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International Congress on Laser Advanced Materials Processing最新文献

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Numerical modeling of keyhole dynamics in laser welding 激光焊接锁孔动力学数值模拟
International Congress on Laser Advanced Materials Processing Pub Date : 2003-03-03 DOI: 10.1117/12.497916
Wenhai Zhang, Jun Zhou, H. Tsai
{"title":"Numerical modeling of keyhole dynamics in laser welding","authors":"Wenhai Zhang, Jun Zhou, H. Tsai","doi":"10.1117/12.497916","DOIUrl":"https://doi.org/10.1117/12.497916","url":null,"abstract":"Mathematical models and the associated numerical techniques have been developed to study the following cases: (1) the formation and collapse of a keyhole, (2) the formation of porosity and its control strategies, (3) laser welding with filler metals, and (4) the escape of zinc vapor in laser welding of galvanized steel. The simulation results show that the formation of porosity in the weld is caused by two competing mechanisms: one is the solidification rate of the molten metal and the other is the speed that molten metal backfills the keyhole after laser energy is terminated. The models have demonstrated that porosity can be reduced or eliminated by adding filler metals, controlling laser tailing power, or applying an electromagnetic force during keyhole collapse process. It is found that a uniform composition of weld pool is difficult to achieve by filler metals due to very rapid solidification of the weld pool in laser welding, as compared to that in gas metal arc welding.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126634153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
High-power CO2 laser welding of Al alloy plates 大功率CO2激光焊接铝合金板材
International Congress on Laser Advanced Materials Processing Pub Date : 2003-03-03 DOI: 10.1117/12.497781
Zhaogu Cheng, Guoliang Xu, Quanzhong Zhao, Y. Lu
{"title":"High-power CO2 laser welding of Al alloy plates","authors":"Zhaogu Cheng, Guoliang Xu, Quanzhong Zhao, Y. Lu","doi":"10.1117/12.497781","DOIUrl":"https://doi.org/10.1117/12.497781","url":null,"abstract":"Using a high power pulse transverse flow CO2 laser developed in our lab, a series of thin Al alloy plates were successfully welded. Effects of processing parameters (beam quality, laser power, welding speed and assisting gas et al) on weldability of Al alloy plates were given. A key technique, artificial keyhole caused by the gap between two Al alloy butt plates is successfully used, which helped to break through their high reflectivity at 10.6 μm wavelength and enhanced the energy coupling efficiency. The weld thickness of Al alloy plates reached 4 mm with 3 kW CO2 laser average output power. Microhardness and tensile tests showed that for some Al alloys, mechanical properties of the welds could be near or equal to base material with the artificial keyhole technique and suitable processing parameters.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121710313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Double focus technique: influence of focal distance and intensity distribution on the welding process 双焦点技术:焦距和强度分布对焊接过程的影响
International Congress on Laser Advanced Materials Processing Pub Date : 2003-03-03 DOI: 10.1117/12.497798
W. Gref, A. Russ, Markus Leimser, F. Dausinger, H. Huegel
{"title":"Double focus technique: influence of focal distance and intensity distribution on the welding process","authors":"W. Gref, A. Russ, Markus Leimser, F. Dausinger, H. Huegel","doi":"10.1117/12.497798","DOIUrl":"https://doi.org/10.1117/12.497798","url":null,"abstract":"Double focus welding is a proven technique to reduce or even to avoid blowholes and porosity in the welding process of aluminum. The application of two focal spots arranged close to each other offers advantages concerning process stability and quality, which is a result of a more stable keyhole geometry respectively of modified energy coupling and fluid dynamic conditions. The opportunity of designing a task-adapted intensity distribution opens possibilities for the bridging of gaps and the shaping of the weld seam geometry which means an increase of flexibility. This contribution will discuss the joining process and will show the connection between spot distance and intensity distribution on one hand and the welding result -- depth, efficiency and quality -- on the other hand.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121764379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Analysis on resin removal in laser drilling of printed circuit board 印刷电路板激光打孔中树脂去除问题分析
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.499621
S. Noguchi, E. Ohmura, I. Miyamoto
