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Testing, a major concern for VLSI 测试是VLSI的主要关注点
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(84)90126-4
M. Graf
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引用次数: 1
Electron-beam customization repair, and testing of wafer-scale circuits 电子束定制修复和晶圆级电路测试
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(84)91023-0
D. Shaver
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引用次数: 6
Multilevel metallization device structures and process options 多层金属化装置结构和工艺选择
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(85)90145-3
S. Mastroianni
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引用次数: 8
Automated inspection of wafer patterns with applications in stepping, projection and direct write lithography 用于步进、投影和直写光刻的晶圆图案自动检测
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(84)91021-7
K. Harris, P. Sandland, R. M. Singleton
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引用次数: 26
Influence of DC bias sputtering during aluminium metallization 铝金属化过程中直流偏压溅射的影响
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(84)90143-4
J. Smith
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引用次数: 12
MeV implantation for silicon device fabrication 用于硅器件制造的MeV注入
Solid State Technology Pub Date : 1984-01-01 DOI: 10.1016/0026-2714(85)90173-8
D. Pramanik, M. Current
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引用次数: 37
Pinhole array capacitor for oxide integrity analysis 用于氧化物完整性分析的针孔阵列电容器
Solid State Technology Pub Date : 1983-11-01 DOI: 10.1016/0026-2714(84)90369-x
M. Buehler, B. Blaes, C. Piña, T. Griswold
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引用次数: 24
Bake effects in positive photoresist 正极光刻胶的烘烤效应
Solid State Technology Pub Date : 1983-01-01 DOI: 10.1016/0026-2714(84)90567-5
T. Batchelder, J. Piatt
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引用次数: 14
Quality solder poste systems for use in microelectronic applications 用于微电子应用的高质量焊点系统
Solid State Technology Pub Date : 1983-01-01 DOI: 10.1016/0026-2714(84)90344-5
R. Anjard
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引用次数: 28
Principles of laser scanning for defect and contamination detection in microfabrication 微细加工中缺陷和污染的激光扫描检测原理
Solid State Technology Pub Date : 1983-01-01 DOI: 10.1016/0026-2714(84)90436-0
P. Gise
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引用次数: 1
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