First International Workshop on Massively Parallel Processing Using Optical Interconnections最新文献

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Optically augmented 3-D computer: technology and architecture 光学增强3-D计算机:技术与架构
P. Marchand, A. Krishnamoorthy, S. Esener, U. Efron
{"title":"Optically augmented 3-D computer: technology and architecture","authors":"P. Marchand, A. Krishnamoorthy, S. Esener, U. Efron","doi":"10.1109/MPPOI.1994.336632","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336632","url":null,"abstract":"In order to achieve high performance parallel computing in terms of bandwidth versus power consumption and volume, denser and faster means of implementing interconnections while minimizing power and crosstalk are required. Global interconnections can be implemented using free-space interconnect technology and can be coupled to the wafer to wafer connection system developed at Hughes Research laboratories to obtain an optoelectronic 3-D computer with increased throughputs for routing or sorting operations. To this end, the 3-D optoelectronic computing architecture needs to be designed for optimal performance, light transmitters and receivers need to be integrated with the 3-D VLSI wafer stacks to allow optical inputs and outputs, and free-space optical interconnect elements need to be assembled with the modified 3-D wafer stacks. In the paper, the underlying concepts of the technology and architecture of the optically augmented 3-D computer are evaluated.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121299454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Fabrication issues for free-space optics at the board packaging level 板封装级自由空间光学器件的制造问题
R. Kostuk
{"title":"Fabrication issues for free-space optics at the board packaging level","authors":"R. Kostuk","doi":"10.1109/MPPOI.1994.336612","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336612","url":null,"abstract":"The successful application of optical interconnects to electronic processing systems requires careful consideration of the: electronic system in which it will be used; optical system and electro-optical device performance; electrical-electro optic interface characteristics; packaging of micro optic components and electro-optic devices with electronic substrates; and the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. We consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":" 86","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113952479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Photonic architectures for distributed shared memory multiprocessors 分布式共享内存多处理器的光子体系结构
P. Dowd, J. Chu
{"title":"Photonic architectures for distributed shared memory multiprocessors","authors":"P. Dowd, J. Chu","doi":"10.1109/MPPOI.1994.336630","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336630","url":null,"abstract":"This paper studies the interaction between the access protocol used to provide arbitration for a wavelength-division multiple access photonic network and the cache coherence protocol required to support a distributed shared memory environment. The architecture is based on wavelength division multiplexing which enables multiple multi-access channels to be realized on a single optical fiber. Larger blocks are supported to reduce the per bit overhead and increase the exploitation of spatial locality, while false sharing is reduced through a mechanism to provide a finer granularity of invalidation. Two main approaches have been considered to harness the enormous available bandwidth of WDMA optical networks: reservation (control-channel based) or pre-allocation media access protocols. This paper extends the function of a control channel to include broadcast support of cache-level control information, in addition to its primary role of data channel reservation, thereby enabling a snooping based coherence protocol to be considered. Larger snooping-based multiprocessors may be possible with this approach. Two major scenarios are considered through trace-based discrete-event simulation in this paper: a system with a directory based cache coherence protocol and a pre-allocation based WDMA access protocol is compared to a system with a snooping based cache coherence protocol and a reservation based WDMA access protocol.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"67 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133524365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Optical interconnection system using stacked thin film modulator and detector 采用叠层薄膜调制器和检测器的光互连系统
D. Shen, S. Kowel
{"title":"Optical interconnection system using stacked thin film modulator and detector","authors":"D. Shen, S. Kowel","doi":"10.1109/MPPOI.1994.336631","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336631","url":null,"abstract":"Proposes a new optical connection system using thin film modulators and detectors on top of silicon VLSI chips. The advantage of this system is that the entire chip area could be dedicated to processor and memory circuits. Such a system could offer large bandwidth parallel communication channels for multiprocessors, based entirely on proven, compatible materials and processes and could be accomplished in near future. Thin film polymer etalon structures can be used as the modulators. The electrically stored information can be changed to optical information and then broadcast to receiving arrays. The amorphous silicon can be deposited on top of the silicon chip as a receiving array. The concept and important technical issues are discussed. The initial experimental results suggest that this new system is promising.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"37 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122514391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Holographic optical interconnections 全息光学互连
H. Grebel, S. Tsay
{"title":"Holographic optical interconnections","authors":"H. Grebel, S. Tsay","doi":"10.1109/MPPOI.1994.336622","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336622","url":null,"abstract":"Introduces a new type of planar optical interconnect, the transverse holographic waveguides. With this type of interconnect, one dimensional, input light distribution is converted into a one dimensional output light distribution via holographic patterning along the direction of the optical wave propagation.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126790867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Fan in loss in electrical and optical circuits and systems 在电气和光学电路和系统中的风扇损耗
J. Goodman, J. Lam
