{"title":"面向FC-BGA的增层胶膜封装基板镀铜工艺","authors":"Peng Li, Junyi Yu, Suibin Luo, Zhiqiang Lai, Bin Xiao, Shuhui Yu, Rong Sun","doi":"10.1360/ssc-2023-0130","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"中国科学(化学)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"中国科学(化学)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1360/ssc-2023-0130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Chemistry","Score":null,"Total":0}
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