2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)最新文献

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ICICM 2019 Table of Contents ICICM 2019目录
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/icicm48536.2019.8977157
{"title":"ICICM 2019 Table of Contents","authors":"","doi":"10.1109/icicm48536.2019.8977157","DOIUrl":"https://doi.org/10.1109/icicm48536.2019.8977157","url":null,"abstract":"","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127432914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrical Locating Technology for Failure Point Location Based on an Amplifier Module 基于放大器模块的故障点电气定位技术
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977137
Zhimin Ding, Chao Duan, Xu Wang, Meng Meng, Zhibin Wang
{"title":"Electrical Locating Technology for Failure Point Location Based on an Amplifier Module","authors":"Zhimin Ding, Chao Duan, Xu Wang, Meng Meng, Zhibin Wang","doi":"10.1109/ICICM48536.2019.8977137","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977137","url":null,"abstract":"A boom in microsystem modules has brought with it increasingly integrated internal chips that are smaller and smaller in feature size. Meanwhile, multilayer wiring has also got more complicated. Consequently, locating failure points in these chips – a crucial link in module failure analysis technologies – is becoming even harder, through electrical methods or otherwise. This article revolves around a type of amplifier module suffering a failure. Alongside traditional failure analysis methods, electrical techniques of infrared hotspot, isolation testing and surface delayering are employed to successfully diagnose the failure, including the location and appearance of the failure point. Findings in this article are hoped to facilitate future development of internal electrical locating technologies for module failure analysis.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114247486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
[Copyright notice] (版权)
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/icicm48536.2019.8977181
{"title":"[Copyright notice]","authors":"","doi":"10.1109/icicm48536.2019.8977181","DOIUrl":"https://doi.org/10.1109/icicm48536.2019.8977181","url":null,"abstract":"","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"27 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127790151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Memory optimization of CNN Heterogeneous Multi-Core Architecture CNN异构多核架构的内存优化
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977143
Mingchen Gao, Dake Liu, Zhidong Miao, Shaohan Liu
{"title":"Memory optimization of CNN Heterogeneous Multi-Core Architecture","authors":"Mingchen Gao, Dake Liu, Zhidong Miao, Shaohan Liu","doi":"10.1109/ICICM48536.2019.8977143","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977143","url":null,"abstract":"Convolutional neural networks(CNNs) computing complexity raises challenges to the power and cost of CNN accelerators. The power consumption and delay of the data access between on-chip and off-chip memories have been a bottleneck of the on-chip system for CNN acceleration. We propose a static scheduling framework based on our heterogeneous programmable multi-core ASIP (Application Specific Instruction-set Processor) for inference of deep learning. This scheduling framework minimizes power consumption and promotes performance under the hardware resource limitation, including datapath computing capability, access bandwidth limitation, and on-chip memory size. We also discussed how to achieve theoretical maximum performance for a set of fixed hardware constraints. Comparing to the scheduling on DNA(deep neural architecture) under the same AlexNet platform, our scheduling achieves 11.8% more average resource utilization. By reusing and broadcasting local data, the average DRAM access of our design is reduced down to 41% of the access of DNA. The estimated power consumption of this design is 35% lower than the power of DNA, mostly because of the power reduction from DDR data accesses. Meanwhile, through the ping-pang memory and the careful design of data partition, the time of data access between DRAM and SRAM is reduced 77% by access hidden.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131448560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Research on Fault Prediction Method of Analog Circuits Based on DCQGA-SVR 基于DCQGA-SVR的模拟电路故障预测方法研究
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977201
Xuelong Yan, Runping Ma
{"title":"Research on Fault Prediction Method of Analog Circuits Based on DCQGA-SVR","authors":"Xuelong Yan, Runping Ma","doi":"10.1109/ICICM48536.2019.8977201","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977201","url":null,"abstract":"Aiming at the shortcomings of analog circuit fault prediction technology, the DCQGA-SVR analog circuit fault prediction method is proposed. Firstly, the failure mechanism of electrolytic capacitor and power MOSFET in analog circuit is analyzed. The fault parameters that can be used to reflect circuit fault, map electrolytic capacitor and power MOSFET are researched. The average output power is extracted as the characteristic parameter of circuit fault. Secondly, the double-chain quantum genetic algorithm is used to optimize the support vector machine regression algorithm to predict the fault feature parameters, and then the fault prediction model is established. Finally, the Boost circuit is used as the simulation test circuit, and compared with the traditional QGA-SVR algorithm and LS-SVM algorithm. The results show that the proposed prediction method has small mean square error and can effectively predict the fault.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131081847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of the Interface Charges' Location on the Threshold Voltage of TFT 界面电荷位置对TFT阈值电压的影响
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977149
Ruize Sun, Zhun Zhang, Qi Yu, Jianming Cao