{"title":"Fan in loss in electrical and optical circuits and systems","authors":"J. Goodman, J. Lam","doi":"10.1109/MPPOI.1994.336626","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336626","url":null,"abstract":"Analogies between the fan-in limitations of linear electrical circuits and linear optical circuits are explored. In both cases, the second law of thermodynamics sets the limits as to the amount of power that can be coupled from multiple inputs into a single output. The limitation applies to the power coupled into a single (properly defined) output \"mode\" from a set of input modes. While fan-in limitations of optics have generally been stated in terms of power coupled into a single outgoing spatial mode from incoming spatial modes, a more general view makes use of temporal and polarization modes as well. It is then possible to show that the usual fan-in restrictions stated with respect to only spatial modes can be violated, while the more general restriction in terms of space-time-polarization modes remains satisfied. The results have direct application to wavelength multiplexed optical interconnects.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"231 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126898000","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optical interconnects based on two-dimensional VCSEL arrays 基于二维VCSEL阵列的光互连
J. Neff
{"title":"Optical interconnects based on two-dimensional VCSEL arrays","authors":"J. Neff","doi":"10.1109/MPPOI.1994.336625","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336625","url":null,"abstract":"Free space optical interconnects offer an exciting alternative to conventional packaging for electronic systems which uses planar board and backplane structures. The alternative, which shall be called 3D packaging, involves using the space perpendicular to the processing planes for free-space optical beams that transport the data between the planes. 3D packaging is very appealing for tightly-coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes an effort to develop the enabling technologies for these 3D systems, and to demonstrate a functional computer based on this technology. The approach is to realize the optical interconnections through the use of two-dimensional optoelectronic (smart pixel) arrays based on vertical-cavity surface-emitting laser arrays.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124260429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
A hypercube-based optical interconnection network: a solution to the scalability requirements for massively parallel computers 基于超立方体的光互连网络:大规模并行计算机可扩展性需求的解决方案
A. Louri, H. Sung
{"title":"A hypercube-based optical interconnection network: a solution to the scalability requirements for massively parallel computers","authors":"A. Louri, H. Sung","doi":"10.1109/MPPOI.1994.336636","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336636","url":null,"abstract":"An important issue in the design of interconnection networks for massively parallel computers is scalability. Size-scalability refers to the property that the number of nodes in the network can be increased with negligible effect on the existing configuration and generation-scalability implies that the communication capabilities of a network should be large enough to support the evolution of processing elements through generations. The lack of size-scalability has limited the use of certain types of interconnection networks (e.g. hypercube) in the area of massively parallel computing. The authors present a new optical interconnection network, called an Optical Multi-Mesh Hypercube (OMMH), which is both size- and generation-scalable while combining positive features of both the hypercube (small diameter, high connectivity, symmetry, simple routing, and fault tolerance) and the mesh (constant node degree and scalability) networks. Also presented is a three-dimensional optical implementation methodology of the OMMH network.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129536805","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Design considerations and algorithms for partitioning opto-electronic multichip modules 光电多芯片模块划分的设计考虑与算法
J. Fan, B. Catanzaro, V. Ozguz, Chung-Kuan Cheng, Sing H. Lee
{"title":"Design considerations and algorithms for partitioning opto-electronic multichip modules","authors":"J. Fan, B. Catanzaro, V. Ozguz, Chung-Kuan Cheng, Sing H. Lee","doi":"10.1109/MPPOI.1994.336638","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336638","url":null,"abstract":"There is considerable interest in developing optical interconnects for multi-chip modules (MCM). As a consequence, there is a basic need in developing a methodology for partitioning the system for effective utilization of the optical and electronic technologies. For the given netlist of a system design, key question to be answered is where to use optical interconnections. The authors introduce the computer aided design (CAD) approach for partitioning opto-electronic systems into opto-electronic multichip modules (OE MCM). They first discuss the design tradeoff issues in optoelectronic system design including speed, power dissipation, area and diffraction limits for free space optics. They then define a formulation for OE MCM partitioning and describe new algorithms for optimizing this partitioning based on the minimization of the power dissipation. The models for the algorithms are discussed in detail and an example of a multistage interconnect network is given. Different results, with the number and size of chips being variable, are presented where improvement for the system packaging has been observed when the partitioning algorithms are applied.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134063472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Performance evaluation of optical systems for multistage interconnection networks 多级互连网络光学系统性能评价
M. Guizani
{"title":"Performance evaluation of optical systems for multistage interconnection networks","authors":"M. Guizani","doi":"10.1109/MPPOI.1994.336624","DOIUrl":"https://doi.org/10.1109/MPPOI.1994.336624","url":null,"abstract":"Some guidelines of the performance evaluation of an all-optical architecture are presented. This basic architecture supports bursty traffic. It can be used as the switching building block far a number of interconnection networks. The power analysis of an all optical buffering architecture that can be interfaced with such an element is discussed. The performance evaluation is given in terms of the switch model, the multistage model and the power performance of the optical buffer. The architecture uses bistable optical devices such as Fabry-Perot etalons, SEED and S-SEED. A number of important issues remain to be addressed, such as the use of different nonlinear optical devices, synchronization, and modeling requirements.<<ETX>>","PeriodicalId":254893,"journal":{"name":"First International Workshop on Massively Parallel Processing Using Optical Interconnections","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121315067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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