{"title":"采用新型导电聚合物技术替代贵金属厚膜油墨","authors":"R. Selwood, A. Zelinski, G. Rosenberger","doi":"10.1109/EIC.1985.7458628","DOIUrl":null,"url":null,"abstract":"This work was undertaken as a feasibility study with limited actual testing. However, the four synthetic metal/conductive polymer systems studied in polymer thick film applications gave generally favorable results. There are many obstacles to be overcome in order to go from feasibility to practical applications. Prime among these is the need to develop alternative procedures to the conventional screen printed hybrid circuit. Application of these materials as a dispersed phase is not thought to be the best method of utilizing them. A method whereby the application could be as a bulk continuous form would greatly increase the sheet conductivity and possibly eliminate the need to dissolve or disperse. One of several possible approaches would be to utilize existing polymer processing methods, e.g. extrusion molding. The question of ambient stability which has been a fundamental shortcoming of all synthetic metal/conductive polymer technology to date remains to be determined. The limited observations suggest that incorporation of these materials into organic resin systems combined with protective overcoats greatly increase the probability of long-term stability.","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1985-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The replacement of precious metal thick film inks using new conductive polymer technology\",\"authors\":\"R. Selwood, A. Zelinski, G. Rosenberger\",\"doi\":\"10.1109/EIC.1985.7458628\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work was undertaken as a feasibility study with limited actual testing. However, the four synthetic metal/conductive polymer systems studied in polymer thick film applications gave generally favorable results. There are many obstacles to be overcome in order to go from feasibility to practical applications. Prime among these is the need to develop alternative procedures to the conventional screen printed hybrid circuit. Application of these materials as a dispersed phase is not thought to be the best method of utilizing them. A method whereby the application could be as a bulk continuous form would greatly increase the sheet conductivity and possibly eliminate the need to dissolve or disperse. One of several possible approaches would be to utilize existing polymer processing methods, e.g. extrusion molding. The question of ambient stability which has been a fundamental shortcoming of all synthetic metal/conductive polymer technology to date remains to be determined. The limited observations suggest that incorporation of these materials into organic resin systems combined with protective overcoats greatly increase the probability of long-term stability.\",\"PeriodicalId\":188957,\"journal\":{\"name\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1985-02-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1985.7458628\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1985 EIC 17th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1985.7458628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The replacement of precious metal thick film inks using new conductive polymer technology
This work was undertaken as a feasibility study with limited actual testing. However, the four synthetic metal/conductive polymer systems studied in polymer thick film applications gave generally favorable results. There are many obstacles to be overcome in order to go from feasibility to practical applications. Prime among these is the need to develop alternative procedures to the conventional screen printed hybrid circuit. Application of these materials as a dispersed phase is not thought to be the best method of utilizing them. A method whereby the application could be as a bulk continuous form would greatly increase the sheet conductivity and possibly eliminate the need to dissolve or disperse. One of several possible approaches would be to utilize existing polymer processing methods, e.g. extrusion molding. The question of ambient stability which has been a fundamental shortcoming of all synthetic metal/conductive polymer technology to date remains to be determined. The limited observations suggest that incorporation of these materials into organic resin systems combined with protective overcoats greatly increase the probability of long-term stability.