2007 IEEE Workshop on Signal Propagation on Interconnects最新文献

Fast calculation of PEEC macromodels using frequency derivatives 使用频率导数快速计算PEEC宏模型

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512253

D. Deschrijver, G. Antonini, T. Dhaene

引用次数: 0

Spice-accurate systemC macromodels of noisy on-chip communication channels 片上噪声通信信道的精确系统宏模型

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512195

N. Terrassan, D. Bertozzi, A. Bogliolo

引用次数: 4

Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system 从二氧化硅到超低 K 电介质和空气间距的引入在互连性能方面的优势比较，适用于未来多耦合线路系统中的高速 Ic

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512199

F. Ponchel, J. Legier, E. Paleczny, C. Seguinot, D. Deschacht

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引用次数: 0

Fundamentals of a 3-D “snowball” model for surface roughness power losses 三维“雪球”模型的基本原理，表面粗糙度功率损失

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512227

P. Huray, S. Hall, S. Pytel, F. Oluwafemi, R. Mellitz, D. Hua, Peng Ye

引用次数: 61

Skew and EMI management in differential microstrip lines up to 15GHz 高达15GHz的差分微带线的歪斜和EMI管理

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512247

M. Burford, P. Levin, T. Kazmierski

引用次数: 6

Evaluation of the propagation constants of differential PCB interconnections 差分PCB互连传播常数的评估

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512251

V. Ricchiuti, A. Orlandi, G. Antonini

引用次数: 1

Electromagnetic coupling analysis of high density bent interconnects 高密度弯曲互连的电磁耦合分析

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512254

S. Ghosh, A. Roy, A. Chakrabarty

引用次数: 0

Coupling and signal propagation model of multimode waveguides with rough core-cladding interfaces 粗糙芯包层界面多模波导的耦合与信号传播模型

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512229

K. Halbe, I. Roda, E. Griese

引用次数: 0

Characterization of flexible interconnects in mobile devices 移动设备中柔性互连的特性

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512225

P. Kotiranta, I. Kelander, M. Rouvala, J. Takaneva

引用次数: 5

Toward a systematic sensitivity analysis of on-chip power grids using factor analysis 用因子分析法对片上电网进行系统的灵敏度分析

2007 IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2007-05-13 DOI: 10.1109/SPI.2007.4512237

D. Andersson, L. Svensson, P. Larsson-Edefors

引用次数: 2