International Conferencre on Simulation of Semiconductor Processes and Devices最新文献

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Characterization of multi-barrier tunneling diodes and vertical transistors using 2-D device simulation 多势垒隧道二极管和垂直晶体管的二维器件仿真表征
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034543
Kwan-Do Kim, Keun-Ho Lee, Seungjae Baik, Jun-Ha Lee, Tai-kyung Kim, J. Kong
{"title":"Characterization of multi-barrier tunneling diodes and vertical transistors using 2-D device simulation","authors":"Kwan-Do Kim, Keun-Ho Lee, Seungjae Baik, Jun-Ha Lee, Tai-kyung Kim, J. Kong","doi":"10.1109/SISPAD.2002.1034543","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034543","url":null,"abstract":"A novel memory cell which adopts a floating gate device with the writing mechanism of direct tunneling through the multiple tunnel junction(MTJ) was proposed recently. The device is known to have potential advantages of scalability, high density, high speed, long data retention time, low voltage operation, low power consumption and good endurability. Characterization and optimization of the vertical transistor with MTJ enables the construction of a novel high-density memory with high speed writing and long data retention time. This paper presents a numerical analysis of the tunnel barriers in explaining I-V characteristics of the vertical transistor. We have characterized the vertical transistor with double and triple barriers from the point of view of the central barrier. We have also performed extensive 2-D device simulation for multi barrier tunneling diodes and vertical transistors with various device parameters. Results of the present analysis are expected to provide guidelines for designing the experiments for optimal transistor fabrications.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130948330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A new non-pair diffusion based dopant pile-up model for process designers and its prediction accuracy 一种新的基于非对扩散的工艺设计掺杂堆积模型及其预测精度
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034553
H. Hayashi, N. Miura, H. Komatsubara, M. Mochizuki, K. Fukuda
{"title":"A new non-pair diffusion based dopant pile-up model for process designers and its prediction accuracy","authors":"H. Hayashi, N. Miura, H. Komatsubara, M. Mochizuki, K. Fukuda","doi":"10.1109/SISPAD.2002.1034553","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034553","url":null,"abstract":"This paper describes an effective model which reproduces the dopant pile-up in the Si/SiO/sub 2/ interface using a conventional process simulator that solves one equation for each impurity. The proposed model is based on the physics where the key factor of RSCE is the dopant pile-up in the Si/SiO/sub 2/ interface. The capability of the model is investigated though the comparison to measurements in actual fabricated nMOSFETs for different process technologies.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114266518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel CDM-like discharge effect during human body model (HBM) ESD stress 人体模型(HBM)静电放电时的一种新型cdm样放电效应
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034530
V. Axelrad, Y. Huh, J.W. Chen, P. Bendix
{"title":"A novel CDM-like discharge effect during human body model (HBM) ESD stress","authors":"V. Axelrad, Y. Huh, J.W. Chen, P. Bendix","doi":"10.1109/SISPAD.2002.1034530","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034530","url":null,"abstract":"Interactions between ESD protection devices and other components of a chip can lead to complex and not easily anticipated discharge behaviour. Triggering of a protection MOSFET is equivalent to the closing of a fast switch and can cause substantial transient discharge currents. The peak value of this current depends on the chip capacitance, resistance, properties of the protection clamp, etc. Careful optimization of the protection circuit is therefore necessary to avoid current overstress and circuit failure.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121266986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Monte Carlo simulation of electron transport in a carbon nanotube 碳纳米管中电子输运的蒙特卡罗模拟
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034572
G. Pennington, N. Goldsman
{"title":"Monte Carlo simulation of electron transport in a carbon nanotube","authors":"G. Pennington, N. Goldsman","doi":"10.1109/SISPAD.2002.1034572","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034572","url":null,"abstract":"We use the Monte Carlo method to simulate electron transport in a zig-zag single-walled carbon nanotube with a wrapping index of n=10. Results show large low-field mobility, negative differential mobility, and large peaks in the drift velocity reaching 3/spl times/10/sup 7/ cm/s.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125664569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Ensemble Monte Carlo/molecular dynamics simulation of inversion layer mobility in Si MOSFETs - effects of substrate impurity Si mosfet中反转层迁移率的集合蒙特卡罗/分子动力学模拟——衬底杂质的影响
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034508
Y. Kamakura, H. Ryouke, K. Taniguchi
{"title":"Ensemble Monte Carlo/molecular dynamics simulation of inversion layer mobility in Si MOSFETs - effects of substrate impurity","authors":"Y. Kamakura, H. Ryouke, K. Taniguchi","doi":"10.1109/SISPAD.2002.1034508","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034508","url":null,"abstract":"Electron transport in bulk Si and MOSFET inversion layers is studied using an ensemble Monte Carlo (EMC) technique coupled with the molecular dynamics (MD) method. The Coulomb interactions among point charges (electrons and negative ions) are directly taken into account in the simulation. It is demonstrated that the static screening of Coulomb interactions is correctly simulated by the EMC/MD method. Furthermore, we calculate the inversion layer mobility in Si MOSFETs, and mobility roll-off near the threshold voltage is observed by the present approach.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124434169","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Enhanced advancing front Delaunay meshing in TCAD 在TCAD中增强了推进前Delaunay网格
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-11-07 DOI: 10.1109/SISPAD.2002.1034526
P. Fleischmann, S. Selberherr
{"title":"Enhanced advancing front Delaunay meshing in TCAD","authors":"P. Fleischmann, S. Selberherr","doi":"10.1109/SISPAD.2002.1034526","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034526","url":null,"abstract":"New developments of the advancing front Delaunay mesher deLink are presented. The motivation for the advancing front Delaunay method and its differences compared to the in three dimensions commonly used incremental Delaunay algorithm are shortly discussed. A new element quality assessment with regard to anisotropy and so called \"flat tets\" or slivers is proposed.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128994044","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Simulation of a "Well Tempered" SOI MOSFET using an enhanced hydrodynamic transport model 利用增强型流体动力输运模型模拟“良好回火”SOI MOSFET
International Conferencre on Simulation of Semiconductor Processes and Devices Pub Date : 2002-09-04 DOI: 10.1109/SISPAD.2002.1034550
M. Gritsch, H. Kosina, Tibor Grasser, Siegfried Selberherr
{"title":"Simulation of a \"Well Tempered\" SOI MOSFET using an enhanced hydrodynamic transport model","authors":"M. Gritsch, H. Kosina, Tibor Grasser, Siegfried Selberherr","doi":"10.1109/SISPAD.2002.1034550","DOIUrl":"https://doi.org/10.1109/SISPAD.2002.1034550","url":null,"abstract":"Anomalous output characteristics are observed in hydrodynamic simulations of partially depleted SOI MOSFETs. The effect that the drain current reaches a maximum and then decreases is peculiar to the hydrodynamic transport model. It is not observed in drift-diffusion simulations and its occurrence in measurements is questionable. An explanation of the cause of this effect is given, and a solution is proposed by modifying the hydrodynamic transport model. Successful simulations of different SOI Devices including a \"Well Tempered\" SOI MOSFET are presented.","PeriodicalId":249609,"journal":{"name":"International Conferencre on Simulation of Semiconductor Processes and Devices","volume":"349 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115301174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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