发布求助
文献互助 智能选刊 最新文献

2007 IEEE Symposium on Product Compliance Engineering最新文献

筛选
英文 中文
Manufacturers Laboratories, - Possibilities in CB Scheme, NRTL, GS Marking etc. 制造商实验室，- CB计划，NRTL, GS标志等的可能性。
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378476
W. Kreinberg
{"title":"Manufacturers Laboratories, - Possibilities in CB Scheme, NRTL, GS Marking etc.","authors":"W. Kreinberg","doi":"10.1109/PSES.2007.4378476","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378476","url":null,"abstract":"The classic approach of testing and certification in independent third party laboratories and certification bodies is still an important means to document compliance with requirements from standards, laws or directives. The majority of small and medium size companies will continue to choose this route as they only have the choice either to build up and maintain own laboratory capacity and competence or to use the third party organizations at least as an extended workbench to ensure compliance of their products with national or international requirements. The majority of manufacturers of products to be handled in the CB Scheme still do not have the capability and facilities to apply for TMP, WMT, SMT or RMT programs. The majority will remain with a 100% Third Party Service performed by an NCB and a CBTL officially accepted in the CB Scheme.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122350428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Application of EMC Testing to Chip Level SOC (System on a CIp) EMC测试在芯片级SOC (System on a CIp)中的应用
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378480
D. Petry
{"title":"Application of EMC Testing to Chip Level SOC (System on a CIp)","authors":"D. Petry","doi":"10.1109/PSES.2007.4378480","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378480","url":null,"abstract":"The advent of customer requirements for module level electromagnetic compatibility (EMC) testing has an impact on the successful achievement of application specific integrated circuit (ASIC) design and qualification. This paper will describe the applicability of the following EMC test standards to a SOC (system on a chip) device: ISO 11452, SAE J1113, AEC Q100, SAE J1752/3 and Ford ES-XW7T-1A278-AB and -AC. The testing presented will focus on: 1) immunity to power supply voltage dropout, 2) radiated emissions, 3) spark over parallel wire, 4) coupled immunity, and 5) RF immunity. Best practice design techniques for module PCB layout will be reviewed. A recently performed battery of EMC test results, including high temperature testing, for a sensor signal conditioner SOC IC will be presented in this paper as an illustration of the overall approach.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"438 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115857525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Failures of Electrical/Electronic Components: Selected Case Studies 电气/电子元件故障:选定案例研究
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378474
A. Arora, N. Medora, J. Swart
{"title":"Failures of Electrical/Electronic Components: Selected Case Studies","authors":"A. Arora, N. Medora, J. Swart","doi":"10.1109/PSES.2007.4378474","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378474","url":null,"abstract":"Consumer products typically contain a large number of discrete electrical and electronic components. The failure modes of these components are usually benign. However, in some cases, these failure modes can pose a safety hazard. An understanding of a component's failure modes and mechanisms is desirable to design a product that is both safe and reliable. Two case studies are presented here: an electrical and thermal test to characterize the temperature of an aluminum electrolytic capacitor during a venting event, and a field failure case study showing a power connector failure due to improper connector mounting techniques. A summary of the test setup, test procedures and selected results are also presented here.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116946328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
An Enhanced Computer Simulation Model of the IEEE Std C62.41.2-2002 Surge Generator for Simulated Surge Testing of Electrical Systems 基于IEEE Std C62.41.2-2002的电涌发生器仿真模型
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378478
N. Medora, E. S.M.P., Alexander Kusko
{"title":"An Enhanced Computer Simulation Model of the IEEE Std C62.41.2-2002 Surge Generator for Simulated Surge Testing of Electrical Systems","authors":"N. Medora, E. S.M.P., Alexander Kusko","doi":"10.1109/PSES.2007.4378478","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378478","url":null,"abstract":"Computer modeling may be used to accurately model an IEEE Std C62.41.2-2002 Combination Wave surge generator and apply the simulated surge waveform to a modeled system to determine the system's immunity to surge voltages. During the simulated surge tests, the designer can verify the suitability of the selected components, and, if necessary, judiciously perform a re-design at low cost and with little time expended. Furthermore, the designer can also observe the magnitude of the stresses imposed on the components by the simulated surge and thus determine the magnitude of the component voltages and currents, including dv/dt, di/dt, and the ringing frequency, thus allowing the designer to fully evaluate the adequacy, reliability and safety of the designed system. The authors evaluated a surge generator model published in an IEEE paper in 2005 and determined that the model was inaccurate. Consequently, a new surge generator model was proposed. The novel features of this enhanced surge generator model are demonstrated for four different simulation runs, using an electronic circuit with an L-C input line filter. The four runs include two operating conditions: a) with a surge suppressor in the circuit and b) with the surge suppressor open- circuited. The connected load includes: 1) a motor load and 2) a resistive load.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130468383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Calculating the Current Limits to Use in Production Line Dielectric Withstand Tests 计算在生产线耐介质测试中使用的电流限制
