和150/spl℃下测试了性能，以观察温度升高的影响。结果清楚地表明，颗粒的变形表现出明显的滞后行为。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

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