{"title":"热失配载荷作用下板-通孔结构的数学模型","authors":"B. Mirman","doi":"10.1109/ITHERM.1988.28680","DOIUrl":null,"url":null,"abstract":"A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch\",\"authors\":\"B. Mirman\",\"doi\":\"10.1109/ITHERM.1988.28680\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented.<<ETX>>\",\"PeriodicalId\":226424,\"journal\":{\"name\":\"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.1988.28680\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28680","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch
A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented.<>