板封装级自由空间光学器件的制造问题

First International Workshop on Massively Parallel Processing Using Optical Interconnections Pub Date : 1994-04-26 DOI:10.1109/MPPOI.1994.336612

R. Kostuk

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引用次数: 0

摘要

光学互连在电子处理系统上的成功应用需要仔细考虑使用它的电子系统;光学系统及电光器件性能;电光接口特性;用电子衬底封装微光学元件和电光器件;以及光互连的可靠性。此外，与先进的电气连接方法相比，光学系统的性能和成本必须具有竞争力。我们在电路板封装层面考虑上述几个问题，并为这些系统设计相关的光学元件

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Fabrication issues for free-space optics at the board packaging level

The successful application of optical interconnects to electronic processing systems requires careful consideration of the: electronic system in which it will be used; optical system and electro-optical device performance; electrical-electro optic interface characteristics; packaging of micro optic components and electro-optic devices with electronic substrates; and the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. We consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems.<>

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First International Workshop on Massively Parallel Processing Using Optical Interconnections

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