2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Advanced analysis for separation of ambient and device under test emission for in-situ measurements 用于现场测量的环境和被测装置发射分离的先进分析
T. Gross, J. Medler
{"title":"Advanced analysis for separation of ambient and device under test emission for in-situ measurements","authors":"T. Gross, J. Medler","doi":"10.1109/emcsi38923.2020.9191454","DOIUrl":"https://doi.org/10.1109/emcsi38923.2020.9191454","url":null,"abstract":"Wind turbines have a strong impact on the radio environment and need to be tested for electromagnetic emissions. With their size, in-situ measurements at the location of operation apply. The test engineer has to deal with a challenging environment including ambient electromagnetic emissions. The draft of IEC 61400-40 [2] standard is currently under development and deals with in-situ wind turbine measurements. The standard assumes knowledge on the present ambient emissions. This paper presents methods on how to examine those using advanced analysis methods of a real-time spectrum analyzer.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133214261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A New Tunable Damped Sine-like Waveform Generator For IEMI Applications 一种用于IEMI应用的新型可调谐阻尼正弦波形发生器
O. Izadi, R. K. Frazier, N. Altunyurt, Sahra Sedighsarvestani, D. Pommerenke, C. Hwang
{"title":"A New Tunable Damped Sine-like Waveform Generator For IEMI Applications","authors":"O. Izadi, R. K. Frazier, N. Altunyurt, Sahra Sedighsarvestani, D. Pommerenke, C. Hwang","doi":"10.1109/EMCSI38923.2020.9191504","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191504","url":null,"abstract":"An experimental generator is presented, which can produce a damped sine-like current waveform for intentional electromagnetic interference (IEMI) studies. The generator is based on an air-filled parallel plate transmission line and is capable of generating an electric field strength in the skilled technical category of IEC61000-4-36 standard. Compared to available generators in this category, the proposed generator is simpler yet more versatile in terms of controlling the pulse amplitude; it can generate a field strength from 0 to ∼230 kV/m between its plates, with a 34-kV charge voltage. The operating frequency can also be changed by altering the length of the transmission line. A circuit model is created for the setup to simulate the current waveform. The simulated and measured current waveforms are in agreement.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133382994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Study on Evaluation Board Requirements for Assessing Vulnerability of Cryptographic Modules to Side-Channel Attacks 评估加密模块侧信道攻击脆弱性的评估板需求研究
K. Iokibe, Tomonobu Kan, Y. Toyota
{"title":"A Study on Evaluation Board Requirements for Assessing Vulnerability of Cryptographic Modules to Side-Channel Attacks","authors":"K. Iokibe, Tomonobu Kan, Y. Toyota","doi":"10.1109/EMCSI38923.2020.9191655","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191655","url":null,"abstract":"We studied for specifying requirements for side-channel attack (SCA) vulnerability evaluation boards. SCAs are a potential threat to cryptographic modules mounted in electronics products. Cryptographic modules are required to be evaluated in terms of vulnerability by using a test board. However, no reasonable requirements for such test boards have been specified. In this paper, we investigated the signal-to-noise ratio (SNR) of side-channel leakage and the transfer impedance from the side-channel leakage source to an observation port where side-channel leakage is probed in an evaluation board. We examined two models of existing SCA vulnerability evaluation boards that implemented the Advanced Encryption Standard (AES). Results suggest that cryptographic modules need to provide SNRs of side-channel leakage greater than 2 dB for implementations of the cryptographic algorithm involving no SCA countermeasures. It is also inferred that the transfer impedance needs to satisfy two conflicting requirements. The transfer impedance should be as large as possible, considering the ease of evaluation. At the same time, the transfer impedance needs to be low enough to suppress fluctuations in the power supply voltage and guarantee evaluation in a state equivalent to the actual operating state of the IC. Coaxial connectors would be recommended to be implemented for increasing the SNR and for reproducibility of measurements.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130394388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant ($beta$) Fitting 基于单端测量和相位常数($beta$)拟合的介电材料和箔表面粗糙度提取
Shaohui Yong, V. Khilkevich, Srinath Penugonda, Xiao-Ding Cai, Qian Gao, Bidyut Sen, Han Gao, Douglas Yanagawa, Darja Padilla, S. Hinaga, J. Drewniak, J. Fan
