发布求助
文献互助 智能选刊 最新文献

1975 EIC 12th Electrical/Electronics Insulation Conference最新文献

筛选
英文 中文
Development and application of a new semiconductive glaze insulator 新型半导釉绝缘子的研制与应用
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1978-11-01 DOI: 10.1109/TPAS.1978.354715
O. Nigol, E. Cherney
{"title":"Development and application of a new semiconductive glaze insulator","authors":"O. Nigol, E. Cherney","doi":"10.1109/TPAS.1978.354715","DOIUrl":"https://doi.org/10.1109/TPAS.1978.354715","url":null,"abstract":"A new semiconductive glaze insulator with superior glaze and greatly improved contamination performance has been developed for use in vertical and V-string positions. This insulator makes it possible to convert many existing lines to operation at higher voltages and to design new lines with greatly reduced tower head dimensions.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1978-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123611862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Automotive electronic system packaging techniques 汽车电子系统封装技术
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458488
Michał Idzikowski
{"title":"Automotive electronic system packaging techniques","authors":"Michał Idzikowski","doi":"10.1109/EIC.1975.7458488","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458488","url":null,"abstract":"It has been seen that the requirements of various automotive electronic systems can dictate distinct packaging approaches. The Theft Deterrent and Lamp Monitor systems required low cost and ease of assembly into the vehicle. In addition, because they are optional systems, the fewer deviations from the standard build sequence the better. Thus electronic modules integrated into wiring assemblies were employed. In the Seat Belt/Starter Interlock system, the logistics of part supply and concern for ruggedness were of prime importance. Thus a separate package relatively impervious to assembly plant handling was employed.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"69 9","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121001762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluating wire and cable components with thermal analysis 用热分析评估电线电缆组件
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458500
C. Houchins
{"title":"Evaluating wire and cable components with thermal analysis","authors":"C. Houchins","doi":"10.1109/EIC.1975.7458500","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458500","url":null,"abstract":"Figures I through 6 illustrate typical thermal characteristics of some wire and cable components. Each material used in the many wire constructions has a normal pattern for a thermogram. Some materials, like polyethylene, show very marked thermal changes when internal transitions such as melting occur. Other materials, including a few types of rubber, require careful technique and high instrument sensitivity to detect transition during a thermal scan. When a transition pattern for a given material is not as expected, it may give very useful information about a cure or compounding problem. Other test or analytical tools may be needed to resolve a problem, but thermal analysis provides an excellent source of evaluation data for many materials.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121016174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Epoxy insulated 150 kV BIL outdoor bushing cooled by refluxing fluid 用回流液冷却的环氧绝缘150kv BIL室外套管
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458528
G. Cushing, F. J. Kolano
{"title":"Epoxy insulated 150 kV BIL outdoor bushing cooled by refluxing fluid","authors":"G. Cushing, F. J. Kolano","doi":"10.1109/EIC.1975.7458528","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458528","url":null,"abstract":"A 150 kV BIL bushing construction combining reflux cooling and epoxy insulation provides 6 kA continuous-current capability and mechanical durability within the confines of dimensions common to lower ratings.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124980474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Why the melting point of a plastic is not a material constant 为什么塑料的熔点不是一个物质常数
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458561
P. Holdsworth
{"title":"Why the melting point of a plastic is not a material constant","authors":"P. Holdsworth","doi":"10.1109/EIC.1975.7458561","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458561","url":null,"abstract":"1. The melting point of a plastic is a variable quantity. It is determined primarily by the conditions under which it crystallises or is annealed.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125877306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Flammability testing of dry type transformer insulating materials 干式变压器绝缘材料的可燃性试验
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458532
B. Vanwert, T. Orbeck
{"title":"Flammability testing of dry type transformer insulating materials","authors":"B. Vanwert, T. Orbeck","doi":"10.1109/EIC.1975.7458532","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458532","url":null,"abstract":"The test results show that silicone resin impregnated glass-cloth and Aramid tapes have a higher Oxygen Index rating, less tendency to spread fire and develop less smoke than polyester or epoxy resins with silicone resin impregnants, the full fire resistant characteristics of the glass-cloth and Aramid paper can be utilized.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125422182","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improved one piece SMA hermetically sealed launcher 改进的单件式SMA密封发射器
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458507
Roger P. Avery, H. G. Hutter
{"title":"Improved one piece SMA hermetically sealed launcher","authors":"Roger P. Avery, H. G. Hutter","doi":"10.1109/EIC.1975.7458507","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458507","url":null,"abstract":"An hermetically sealed launcher (Figure 1) is intended to join planar circuit structures (microstripline) inside a microwave enclosure to standard coaxial connectors/cable outside the enclosure. Many microwave integrated circuit (MIC) components are deposited on the planar circuit structures without individual protection. Therefore, the entire planar circuit structure must be sealed from the ambient environments since these environments could degrade the performance of the MIC components. An hermetically scaled package is used to protect the circuit structure, necessitating hermetically sealed coaxial connectors (launchers) to permit connection of external microwave transmission lines.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126605807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A new family of cycloaliphatic epoxy resins for electrical insulation 电绝缘用环脂肪族环氧树脂新家族
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458554
T. Kimura, M. Tokizawa, S. Nishizaki, H. Teratani
{"title":"A new family of cycloaliphatic epoxy resins for electrical insulation","authors":"T. Kimura, M. Tokizawa, S. Nishizaki, H. Teratani","doi":"10.1109/EIC.1975.7458554","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458554","url":null,"abstract":"1. A new family of the cycloaliphatic epoxy resins were derived and developed from derivatives of butadiene. These resins offer lower toxicity due to lower vapor pressures of the liquid resin components.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114185878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solventless enamels-development & evaluation 无溶剂搪瓷-开发与评价
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458551
W. L. Martin
{"title":"Solventless enamels-development & evaluation","authors":"W. L. Martin","doi":"10.1109/EIC.1975.7458551","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458551","url":null,"abstract":"Although there have been no major changes or innovations in production methods for enameling magnet wire in recent years, many organic solvents change almost with the cycle of the moon, and has generated many difficulties not only in deliveries but also budget forecasts. Solvent removal from conventional wire enamel solutions along with incineration are important factors in manufacturing and pollution control costs.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128442001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A new component for insulation systems 一种用于绝缘系统的新元件
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458514
H. C. Lauroesch, R. S. Armstrong
{"title":"A new component for insulation systems","authors":"H. C. Lauroesch, R. S. Armstrong","doi":"10.1109/EIC.1975.7458514","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458514","url":null,"abstract":"While the electrical insulation industry has been fortunate in the number and quality of new material developments over the past several decades, (epoxies, silicones and polyimides to name a few) most material and product improvements have been a series of minor changes. One of the more recent steps in this evolution has been the development and commercial adoption of “GEMAT,”* a composite of a bonded and relatively thin glass mat with reinforcement of glass yarns, cloth or organic film. The glass mat alone is of limited value, but can be readily incorporated into a wide variety of composite structures used in the electrical industry.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128248707","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信