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378481
S. Richardson
{"title":"Calculating the Current Limits to Use in Production Line Dielectric Withstand Tests","authors":"S. Richardson","doi":"10.1109/PSES.2007.4378481","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378481","url":null,"abstract":"This article includes the result of a survey as to what the term \"breakdown\" means, and provides a working definition of the term. Next, the article will investigate various methods for determining the impedance of a product to assist in setting the current limits.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123018244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improved EN-60529 Dust Chamber for IP5x or IP6x Enclosure Testing 改进的EN-60529防尘室，用于IP5x或IP6x外壳测试
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378482
M. Taylor
{"title":"Improved EN-60529 Dust Chamber for IP5x or IP6x Enclosure Testing","authors":"M. Taylor","doi":"10.1109/PSES.2007.4378482","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378482","url":null,"abstract":"Europe requires safety certification to EN 61010 for equipment such as laboratory, test & measurement equipment. Section 11.6 calls out protection against hazards from liquids (and dust) by testing the product enclosure to IEC 60529, the dust test. This work describes the evaluation of the dust test chamber as detailed in IEC 60529, figure-2 and the subsequent design of an improved dust test chamber. Deficiencies in the existing design and rational for improvement are discussed. The resulting final design is discussed in detail and test data is presented to validate the improvements to the dust test chamber.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131703081","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electric Shock protection within the heart cycle 心脏循环内的电击保护
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378479
P. E. Perkins
{"title":"Electric Shock protection within the heart cycle","authors":"P. E. Perkins","doi":"10.1109/PSES.2007.4378479","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378479","url":null,"abstract":"Impulses inside the period of the heart require special attention because of the identified inability of the heart to withstand as severe a shock if it does not have time to cycle and recover. This effect is cumulative and fall quickly to 10% or less of the initial value.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115135331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Safety Concerns on Ground Fault Application Transfer Phenomenon in HV Installations 高压装置接地故障应用转移现象的安全关注
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378477
S. Mangione, L. Mineo
{"title":"Safety Concerns on Ground Fault Application Transfer Phenomenon in HV Installations","authors":"S. Mangione, L. Mineo","doi":"10.1109/PSES.2007.4378477","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378477","url":null,"abstract":"When a fault to ground occurs in HV/MV substations supplied by a combined overhead-cable line, most of the fault current can be transferred and injected into the soil several kilometers far away from the fault location. This phenomenon is called \"fault application transfer\" and mostly concerns transition stations, where cables are connected to the overhead line. If the transition station is a dead-end steel pole structure, usually accessible to the general public, the local ground electrode could be inadequate to maintain ground potential rise within safety limits. Hence, dangerous touch and step voltages may appear at exposed locations. In the paper results of various computer simulations are presented, pointing out the main factors affecting the phenomenon and associated hazards.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128530154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Safety Considerations for Liquid Filled Heat Sinks 充液散热器的安全注意事项
2007 IEEE Symposium on Product Compliance Engineering Pub Date : 2007-11-05 DOI: 10.1109/PSES.2007.4378475
L. Bahra
{"title":"Safety Considerations for Liquid Filled Heat Sinks","authors":"L. Bahra","doi":"10.1109/PSES.2007.4378475","DOIUrl":"https://doi.org/10.1109/PSES.2007.4378475","url":null,"abstract":"The basis for applying safeguard requirements to Information Technology Equipment (ITE) containing liquids is the requirement in sub-clause 4.3.10 of I EC 60950-1. It provide very general guidelines and do not completely specify the required safeguards and safeguard requirements. We need to look into other standards which address equipment that use pressurized and non-pressurized liquid containment vessels and address compatibility issues when plastic materials are used in conjunction with liquids. Product sizes are continuously being reduced and integrated circuit (IC) chips are becoming more compact containing more and more components. They are also going up in processing speeds. Products that try to keep up with new technology need more power and as a result, generate more heat in the equipment. This heat must be moved out of the product. There are many different types of systems available for cooling (moving heat out of the product). We are going to discuss mainly two types of liquid cooling systems here: liquid cooling heat pipes and liquid filled heat sink system.","PeriodicalId":264110,"journal":{"name":"2007 IEEE Symposium on Product Compliance Engineering","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131707608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信