Proceedings of WESCON'95最新文献

{"title":"Electric hybrid module based specialty car design","authors":"K. Bohan","doi":"10.1109/WESCON.1995.485442","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485442","url":null,"abstract":"Background The vast majority of automobiles made in the United states today are manufactured by one of three major auto manufacturers. It is intrinsic in their nature to act conservatively. The big three's large production runs represents a huge amount of capitalization. The amount of capital being invested is the real driving factor behind the conservative nature of these companies. In the computer industries we have seen a significant number of small start up companies as the driving force behind technological change. If a large company does not do it, a small venture capital company will certainly fill the vacuum. Unfortunately, the existing auto industry does not have a strong startup company presence. Even into the 1920's, the specialty car or custom coach work manufactures represented a lively part of the auto economy. It was not until the coming of the great depression that the small specialty car manufacture was virtually eliminated. Today we see the beginnings of a comeback of the specialty car manufacturer in the kit car industry of today.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125466983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Neural networks in nonlinear aircraft flight control","authors":"A. Calise","doi":"10.1109/WESCON.1995.485489","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485489","url":null,"abstract":"This paper describes an approach for incorporating a neural network with real-time learning capability in a flight control architecture. The architecture is also applicable, in general, for the control of processes described by nonlinear differential equations of motion in which there exists a control for each degree of freedom. The main features are that the defining equations of motion for the process to be controlled are poorly known with respect to their functional forms, and that the functional forms, themselves, may undergo sudden and unexpected variation. It is well known that such systems are difficult to control, particularly when the effect of the control action enters nonlinearly. Numerical results based on 6DOF simulations of a high performance aircraft are presented to illustrate the potential benefits of incorporating neural networks as a part of a flight control system architecture.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132534537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Encoding solutions for MPEG systems","authors":"A. Saraiya, William Chien","doi":"10.1109/WESCON.1995.485492","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485492","url":null,"abstract":"Real-time digital video and audio compression has become a reality with integrated silicon solutions like C-Cube’s VideoRISC Processor (MU’). This paper provides an overview of two MPEG-1 encoding solutions. One paradigm, capture-edit-recode, enables desktop multimedia authoring for business and home use. The other, real-time authoring, allows the creation of high throughput, fully mastered content for movies, video karaoke, and interactive titles. Both solutions deliver quality MPEG-1 encoding in a rapid, cost-effective fashion. MPEG-1 Video Compression In 1993, the IS0 Moving Pictures Experts Group (MPEG) Committee finalized the MPEG-1 standard. MPEG-1, an open standard for coding of digital video and audio, enabled the delivery of digital video and audio at the rate of 1.563 Mbits/sec over single-speed (IX) CD-ROM drives, as well as transmission over T1 lines. In addition to solving the bandwidth, storage, and transmission problems of digital video, MPEG1 promised to enable the delivery of random access, VHS quality digital video at a low cost. In the time since 1993, MPEG-1 based solutions have been widely adopted in VideoCD applications. The prediction is that over two million VideoCD players will be sold worldwide in 1995 and that strong growth will","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116579779","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electrical two and three dimensional modelling of high-speed board to board interconnections","authors":"M. Gailus, M. Fusi, F. Zanella","doi":"10.1109/WESCON.1995.485259","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485259","url":null,"abstract":"In today's high speed electronic systems, board-to-board connectors can contribute to signal degradation, reflections, and crosstalk. Methods exist for using computer modeling to predict the electrical behavior of interconnections from a knowledge of their materials and construction. A typical modeling process utilizes a combination of 2 or 3 dimensional electromagnetic field solvers to derive an approximate circuit model of the connector. Predictions of connector electrical performance are then obtained by plugging this connector model into a model test circuit and simulating the combination with circuit simulation software such as SPICE. ( Figure 1 shows as an example a six-row 2mm-grid backplane connector discussed in this paper. 1","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114739872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effective use of line termination in high speed logic","authors":"S. Hronik","doi":"10.1109/WESCON.1995.485255","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485255","url":null,"abstract":"","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130326543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IntelliCAD: the CAD for MEMS","authors":"F. Maseeh","doi":"10.1109/WESCON.1995.485298","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485298","url":null,"abstract":"The absence of manufacturing know-how in an accessible and useful form explains much of micromanufacturers's inability to supply the existing demand for microelectromechanical system(s) (MEMS). InteIliCAD is an integrated software tool that simulates the design and manufacturing of MEMS and the mechanical aspects of semiconductor structures. The aim of IntelliCAD is to fill the gap in microfabrication know-how and to reduce timely process iterations by first mimicking them on a workstation. IntelliCAD allows a single user or a group of users to design, fabricate, visualize, and test the performance of a device in a completely integrated en vi ro n ment . Introduction to the MEMS market U.S. industry has a large opportunity with microsensors and other MEMS. Because these devices are tiny and can be made at a very low cost, they not only are replacing traditional sensors but can find applications in new areas. MEMS have geometries measured in microns like ubiquitous ICs and have potential applications wherever traditional devices are found. In 1994 the market for micromachined sensors was approximately $1.4 billion with applications in automotive, biomedical, process control, aerospace and other industries. The automotive industry in particular has invested heavily in MEMS sensors because they present tremendous cost savings. Five ISBN# 0-7803-2636-9 years ago the annual production of MEMS for engine and transmission controls and diagnostics was more than 12 million units per year in the U.S. [High Technology Business, Sept. Oct. 1989, p. 291. This number has steadily increased since then with the drive for ever better fuel efficiency and lower emissions. Another large automotive application is silicon accelerometers for air bag release, anti-lock brakes and smart suspension. Silicon micromachining promises to reduce the costs in making MEMS because the process technology is very similar to that used in the high-volume manufacturing of semiconductor integrated-circuits (ICs). Rather than building electrical components like transistors and capacitors in silicon, manufacturers micromachine electromechanical elements for sensors and actuators. With the advantages of lower cost and widespread knowledge of semiconductor process technology, why is the MEMS market so small today? The reason is the lack of manufacturing knowledge in making the tremendous variety of miniature mechanical components. Semiconductor ICs have the advantage of commonalty: the technology advances made for high volume DRAM production spread quickly to other devices such as microprocessors and other types of memories. The MEMS market has yet to benefit from a similar commonalty.