{"title":"Influence of the Interface Charges' Location on the Threshold Voltage of TFT","authors":"Ruize Sun, Zhun Zhang, Qi Yu, Jianming Cao","doi":"10.1109/ICICM48536.2019.8977149","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977149","url":null,"abstract":"With the development of VLSI (Very Large Scale Integration), the size of devices decreases and the electric field of gate oxide increases relatively. The degradation of TFT (Thin Film Transistor) devices is further affected by NBTI effect. When the device DB-NBTI degenerates, interface charges distribution is non-uniform. In this paper, the gate of p-type silicon TFT device is divided into several grid segments, and different concentration of interface charges is introduced to simulate the non-uniform distribution of charge. The relationship between the interface charges’ location and the threshold voltage is well simulated numerically, in which the conditions of drain biasing, interface charges’ concentration and with or without traps are considered. It is found that the device transfer characteristics lag behind those without considering the trap model. The influence of non-uniform interface charges on the threshold voltage of TFT is stronger near the source and weaker near the drain. When the drain voltage increases, the influence is suppressed to some extent. At the same time, the influence of interface charges on pMOS and TFT are compared and analyzed. The proposed work can promote the research on Drain Bias-Negative Bias Temperature Instability (DB-NBTI) effect.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"24 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131123929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Laser Modulation Driver in 130-nm CMOS Technology for Quantum Key Distribution System 一种用于量子密钥分配系统的130纳米CMOS激光调制驱动器
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977145
Bo Feng, Futian Liang, Xinzhe Wang, Yulong Zhu, Chenxi Zhu, G. Jin
{"title":"A Laser Modulation Driver in 130-nm CMOS Technology for Quantum Key Distribution System","authors":"Bo Feng, Futian Liang, Xinzhe Wang, Yulong Zhu, Chenxi Zhu, G. Jin","doi":"10.1109/ICICM48536.2019.8977145","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977145","url":null,"abstract":"Laser modulation is a process to modulate the photons to different states in quantum key distribution (QKD) system. A laser modulation driver, which is a pre-driver for the laser modulator, is presented in this paper. The laser modulation driver is implemented in a 130-nm complementary metal oxide semiconductor (CMOS) process. The laser modulation driver can provide a current pulse signal with an adjustable amplitude and an adjustable pulse-width to a distributed power amplifier. The pulse-width of the current signal can be adjusted from 300 ps to 3800 ps, the maximum adjustable amplitude is 14.4 mA, and the data rate can reach 625 Mb/s. According to the test results, the laser modulation driver can meet the requirements of the electro-optic modulator (EOM) in QKD system, and it can be used in the laser modulation circuit in QKD experiments.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133352742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A New Generation of Static Timing Analysis Technology Based on N7+ Process—POCV 基于N7+工艺的新一代静态时序分析技术- pocv
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977171
Xiaohong Peng, Hong Wang, Shengxia Wang, J. Du
{"title":"A New Generation of Static Timing Analysis Technology Based on N7+ Process—POCV","authors":"Xiaohong Peng, Hong Wang, Shengxia Wang, J. Du","doi":"10.1109/ICICM48536.2019.8977171","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977171","url":null,"abstract":"With the continuous development of semiconductor technology, timing analysis is becoming more and more complicated. Static timing analysis is constantly improving the constraint mode. The traditional on-chip variation (OCV) has become increasingly unsatisfactory under advanced technology. The design requirements of the tens of millions of high-speed chips; the advanced on-chip methodology (advanced OCV, AOCV), while solving the pessimism of the traditional method, will increase the analysis time. This article will introduce the new generation of static timing analysis technology applied in the 7Plus process - Parametric on-chip variation (POCV); POCV simulates the delay distribution probability obtained by the variation in a certain case, which is more accurate than AOCV. And reduce the time of timing analysis, increasing the number of iterations of timing analysis.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133421472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A 50 GHz High Sensitivity InP HBT Comparator 一种50 GHz高灵敏度InP HBT比较器
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977203
Hao Zhou, Youtao Zhang
{"title":"A 50 GHz High Sensitivity InP HBT Comparator","authors":"Hao Zhou, Youtao Zhang","doi":"10.1109/ICICM48536.2019.8977203","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977203","url":null,"abstract":"In this paper, a high speed and high sensitivity voltage comparator circuit is designed based on the 0.7um InP double heterojunction bipolar transistor technology with a current gain cutoff frequency (fT) of 320 GHz. The comparator consumes 410mW with a single 3.3V power supply. The simulation results show that the input sensitivity is 1mV with 25GHz data input and 3mV with 49GHz data input at 50GS/s. The input signal dynamic range of the comparator is 55.6dBc and the Figure of Merit (FoM) of the comparator is 1.99. To our best knowledge, it achieves the highest sensitivity and the highest value of FoM at 50GS/s.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131281521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 71.8-87.9 GHz CMOS Injection-Locked Frequency Divider with Coupled Inductance 一种71.8-87.9 GHz耦合电感CMOS注入锁频分频器
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2019-10-01 DOI: 10.1109/ICICM48536.2019.8977141
Jingyi Cai, Lu Tang
{"title":"A 71.8-87.9 GHz CMOS Injection-Locked Frequency Divider with Coupled Inductance","authors":"Jingyi Cai, Lu Tang","doi":"10.1109/ICICM48536.2019.8977141","DOIUrl":"https://doi.org/10.1109/ICICM48536.2019.8977141","url":null,"abstract":"In this paper, a technique of inductor coupling is used to optimize the bandwidth of the injection-locked transformer. This design replaces the inductance of a conventional injection-locked divider with a transformer consists by two coupled inductance, each has its own independent cross-coupled pair. This design is based on 40nm-CMOS technology, with a supply voltage of 0. 9V, the post-simulation results achieve a locking range of 71.8-87.9GHz with an injected signal of 0dBm, and the core chip size is 88$times $1301$mu mathrm{m}^{2}$.","PeriodicalId":257536,"journal":{"name":"2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116978949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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