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2012 35th International Spring Seminar on Electronics Technology最新文献

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The manufacture process influence on thermal conductivity of polymers thermal interface materials with carbon nanotubes 研究了制备工艺对碳纳米管聚合物热界面材料导热性能的影响
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273113
B. Platek, T. Falat, J. Felba
{"title":"The manufacture process influence on thermal conductivity of polymers thermal interface materials with carbon nanotubes","authors":"B. Platek, T. Falat, J. Felba","doi":"10.1109/ISSE.2012.6273113","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273113","url":null,"abstract":"In this paper the manufacture process influence on thermal conductivity of polymer composites used as the Thermal Interface Material (TIM) is presented. To evaluate the influence of the manufacture factors the design of the experiment technique (DoE) and Analysis Of Variance for the results (ANOVA) were used. From the experiment results one import5ant factor and one important interaction have been specified which have the most important influence on the experiment. The factor is the time of mixing of dispersed carbon nanotubes in the polymer matrix and the interaction is the interdependence between the content of carbon nanotubes in the composite and the way of mixing (piston and mortar or three roller-mill). To evaluate the results the thermal conductivity of the TIMs was taken.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129904818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Resistance of conductive adhesive joints on non-noble surface finishes 导电胶接头在非高贵表面上的耐蚀性
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273082
V. Ivanov, B. Boehme, K. Wolter
{"title":"Resistance of conductive adhesive joints on non-noble surface finishes","authors":"V. Ivanov, B. Boehme, K. Wolter","doi":"10.1109/ISSE.2012.6273082","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273082","url":null,"abstract":"Electrically conductive adhesives (ECAs) have number of advantages comparing to solder joints. They are environmentally friendly and have lower processing temperature that makes them suitable for manufacturing of LCD's or connecting flexible solar cell arrays in modules. However, in flexible solar cells the metal contact is usually made of non-noble metal, and this joint can suffer from decrease of conductivity at the operation environment. In this work the joint behavior between different metal surfaces (Au, Sn, Mo) and ECAs during different ageing conditions is investigated. The aim of the work is to investigate the degradation of non-noble metal-ECA joints in order to predict the reliability of such an electrical contact. The results of the literature review and ageing experiments are presented. The ageing conditions were 120 °C thermal ageing and damp heat test (85 °C/85RH). The test samples were manufactured on FR-4-boards with metal stripes and applied ECAs between them. The experiments are focused on the electrical conductivity. The experiments have shown significant increase in joint resistance after 85 °C/85RH, while under 120 °C ageing a slight decrease was observed.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125264261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Study of curing process of electrically conductive adhesives using differential scanning calorimetry 差示扫描量热法研究导电胶粘剂固化过程
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273081
P. Mach, E. Povolotskaya
{"title":"Study of curing process of electrically conductive adhesives using differential scanning calorimetry","authors":"P. Mach, E. Povolotskaya","doi":"10.1109/ISSE.2012.6273081","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273081","url":null,"abstract":"Differential scanning calorimetry has been used to verify quality of curing of nine formulations of electrically conductive adhesive based on epoxy resin matrix filled with silver flakes. Three formulations have been added with low concentration of silver nanoparticles. The measurement has been performed in addition to the measurement of tensile strength and shear strength of thermally aged adhesive joints, since it has been found that mechanical properties of some joints have improved after thermal ageing provided at the temperature of 125 °C for 300 hours. This could suggest an imperfect cure of adhesives despite the fact that adhesives have been cured according to instructions of a manufacturer. It has been found, by the use of DSC that exothermic reactions associated with additional hardening of adhesive occur for some formulations during the initial stage of thermal ageing. This means that the curing schedules for these adhesives, recommended by a manufacturer, have not been optimal. Such way cured adhesives have worse electrical and mechanical properties.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"2005 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128298797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Model based FMEA - An efficient tool for quality management of the free lead soldering 基于模型的FMEA——无铅焊接质量管理的有效工具
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273078
Martin Molhanec, E. Povolotskaya
{"title":"Model based FMEA - An efficient tool for quality management of the free lead soldering","authors":"Martin Molhanec, E. Povolotskaya","doi":"10.1109/ISSE.2012.6273078","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273078","url":null,"abstract":"The main idea behind of this paper is aimed to improve FMEA (Failure Mode and Effects Analysis) method in the field of the free lead soldering process with employing a Model Based approach (more precisely an Ontological Based Model approach). This approach, a novelty of the Authors, contributes to more efficient risk management of a manufacturing process. It also increases quality, reliability and testing-capability of the process. Further, the Authors describe selected software tools and ontology editors suitable for the support of the introduced method. Finally, a brief description of Model Based FMEA method is set and some future directions of further research are indicated.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116416151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Surface insulation resistance testing of solder pastes with protective coating 涂有保护涂层的焊膏表面绝缘电阻试验
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273132
M. Pantazica, C. Marghescu, C. Tămaş, P. Svasta, I. Plotog, G. Vărzaru