{"title":"Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant ($beta$) Fitting","authors":"Shaohui Yong, V. Khilkevich, Srinath Penugonda, Xiao-Ding Cai, Qian Gao, Bidyut Sen, Han Gao, Douglas Yanagawa, Darja Padilla, S. Hinaga, J. Drewniak, J. Fan","doi":"10.1109/EMCSI38923.2020.9191679","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191679","url":null,"abstract":"Dielectric substrate and foil surface roughness properties of fabricated printed circuit boards (PCB) are important for high-speed channel design. Several stripline-based extraction methods have been developed to characterize dielectric relative permittivity ($varepsilon_{r}$), dielectric dissipation factor ($text{tan}delta$), and foil surface roughness correction factor ($K_{R}$) using measured S-parameters. However, the $text{tan}delta$ extraction still needs further improvement due to the difficulty in separation of dielectric and conductor loss. The authors found that the frequency-dependence of the stripline phase constant ($beta$) is helpful to determine the $text{tan}delta$ without introducing high sensitivity to foil surface roughness. By introducing a causal dielectric frequency-dependent model, $varepsilon_{r}$ and $text{tan}delta$ are extracted by fitting measured $beta$. The foil surface roughness property (correction factor $K_{R}$) is obtained using the conductor loss calculated by subtracting extracted dielectric loss from the total loss. To demonstrate the feasibility of the proposed method examples are provided using simulation data and fabricated PCB.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"132 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115901752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Measurement Investigation of MLCC Mounting Variation Impact on Acoustic Noise in Power Distribution Network MLCC安装变化对配电网噪声影响的测量研究
Yin Sun, Songping Wu, Jianmin Zhang, C. Hwang, Zhiping Yang
{"title":"Measurement Investigation of MLCC Mounting Variation Impact on Acoustic Noise in Power Distribution Network","authors":"Yin Sun, Songping Wu, Jianmin Zhang, C. Hwang, Zhiping Yang","doi":"10.1109/EMCSI38923.2020.9191464","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191464","url":null,"abstract":"The multilayer ceramic capacitors (MLCCs) mounting method impact on the MLCC induced acoustic noise in printed circuit board (PCB) is investigated through measurement. The influence of MLCC soldering stencil height, MLCC orientation and MLCC pair offset distance are evaluated on a series of test boards. The sound pressure level (SPL) is measured to evaluate the PCB acoustic noise performance. In the investigated mounting variation range, the acoustic noise performance does not exhibit noticeable changes.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1004 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116237417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effects of Various Via Patterns on Resonance and Crosstalk in High Speed Printed Circuit Boards 不同通孔模式对高速印刷电路板谐振串扰的影响
I. Park, Iftikhar Ahmed, D. Brunker, Pu Xie, Jayanthi Natarajan
{"title":"Effects of Various Via Patterns on Resonance and Crosstalk in High Speed Printed Circuit Boards","authors":"I. Park, Iftikhar Ahmed, D. Brunker, Pu Xie, Jayanthi Natarajan","doi":"10.1109/EMCSI38923.2020.9191554","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191554","url":null,"abstract":"Resonance and crosstalk due to via patterns are critical in design of high-speed multi-layer printed circuit boards (PCBs). Crosstalk causes compliance issues whereas resonance limits bandwidth. These factors can also generate jitter and as a result, degrade signal quality. In this paper, different approaches based on via patterns are proposed to minimize crosstalk and to improve resonance by varying different parameters such as via size and pitch, orthogonal and hexagonal via arrays. Results of the approaches are analyzed and evaluated in terms of crosstalk and resonance on multi-layer, high-speed printed circuit boards. A significant improvement in crosstalk, up-to 12 dB and up-to 8GHz in bandwidth is obtained.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124718074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Cross-sectional Profile Based Model for Stripline Conductor Surface Roughness 基于截面轮廓的带状线导体表面粗糙度模型
Shaohui Yong, V. Khilkevich, Yuanzhuo Liu, Ruijie He, Yuandong Guo, Han Gao, S. Hinaga, Darja Padilla, Douglas Yanagawa, J. Fan, J. Drewniak
{"title":"A Cross-sectional Profile Based Model for Stripline Conductor Surface Roughness","authors":"Shaohui Yong, V. Khilkevich, Yuanzhuo Liu, Ruijie He, Yuandong Guo, Han Gao, S. Hinaga, Darja Padilla, Douglas Yanagawa, J. Fan, J. Drewniak","doi":"10.1109/EMCSI38923.2020.9191620","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191620","url":null,"abstract":"As the data rate of high-speed digital systems is getting higher, the conductor loss can no more be modeled assuming perfectly smooth conductor surfaces for even the smoothest foils available. The Huray model, based on the analytical calculation of the additional loss due to the scattering/absorption from conductive spheres on a smooth plane, has been presented to account for this issue. However, in practice it is very difficult to determine the parameters of the model. A modeling approach relating the parameters of the model to the conductor roughness profiles is needed. In this paper an investigation of the scattering by metal hemispheres, including their interaction, is performed. A method is brought up to estimate the multi-level physical model's parameters using the scanning electron microscope (SEM) or optical cross-sectional profile imaging. Accurate modeling of the frequency-dependent conductor loss is achieved.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125041925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Wireless Communication Desense Due to Electromagnetic Shields 基于电磁屏蔽的无线通信
