{"title":"面向FC-BGA的增层胶膜封装基板镀铜工艺","authors":"Peng Li, Junyi Yu, Suibin Luo, Zhiqiang Lai, Bin Xiao, Shuhui Yu, Rong Sun","doi":"10.1360/ssc-2023-0130","DOIUrl":"https://doi.org/10.1360/ssc-2023-0130","url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"SCIENTIA SINICA Chimica","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135011112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0