1985 EIC 17th Electrical/Electronics Insulation Conference最新文献

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Computer-assisted selection/development of electrical insulating materials by use of Artificial Intelligence 利用人工智能计算机辅助选择/开发电绝缘材料
1985 EIC 17th Electrical/Electronics Insulation Conference Pub Date : 1985-09-01 DOI: 10.1109/EIC.1985.7458602
W-F. A. Su, A. Grosset, A. Barrett
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引用次数: 0
Evaluation of several polymer films for use as electrical insulators 几种用作电绝缘体的聚合物薄膜的评价
1985 EIC 17th Electrical/Electronics Insulation Conference Pub Date : 1985-04-01 DOI: 10.1109/EIC.1985.7458584
H. McCoy, C. Brinkman
{"title":"Evaluation of several polymer films for use as electrical insulators","authors":"H. McCoy, C. Brinkman","doi":"10.1109/EIC.1985.7458584","DOIUrl":"https://doi.org/10.1109/EIC.1985.7458584","url":null,"abstract":"A facility was developed in which polymer samples were aged to 32,700 h with an applied load of 6.9 MPa and at temperatures of 70, 110, 135, and 160°C. The aging environment was 0.4 MPa (4 atm) SF6 containing either 4 or 40 Pa (40 or 400 µatm) H2O. The polymers evaluated to 32,700 h were polyethylene terephthalate, polycarbonate, polyparabanic acid, polyethersulfone, and polyimide. Polysulfone and polyetherimide were aged to 11,200 h. Only polyethylene terephthalate showed any interaction with the environment, and this was in the form of higher moisture causing greater reductions in fracture strain. Electrical breakdown measurements were made on most of the aged samples, and there were no reductions in breakdown voltage as a result of aging. The sticking temperatures between polymers was determined to be 160°C for polyethylene terephthalate; 110°C for polycarbonate; 160°C for polysulfone; and >160°C for polyetherimide, polyethersulfone, polyparabanic acid, and polyimide.","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1985-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115551532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
The replacement of precious metal thick film inks using new conductive polymer technology 采用新型导电聚合物技术替代贵金属厚膜油墨
1985 EIC 17th Electrical/Electronics Insulation Conference Pub Date : 1985-02-28 DOI: 10.1109/EIC.1985.7458628
R. Selwood, A. Zelinski, G. Rosenberger
{"title":"The replacement of precious metal thick film inks using new conductive polymer technology","authors":"R. Selwood, A. Zelinski, G. Rosenberger","doi":"10.1109/EIC.1985.7458628","DOIUrl":"https://doi.org/10.1109/EIC.1985.7458628","url":null,"abstract":"This work was undertaken as a feasibility study with limited actual testing. However, the four synthetic metal/conductive polymer systems studied in polymer thick film applications gave generally favorable results. There are many obstacles to be overcome in order to go from feasibility to practical applications. Prime among these is the need to develop alternative procedures to the conventional screen printed hybrid circuit. Application of these materials as a dispersed phase is not thought to be the best method of utilizing them. A method whereby the application could be as a bulk continuous form would greatly increase the sheet conductivity and possibly eliminate the need to dissolve or disperse. One of several possible approaches would be to utilize existing polymer processing methods, e.g. extrusion molding. The question of ambient stability which has been a fundamental shortcoming of all synthetic metal/conductive polymer technology to date remains to be determined. The limited observations suggest that incorporation of these materials into organic resin systems combined with protective overcoats greatly increase the probability of long-term stability.","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1985-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121560587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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