{"title":"Surface insulation resistance testing of solder pastes with protective coating","authors":"M. Pantazica, C. Marghescu, C. Tămaş, P. Svasta, I. Plotog, G. Vărzaru","doi":"10.1109/ISSE.2012.6273132","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273132","url":null,"abstract":"This paper presents the results obtained after performing SIR testing in order to evaluate different solder materials. The scope of the test was to determine the effects of the reflow process used and of a protective coating on surface insulation resistance (SIR) in the presence of medium heat and high humidity for several solder pastes. There were used special designed test pattern boards according to IPC-B-24 and several solder pastes with no-clean fluxes: SAC305, OM338PT, OM5300, SN100C and SN100C-XF3. After 110 hours, the measurements showed the reduced values of the average surface insulation resistance. The optical inspection did not show any electrochemical formation (dendrites) between conductors.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"158 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116544247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Heat protection coatings for high temperature electronics 高温电子产品用热防护涂层
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273099
F. Bremerkamp, D. Seehase, M. Nowottnick
{"title":"Heat protection coatings for high temperature electronics","authors":"F. Bremerkamp, D. Seehase, M. Nowottnick","doi":"10.1109/ISSE.2012.6273099","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273099","url":null,"abstract":"Highly-integrated electronic devices and printed circuit boards need to be protected against overheating. In this disquisition a concept is introduced to improve the thermal management of coated assemblies by means of functional additives based on earlier works [4]. It has already been proven that paraffin wax, zeolite molecular sieve and silica gel have the potential as thermal energy storage systems due to phase transition effects and sorption [1], [5], [6]. Here the cooling effects of these materials were analyzed by using a heating element (constantan on ceramic substrate) and chip resistors with different package sizes (2512, 1206, 0805, 0603). The covering of these testing elements with the investigated additives lead to a significant delayed heating and therewith to a short-period heat protection at pulse load condition. Nevertheless a re-cooling of the system could regenerate the cooling effects of the additives for multiple utilization; paraffin wax due to refreezing and zeolite/silica gel due to rehydration. The Application for coating technology indicates a significant improvement of thermal properties.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126479136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Investigations on current capabilities of PEDOT:PSS conductors PEDOT:PSS导体电流性能的研究
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273109
C. Ionescu, D. Bonfert, N. Codreanu, P. Svasta
{"title":"Investigations on current capabilities of PEDOT:PSS conductors","authors":"C. Ionescu, D. Bonfert, N. Codreanu, P. Svasta","doi":"10.1109/ISSE.2012.6273109","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273109","url":null,"abstract":"The organic electronics products becomes every day more and more present, especially known being organic light emitting diodes (OLED), organic photovoltaic cells (OPV) or organic thin film transistors (OFET). It is very important to have a reliable solution for interconnection of these devices in a manner similar to printed circuit boards. This paper will present results on electrical and thermal tests of organic conductors based on poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS) that can be used for data and power tracks. The samples are, and will be prepared by screen printing and ink-jetting, having silver paste and respectively ink based terminations. The results have shown that the current capabilities of PEDOT:PSS organic conductive tracks are limited by the dissipated power, due to relatively large resistance. As expected, the screen printed tracks having a higher thickness will have lower resistance. The temperature coefficient (TCR) has been found negative around -1000 ppm/°C.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133489047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Electron beam welding of micro-housings with dissimilar metals for electronic circuits 电子电路用异种金属微型外壳的电子束焊接
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273128
M. Steinhauser, C. Korbs, R. Bauer
{"title":"Electron beam welding of micro-housings with dissimilar metals for electronic circuits","authors":"M. Steinhauser, C. Korbs, R. Bauer","doi":"10.1109/ISSE.2012.6273128","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273128","url":null,"abstract":"The Electron beam technology with its electromagnetic lenses enable the inertialessly deflection and focusing of the beam and gives a lot of possibilities for welding and modification of different materials. This paper and the poster shows selected results of research investigations on thermal electron beam processes of HTW Dresden. The first part handles with the influences of the heat-input in the weld zone. The second part shows results of investigations to weld 16 electronic-housings at the same time by using the fast beam deflection as multi-weld technology.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"214 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133690761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Possibilities of making 3D resistors in LTCC technology LTCC技术制造3D电阻器的可能性
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273107
M. Klíma, I. Szendiuch
{"title":"Possibilities of making 3D resistors in LTCC technology","authors":"M. Klíma, I. Szendiuch","doi":"10.1109/ISSE.2012.6273107","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273107","url":null,"abstract":"The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers - directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"142 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133349342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Modeling supercontinuum generation in microstructured fibers by femtosecond pump pulses using Split-Step Fourier method 用分步傅里叶方法模拟微结构光纤中飞秒泵浦脉冲产生的超连续谱
2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI: 10.1109/ISSE.2012.6273092
Y. Bashkatov, B. Tsyganok, V. Khomenko, N. Kachalova, V. Voitsekhovich, I. Uvarova
{"title":"Modeling supercontinuum generation in microstructured fibers by femtosecond pump pulses using Split-Step Fourier method","authors":"Y. Bashkatov, B. Tsyganok, V. Khomenko, N. Kachalova, V. Voitsekhovich, I. Uvarova","doi":"10.1109/ISSE.2012.6273092","DOIUrl":"https://doi.org/10.1109/ISSE.2012.6273092","url":null,"abstract":"Numerical algorithm for modeling supercontinuum generation was build. Split-step Fourier method was used modeling. Dependence on pump wavelength is shown. Modeling is implemented in MatLab environment. All results of theoretical modulation are proved by experiment.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131094693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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