E. Elkhouly, M. Mohajer
{"title":"Wireless Communication Desense Due to Electromagnetic Shields","authors":"E. Elkhouly, M. Mohajer","doi":"10.1109/EMCSI38923.2020.9191536","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191536","url":null,"abstract":"EM shields are commonly used to prevent unwanted radiations and isolate the electronic devices from outside environment. In this paper, we show EM shields may cause the degradation of wireless communication performance if not carefully deigned. In the presented wireless system, the resonance frequency of EM shield is within the range of Wi-Fi communication band. The thermal pad inside the EM shield has high dielectric constant that reduces the resonance frequency from above the operating frequency band to inside the band. Also, the certain harmonic of digital clock happens to be at the resonance frequency of the EM shield. Therefore, the harmonic spur couples to Wi-Fi chains of communications through resonance of EM shield and degrades the sensitivity of Wi-Fi receivers. We will discuss the mechanism of EM coupling and how to alleviate the system performance degradation through a few mitigation techniques. The dielectric constant of the thermal pads inside the EM shield should be chosen carefully to prevent the coupling through EM shield or external radiation.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122142593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation and Mitigation of Radio Frequency Interference Caused by Weak Grounding of USB Type-C Receptacle Connector USB Type-C插座接头弱接地射频干扰的研究与缓解
Anfeng Huang, Xin Yan, Jingdong Sun, Qiaolei Huang, J. Fan, Songping Wu, Dave Zhang, Huan Liao, Shuai Jin, Zhiping Yang
{"title":"Investigation and Mitigation of Radio Frequency Interference Caused by Weak Grounding of USB Type-C Receptacle Connector","authors":"Anfeng Huang, Xin Yan, Jingdong Sun, Qiaolei Huang, J. Fan, Songping Wu, Dave Zhang, Huan Liao, Shuai Jin, Zhiping Yang","doi":"10.1109/EMCSI38923.2020.9191587","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191587","url":null,"abstract":"In modern mobile electronic systems, USB connector has been identified as one of the dominant noise sources for desense issues. In this paper, the noise coupled to the Wi-Fi antenna from a USB connector is investigated. With the assistance of full-wave simulations, the root cause of desense noise is identified as the non-ideal electrical connection between the metal chassis and the USB receptacle shell where it is installed. The proposed radiation mechanism is validated through measurements of a real tablet device, and 15 dB noise level reduction is observed with a better grounding structure.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125412735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance 任意目标阻抗下基于最小解耦电容数的遗传算法PDN优化
F. de Paulis, R. Cecchetti, C. Olivieri, Markus Buecker
{"title":"Genetic Algorithm PDN Optimization based on Minimum Number of Decoupling Capacitors Applied to Arbitrary Target Impedance","authors":"F. de Paulis, R. Cecchetti, C. Olivieri, Markus Buecker","doi":"10.1109/EMCSI38923.2020.9191458","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191458","url":null,"abstract":"The current demand in Power Distribution Network (PDN) design is characterized by the accurate placement of decoupling capacitors and the minimization of their number aimed at cost saving. The paper proposes an optimization algorithm for accordingly placing decoupling capacitors one-by-one and iteratively evaluating the cost function of each PDN design solution. This allows the designer to identify the minimum number of decaps whenever the input impedance satisfies the target impedance requirements. The algorithm is based on the Genetic Algorithm accordingly adapted for the specific application of PDN design. It may involve the evaluation of the input impedance at multiple locations, representing either multiple ICs, as well as multiple power input areas/pins of the same IC. The validation of the developed optimization algorithm is carried out by applying it to a manufactured PCB and by employing typical (low inductance) decaps for PDN design. The optimization process led to a decap configuration that effectively takes into account the decap value, the parasitics inductance, and the decap location. An accurate experimental test further validates the optimized PDN.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128531191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
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