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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)最新文献

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Statistical approach to the EMI modeling of large ASICs by a single noise-current source 单噪声电流源对大型asic电磁干扰建模的统计方法
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250065
G. Antonini, J. Drewniak, M. Leone, A. Orlandi, V. Ricchiuti
{"title":"Statistical approach to the EMI modeling of large ASICs by a single noise-current source","authors":"G. Antonini, J. Drewniak, M. Leone, A. Orlandi, V. Ricchiuti","doi":"10.1109/EPEP.2003.1250065","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250065","url":null,"abstract":"Large and complex ASICs are source of propagating noise inside the powerbus planes. A lumped noise source model is proposed and validated by means of a statistics based method.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125342533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Transmitter and channel equalization for high-speed server interconnects 高速服务器互连的发射机和信道均衡
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250036
D. de Araujo, J. Diepenbrock, M. Cases, N. Pham
{"title":"Transmitter and channel equalization for high-speed server interconnects","authors":"D. de Araujo, J. Diepenbrock, M. Cases, N. Pham","doi":"10.1109/EPEP.2003.1250036","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250036","url":null,"abstract":"As the demand for higher performance increases the operating frequencies, the complexity and sophistication of interface designs are increased to enable operation of high speed links in imperfect, lossy, and cost competitive environments. This paper investigates three equalization methods for high speed differential serial links: transmitter equalization, discrete equalization, and distributed cable equalization. The performance, advantages, and tradeoffs among the methods is examined.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121494976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Hybrid method for frequency-dependent lossy coupled transmission line characterization and modeling 频率相关损耗耦合传输线特性与建模的混合方法
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250040
Joong-Ho Kim, Dong-ho Han
{"title":"Hybrid method for frequency-dependent lossy coupled transmission line characterization and modeling","authors":"Joong-Ho Kim, Dong-ho Han","doi":"10.1109/EPEP.2003.1250040","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250040","url":null,"abstract":"This paper presents a hybrid method that combines measurements, electromagnetic (EM) numerical tools, and extrapolation techniques for accurate modeling of lossy multi-transmission lines over tens of gigahertz (GHz) ranges. The parameters of the RLGC model are made up of the frequency-dependent characteristic impedance and the propagation constant, which are de-embedded from measured scattering (S) matrices of two transmission lines of different lengths and an extrapolation technique. By combining the extracted RLGC parameters with an EM tool, the relative permittivity and loss tangent of a dielectric substrate and the effective conductivity of a conductor for considering the surface resistivity due to skin effect and surface roughness are determined accurately. Multiconductor transmission lines are simulated using tabular W-element models based on frequency-dependent RLGC parameters.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124428188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
On the behavioral modeling of integrated circuit output buffers 集成电路输出缓冲器的行为建模
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250050
I. Stievano, F. Canavero, I. Maio
{"title":"On the behavioral modeling of integrated circuit output buffers","authors":"I. Stievano, F. Canavero, I. Maio","doi":"10.1109/EPEP.2003.1250050","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250050","url":null,"abstract":"The properties of common behavioral macromodels for single ended CMOS integrated circuits output buffers are discussed with the aim of providing criteria for an effective use of possible modeling options.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127073706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements 用s参数测量法确定与芯片测试线路结构相关的产品上与频率相关的传输线参数
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250008
T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink
{"title":"Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements","authors":"T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink","doi":"10.1109/EPEP.2003.1250008","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250008","url":null,"abstract":"The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117017422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Impact of high impedance mid-frequency noise on power delivery 高阻抗中频噪声对电力输送的影响
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250014
H. Tsai
{"title":"Impact of high impedance mid-frequency noise on power delivery","authors":"H. Tsai","doi":"10.1109/EPEP.2003.1250014","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250014","url":null,"abstract":"In this paper, we present the core switching noise analysis of the power distribution system (PDS) for a signal processor on a card. The SPEED2000, a SPICE and full-wave based simulation tool is used to study the frequency and transient responses of the core switching noise. The correlation between the result in frequency domain and time domain is discussed in detail. The frequency responses of the on-chip switching current and package current are introduced to illustrate that the noise level caused by the high impedance of the PDS is also frequency dependent.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131170643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Notes on polynomial selection for piecewise polynomial model order reduction [nonlinear systems] 分段多项式模型降阶的多项式选择注记[非线性系统]
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250026
I. Balk
{"title":"Notes on polynomial selection for piecewise polynomial model order reduction [nonlinear systems]","authors":"I. Balk","doi":"10.1109/EPEP.2003.1250026","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250026","url":null,"abstract":"Modern trends in simulation of large microelectronics systems has introduced the necessity for development of fast and robust nonlinear model order algorithms. This paper discusses polynomial selection in conjunction with piecewise polynomial model order reduction. The advantage of mean value convergence over pointwise convergence is shown in respect to input function expansion.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"190 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124215937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Modeling of non-ideal planes in stripline structures 带状线结构中非理想平面的建模
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250042
A. Engin, W. John, G. Sommer, W. Mathis
{"title":"Modeling of non-ideal planes in stripline structures","authors":"A. Engin, W. John, G. Sommer, W. Mathis","doi":"10.1109/EPEP.2003.1250042","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250042","url":null,"abstract":"A multiconductor transmission line model for stripline structures is derived, which can represent the interaction between the signal lines and the power planes. The advantages of the proposed model over an existing alternative model are discussed.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114224448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids 片上互连线与底层正交金属网格的色散和共振
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250011
Pingshan Wang, E. Kan
{"title":"Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids","authors":"Pingshan Wang, E. Kan","doi":"10.1109/EPEP.2003.1250011","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250011","url":null,"abstract":"High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130609816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters 基于s参数的片上互连高频串扰仿真实验验证
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI: 10.1109/EPEP.2003.1250061
M. Kobrinsky, S. Chakravarty, D. Jiao, M. Harmes, S. List, M. Mazumder
{"title":"Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters","authors":"M. Kobrinsky, S. Chakravarty, D. Jiao, M. Harmes, S. List, M. Mazumder","doi":"10.1109/EPEP.2003.1250061","DOIUrl":"https://doi.org/10.1109/EPEP.2003.1250061","url":null,"abstract":"Since advanced microprocessors are designed based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and fullwave simulation tools, for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the trade-offs between accuracy and computation expenses for a large variety of cases.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132361301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
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