基于s参数的片上互连高频串扰仿真实验验证

M. Kobrinsky, S. Chakravarty, D. Jiao, M. Harmes, S. List, M. Mazumder
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引用次数: 19

摘要

由于先进的微处理器是基于仿真工具设计的,因此准确评估串扰噪声的数量对于避免逻辑故障和非最佳设计至关重要。随着时钟频率的增加,感应效应变得更加重要,而通常在仿真工具和方法中使用的假设的有效性尚不清楚。我们将精确的实验s参数与磁准静态和全波模拟工具得出的结果进行了比较,在并联和正交导体存在的情况下,具有各种电容和电感耦合的简单串扰结构。我们的验证方法使识别这两种工具作为频率函数的优缺点成为可能,这为必须在各种情况下在准确性和计算费用之间进行权衡的设计人员提供了有用的指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters
Since advanced microprocessors are designed based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and fullwave simulation tools, for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the trade-offs between accuracy and computation expenses for a large variety of cases.
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