Fundamentals of a 3-D “snowball” model for surface roughness power losses

P. Huray, S. Hall, S. Pytel, F. Oluwafemi, R. Mellitz, D. Hua, Peng Ye
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引用次数: 61

Abstract

SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D "snowball" structure of copper surface distortions. We have developed an analytical basis for the electromagnetic scattering by the copper "snowballs" to predict additional power losses to those presented by the propagating medium that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3D scattering theory of our analysis.
三维“雪球”模型的基本原理,表面粗糙度功率损失
PCB工业制备的典型铜导体的SEM照片显示出铜表面扭曲的3-D“雪球”结构。我们已经开发了铜“雪球”电磁散射的分析基础,以预测传播介质所呈现的额外功率损耗,与一组粗糙微带线的观察测量结果相比较。在本文中,我们描述了与我们分析的三维散射理论有关的基本概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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