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129400877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Emulation: prototyping without the hassles of FPGA-to-ASIC conversion","authors":"M. Courtoy","doi":"10.1109/WESCON.1995.485292","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485292","url":null,"abstract":"FPGAs have been gaining momentum as the tool of choice for creating prototypes of new ASIC designs. The requirement to create prototypes of new designs is driven by multiple factors. Key elements among those are definitely the combination of the increasing complexity of designs and the shrinking development schedules imposed on the engineering teams. On the design creation side, the emergence of synthesis technology is helping designers to meet the increasing pressures of complexity and shorter time schedules. But this has not been matched by a corresponding increase in the performance of verification tools. This has created a discrepancy between the performance on the design creation on one side and the design verification on the other side which is fueling the requirement for increased verification performance. Hence the re-emergence of prototyping for design verification a sequel it is since today’s implementation of prototypes based on FPGAs is truly a reincarnation of the traditional breadboarding approach. Other verificatic,technologies offel. no substitute for prototyping when it comes to full system-level verification. System-level verification or validation implies the ability to check the new design in its final environment I including the final hardware and software configurations. An FPGA-based hardware prototype delivers this key benefit: it can be plugged in the final target system (ICE InCircuit Emulation) and operates at frequencies that allow productive software debug. Table 1 clearly indicates how prototyping bridges the verification performance gap created by the increasing design complexities and offers the possibility to verify software. This is why prototyping has become a key tool in developing high quality products.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124616977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IC package modeling and characterization for RF applications","authors":"Zemo Yang, D. Moore, J. Ewanich","doi":"10.1109/WESCON.1995.485260","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485260","url":null,"abstract":"A novel method to study the parasitic effect of IC packages in RF application is introduced in this paper. As an application of the method, a case study of PQFP32 (7 x 7 x 1.4 mm body) package modeling, the coupling noise and effective ground inductance is investigated. Package design optimization upon the RF performance as well as thermal performance are also discussed.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134529786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Miniaturization of circuit protection devices to meet surface mount applications","authors":"A. J. Neuhalfen","doi":"10.1109/WESCON.1995.485272","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485272","url":null,"abstract":"The electronic industry's trend toward surface mount teohnology is influencing the fabrication methodology of all components including circuit protection devices. Conventional circuit protection devices such as fuses are typically constructed of wire filaments as the fusible link. However, the packaging constraints of surface mount components makes it extremely diffkult to handle small filament wires in a cost effective manner. The fabrication of fuses and the packaging of the components has demanded that fuse designers and manufacturers consider other technologies for the construction of these devices. For surface mount fuses configured in a \"1206\" package sue, these technologies include electroless copper thin film deposition, sputtered aluminum thin film deposition, and gold wire bond processing, This paper will discuss these fabrication technologies and address a comparison of the attributes, both physical and electrical, of these technologies as viable fusible links for various surface mount fuse constructions. INTRODUCTION The electronic industry's trend toward smaller, higher density, and increased functionality products has accelerated the utilization of surface mount technology (SMT) components. These SMT components offer advantages over through-hole technology devices in terms of reduced size, decreased weight, lower profile, and cost effectiveness in manufacturing. The transition toward the use of surface mount components and its associated packaging is influencing the fabrication technologies of all components including circuit protection devices. Surface mount fuses, as one form of circuit protection device, offer the circuit design engineer the ability to protect critical components and circuitry at the board level instead of depending on protection devices external to the circuit board or module. Traditional fuses are typically constructed of wire filaments as the fusible link; however, the paokaging constraints of surface mount components makes it extremely difficult to handle the small filament wires in a cost effective manner. The construction of fusible elements and the packaging of the components has demanded that fuse manufacturers consider modifications to current technologies and investigate alternative technologies for the fabrication of these devices. This paper will discuss the technological trends in miniaturizing circuit protection devices for use in surface mount technology applications. Further, the fabrication technologies of various surface mount fuses, and the advantages and disadvantages of each, will be addressed. MINIATURIZATION TRENDS OF CIRCUIT PROTECTION DEVICES The package size reduction trend for surface mount fuses is closely following the trend of the surface mount chip resistor. The surface mount fuse is the fastest growing market among circuit protection devices in the electronics industry, and presumably the \"1206\" size fuse is the preferred package size for surface mount applications. To meet the dem","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132137506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The future trends of PC Card Host Controllers","authors":"O. Baltuch, P. Holden","doi":"10.1109/WESCON.1995.485268","DOIUrl":"https://doi.org/10.1109/WESCON.1995.485268","url":null,"abstract":"This discussion focuses on the future trends of PC-Card Host Controllers and the industry market forces which are shaping that future. The PC Card Host Controllers are the interface between a computer systems’ central bus structure and a Socket which conforms to the PC Card Standard Specification. Most host controllers follow an original standard register set which as defined and used by Intel Corporation in the i82365SL chip.","PeriodicalId":177121,"journal":{"name":"Proceedings of WESCON'95","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134399705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}