Effects of Various Via Patterns on Resonance and Crosstalk in High Speed Printed Circuit Boards

Abstract

Resonance and crosstalk due to via patterns are critical in design of high-speed multi-layer printed circuit boards (PCBs). Crosstalk causes compliance issues whereas resonance limits bandwidth. These factors can also generate jitter and as a result, degrade signal quality. In this paper, different approaches based on via patterns are proposed to minimize crosstalk and to improve resonance by varying different parameters such as via size and pitch, orthogonal and hexagonal via arrays. Results of the approaches are analyzed and evaluated in terms of crosstalk and resonance on multi-layer, high-speed printed circuit boards. A significant improvement in crosstalk, up-to 12 dB and up-to 8GHz in bandwidth is obtained.