Proceedings of the 9th International Symposium on Networks-on-Chip最新文献

筛选
英文 中文
Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC 3D-NoC精确系统级tsv - tsv电容耦合故障模型
Proceedings of the 9th International Symposium on Networks-on-Chip Pub Date : 2015-09-28 DOI: 10.1145/2786572.2786598
Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, N. Bagherzadeh
{"title":"Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC","authors":"Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, N. Bagherzadeh","doi":"10.1145/2786572.2786598","DOIUrl":"https://doi.org/10.1145/2786572.2786598","url":null,"abstract":"TSV-based 3D-NoC has been introduced as a viable solution for integrating more cores on a chip, while imposing smaller footprint area and better timing performance as compared to 2D-NoC. However, TSV-to-TSV coupling is increasingly impacting the reliability of 3D-NoCs due to large size of TSVs. Addressing this issue, various resilient approaches have been recently proposed. But they have been evaluated by uniform random distributions fault modelling, which results in 26%-99% inaccuracy. We propose a system-level TSV-to-TSV coupling fault model that models the capacitive coupling effect, considering thermal impact, with circuit-level accuracy. This model can be plugged into any system-level TSV-based 3D-NoC simulator. It is also capable of identifying faulty TSV bundles and evaluating the efficiency of alternative resilient TSV-based 3D-NoC designs at the system-level.","PeriodicalId":228605,"journal":{"name":"Proceedings of the 9th International Symposium on Networks-on-Chip","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132841190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Proceedings of the 9th International Symposium on Networks-on-Chip 第九届片上网络国际研讨会论文集
Proceedings of the 9th International Symposium on Networks-on-Chip Pub Date : 1900-01-01 DOI: 10.1145/2786572
{"title":"Proceedings of the 9th International Symposium on Networks-on-Chip","authors":"","doi":"10.1145/2786572","DOIUrl":"https://doi.org/10.1145/2786572","url":null,"abstract":"","PeriodicalId":228605,"journal":{"name":"Proceedings of the 9th International Symposium on Networks-on-Chip","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126552474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信