Study of curing process of electrically conductive adhesives using differential scanning calorimetry

2012 35th International Spring Seminar on Electronics Technology Pub Date : 2012-05-09 DOI:10.1109/ISSE.2012.6273081

P. Mach, E. Povolotskaya

{"title":"Study of curing process of electrically conductive adhesives using differential scanning calorimetry","authors":"P. Mach, E. Povolotskaya","doi":"10.1109/ISSE.2012.6273081","DOIUrl":null,"url":null,"abstract":"Differential scanning calorimetry has been used to verify quality of curing of nine formulations of electrically conductive adhesive based on epoxy resin matrix filled with silver flakes. Three formulations have been added with low concentration of silver nanoparticles. The measurement has been performed in addition to the measurement of tensile strength and shear strength of thermally aged adhesive joints, since it has been found that mechanical properties of some joints have improved after thermal ageing provided at the temperature of 125 °C for 300 hours. This could suggest an imperfect cure of adhesives despite the fact that adhesives have been cured according to instructions of a manufacturer. It has been found, by the use of DSC that exothermic reactions associated with additional hardening of adhesive occur for some formulations during the initial stage of thermal ageing. This means that the curing schedules for these adhesives, recommended by a manufacturer, have not been optimal. Such way cured adhesives have worse electrical and mechanical properties.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"2005 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273081","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

Abstract

Differential scanning calorimetry has been used to verify quality of curing of nine formulations of electrically conductive adhesive based on epoxy resin matrix filled with silver flakes. Three formulations have been added with low concentration of silver nanoparticles. The measurement has been performed in addition to the measurement of tensile strength and shear strength of thermally aged adhesive joints, since it has been found that mechanical properties of some joints have improved after thermal ageing provided at the temperature of 125 °C for 300 hours. This could suggest an imperfect cure of adhesives despite the fact that adhesives have been cured according to instructions of a manufacturer. It has been found, by the use of DSC that exothermic reactions associated with additional hardening of adhesive occur for some formulations during the initial stage of thermal ageing. This means that the curing schedules for these adhesives, recommended by a manufacturer, have not been optimal. Such way cured adhesives have worse electrical and mechanical properties.

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差示扫描量热法研究导电胶粘剂固化过程

采用差示扫描量热法对九种环氧树脂基银片填充导电胶粘剂配方的固化质量进行了验证。三种配方添加了低浓度的纳米银。除了测量热老化胶粘剂接头的抗拉强度和剪切强度外，还进行了该测量，因为发现在125℃的温度下进行300小时的热老化后，某些接头的机械性能有所改善。这可能表明粘合剂的固化不完美，尽管粘合剂已经根据制造商的说明进行了固化。通过DSC发现，在热老化的初始阶段，某些配方会发生与粘合剂附加硬化相关的放热反应。这意味着这些胶粘剂的固化时间表，由制造商推荐，并不是最佳的。这种方式固化的胶粘剂具有较差的电气和机械性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 35th International Spring Seminar on Electronics Technology

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