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1975 EIC 12th Electrical/Electronics Insulation Conference最新文献

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Technological requirements for portable thick film hybrid devices 便携式厚膜混合装置的技术要求
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458485
A. Kocsis, A. Leroux, S. Richard, G. Aube, J. Aucouturier
{"title":"Technological requirements for portable thick film hybrid devices","authors":"A. Kocsis, A. Leroux, S. Richard, G. Aube, J. Aucouturier","doi":"10.1109/EIC.1975.7458485","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458485","url":null,"abstract":"This paper primarily comprises excerpts of the work done under our regular undergraduate teaching program. The material is organized into subject groupings with the intention of presenting in convenient form sufficient information for making high quality thick film portable devices. The work emphasizes problems and methods of solving the construction of a thick film digital wrist-watch prototype, using a new PtAg. ink and a novel procedure to fabricate thick film multilayer structures with unusually high line densities associated with increased yield as compared with previously known methods.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127593623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A hydrostatic model of solder fillets part I: Axisymmetric model 焊料圆角的流体静力模型第一部分:轴对称模型
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458483
T. Y. Chu
{"title":"A hydrostatic model of solder fillets part I: Axisymmetric model","authors":"T. Y. Chu","doi":"10.1109/EIC.1975.7458483","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458483","url":null,"abstract":"Despite its wide use and long history as a metal joining technique, soldering until today remains as much an art as a science. Although there are some general characteristics that can be used to describe a good solder joint or fillet, no precise definition of a good solder fillet exists. With the increasing application of mass soldering methods for manufacturing large numbers of identical parts, it becomes desirable to have a precise definition of a good solder fillet. Such information would be useful in quality control and component design and it would also contribute to the basic understanding of soldering. An analytical model based on the balance of surface tension and pressure forces in solder at the molten state is formulated to predict fillet shapes. The paper deals mainly with the fillet formed by a pin and the land area of a plated-through-hole. The model can also be adopted to other geometries.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115853037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A new mathematical approach to minimum builds and other dimensions of magnet wire 一种求解磁线最小尺寸及其它尺寸的新数学方法
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458550
E. A. Mol
{"title":"A new mathematical approach to minimum builds and other dimensions of magnet wire","authors":"E. A. Mol","doi":"10.1109/EIC.1975.7458550","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458550","url":null,"abstract":"This new dimensional proposal for magnet wire is intended for use at the time conversion to the SI (metric) system will, by industry consent, take place. It contains elements of present NEMA and IEC standards and makes extensive use of the simplifying features of the preferred number series and power law relationships between the conductor diameter and derived dimensions (builds) and properties (dielectric breakdown strength).","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131987920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Monolithic integrated circuit interface series for gas discharge displays 气体放电显示单片集成电路接口系列
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458491
P. Emerald
{"title":"Monolithic integrated circuit interface series for gas discharge displays","authors":"P. Emerald","doi":"10.1109/EIC.1975.7458491","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458491","url":null,"abstract":"Display technology has recently developed at a rapid rate-largely due to the phenominal growth of the calculator market. Planar gas discharge displays offer an excellent combination of low cost, large character size, high reliability, multiplexing capability, aesthetics, etc. but have been held back by the lack of an available inexpensive interface. The gas discharge display is a long way from obscurity, and the availability of the Series UDN-6100 digit drivers and the Series UDN-7100 segment drivers should open up new areas while satisfying the needs of existing applications as well.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132114279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A flame resistant, high temperature, cross-linked wire insulation system 一种耐燃、耐高温、交联导线绝缘系统
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458524
N. Hildreth
{"title":"A flame resistant, high temperature, cross-linked wire insulation system","authors":"N. Hildreth","doi":"10.1109/EIC.1975.7458524","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458524","url":null,"abstract":"For many years the wire industry has worked to upgrade the high temperature performance of low-cost insulating materials. One technique that has been developed is cross-linking by irradiation. Introduced 21 years ago, the irradiation process is a simple one. After the thermoplastic compound is extruded onto wire, it is exposed to high energy electrons from an electron accelerator. The energy from the fast moving electrons is intense enough to change the chemical structure of many materials. In a properly formulated polymer system this change can cause extensive cross-linking and even change a thermoplastic to an insoluble, infusible thermosetting plastic.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115564240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Insulating GFRP, bolted joints and their use at very low temperatures 绝缘GFRP，螺栓连接及其在极低温下的使用
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458544
H. Fuchs
{"title":"Insulating GFRP, bolted joints and their use at very low temperatures","authors":"H. Fuchs","doi":"10.1109/EIC.1975.7458544","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458544","url":null,"abstract":"1. Glass fiber reinforced epoxy resins are suitable for the construction of insulating, anti-magnetic, load-bearing parts, not only for higher temperatures in class F, but also for immersion in cryogenic liquids.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117068731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
V.P.I. of random wound motors 随机绕线电机的V.P.I.
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458521
L. J. Rejda
{"title":"V.P.I. of random wound motors","authors":"L. J. Rejda","doi":"10.1109/EIC.1975.7458521","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458521","url":null,"abstract":"Why impregnate? What are the primary functions of an impregnant for random wound motors? From an insulation or dielectric viewpoint the turn to turn and ground insulation is provided by the enamel on the magnet wire and the cell liner.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"103 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123523774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electrostatic fluid bed application a process to apply integral insulation 静电流化床应用是应用整体绝缘的过程
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458509
David J. Baratto
{"title":"Electrostatic fluid bed application a process to apply integral insulation","authors":"David J. Baratto","doi":"10.1109/EIC.1975.7458509","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458509","url":null,"abstract":"The versatility of the use of powdered resins has been demonstrated in a variety of commercially accepted applications. The major areas of use can be categorized into three market areas (1) metal finishing or decorative (2) corrosion protection and (3) electrical insulation. In all three market areas, the types of powdered resin used, thermoplastics or thermosetting, are dependent upon the end use requirements.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"38 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123603916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Water soluble electrical insulating varnishes & coatings 水溶性电绝缘清漆和涂料
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458548
G. B. Fleeson
{"title":"Water soluble electrical insulating varnishes & coatings","authors":"G. B. Fleeson","doi":"10.1109/EIC.1975.7458548","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458548","url":null,"abstract":"A comparison of the thermal ratings, chemical resistance, physical characteristics, wire enamel compatibility and application techniques between water soluble and organic solvent type insulating varnishes and coatings is presented. The benefits to be realized from the use of these non-dispersion or non-emulsion type varnishes and coatings in the areas of reduced air pollution and fire hazard are also discussed.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124012281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High performance composite insulation for magnet wire based on electrodeposition 基于电沉积的高性能磁线复合绝缘材料
1975 EIC 12th Electrical/Electronics Insulation Conference Pub Date : 1975-11-01 DOI: 10.1109/EIC.1975.7458546
K. Shibayama, F. Sato, Y. Hirakoa
{"title":"High performance composite insulation for magnet wire based on electrodeposition","authors":"K. Shibayama, F. Sato, Y. Hirakoa","doi":"10.1109/EIC.1975.7458546","DOIUrl":"https://doi.org/10.1109/EIC.1975.7458546","url":null,"abstract":"We have developed high performance composite insulations for e1ectrodeposition magnet wire by introducing a dual coating technique.","PeriodicalId":250579,"journal":{"name":"1975 EIC 12th Electrical/Electronics Insulation Conference","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1975-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129392822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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