InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88最新文献_第4页

Thermal advantages of a new microcircuit configuration 一种新型微电路结构的热优势

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI: 10.1109/ITHERM.1988.28674

T. D. Pestorius, V. Gregory, A. Kraus

引用次数: 1

Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch 热失配载荷作用下板-通孔结构的数学模型

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI: 10.1109/ITHERM.1988.28680

B. Mirman

引用次数: 4

Unsteady heat transfer near a bluff body in contact with a moving wall 与运动壁面接触的钝体附近的非定常传热

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI: 10.1109/ITHERM.1988.28696

M. Arnal, D. Goering, J. Humphrey

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引用次数: 0

Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation 氮化硼填充环氧树脂的导热性:温度依赖性及样品制备的影响

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI: 10.1109/ITHERM.1988.28676

P. Bujard

引用次数: 48