Thermal advantages of a new microcircuit configuration

Abstract

A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well.<>