{"title":"Analysis on resin removal in laser drilling of printed circuit board","authors":"S. Noguchi, E. Ohmura, I. Miyamoto","doi":"10.1117/12.499621","DOIUrl":"https://doi.org/10.1117/12.499621","url":null,"abstract":"On laser drilling of printed circuit board, one-dimensional non-steady heat conduction problem of two-layers composed of resin and metal was analyzed with the finite element method (FEM), considering resinous evaporation. Validity of analysis method was verified by comparing with experimental results. The main conclusions are as follows: (1) Proportionality between latent heat of evaporation and absorptivity can be obtained using the experimental results of removal quantity when resin is thick enough. These values can be estimated simultaneously by comparing analytical results by FEM and experimental results. (2) An equation for rough estimate of maximum removal velocity was derived. (3) Removal quantity is proportional to the number of shots, but its proportionality is lost after layer thickness reaches to absorption length, yielding smear in practical use. Residual smear is caused by heat conduction to substrate during pulse. (4) Removal quantity depends on fluence most, but hardly depends on repetition rate. When resin thickness is larger than absorption length, removal quantity per pulse is proportional to fluence. (5) Removal velocity becomes larger with shorter pulse width. When resin thickness is smaller than absorption length, residual thickness increases as pulse width becomes long.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127124351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Characteristics of electric devices made by direct nanoparticle spraying 纳米颗粒直接喷涂制备电子器件的特性
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486523
E. Ozawa, Y. Kawakami, Toshinobu Yoshida, M. Iwashina, Kazutoshi Takahashi
{"title":"Characteristics of electric devices made by direct nanoparticle spraying","authors":"E. Ozawa, Y. Kawakami, Toshinobu Yoshida, M. Iwashina, Kazutoshi Takahashi","doi":"10.1117/12.486523","DOIUrl":"https://doi.org/10.1117/12.486523","url":null,"abstract":"Metal nanoparticles films were prepared by a gas deposition technique couple with the nanosecond pulsed Nd:YAG laser ablation of two kinds of metal targets. Two generated nanoparticles were insitu mixed in the near space of the targets in the generation chamber and transported by a helium carrier gas to the deposition chamber and deposited on a substrate to form electric devices such as a resistor, a capacitor, wiring, etc., composed of nanoparticles composites. The electrical resistivity and capacity of the devices were measured. The relationship between the experimental conditions such as ambient pressure and laser fluences and the electrical properties of each device were analyzed. A heater was produced as an example of the application of a resistor.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129876177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Diffractive/refractive hybrid f-theta lens for laser drilling of multilayer printed circuit boards 用于多层印刷电路板激光打孔的衍射/折射混合f-theta透镜
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486556
K. Fuse, T. Okada, K. Ebata
{"title":"Diffractive/refractive hybrid f-theta lens for laser drilling of multilayer printed circuit boards","authors":"K. Fuse, T. Okada, K. Ebata","doi":"10.1117/12.486556","DOIUrl":"https://doi.org/10.1117/12.486556","url":null,"abstract":"A new type of f-theta lens has recently been developed for microvia laser drilling of multilayer printed circuit boards. It employs a diffractive/refractive hybrid lens which has a blazed surface-relief microstructure on an aspheric surface. By introducing that hybrid lens for CO2 laser system, and by stopping the use of germanium that is optically much sensitive to temperature, the f-theta lens that consists of all zinc selenide lenses is obtained with its optical performance stable on temperature. Achromatic properties against the wavelength fluctuations of actual lasers are also achieved. A prototype is fabricated through the development of single point diamond turning of hybrid surfaces. The performance of the lens is first examined by measuring wavefront error with a tunable infrared interferometer. The results show diffraction-limited performance at all conditions, including different temperatures (up to 50°C) and wavelengths. The temperature dependence of the focal length of the lens is also measured and found to be 5 times as insensitive to temperature as that of a conventional one. Laser drilling experiments are performed for a polymide film on copper foil. The result shows good uniformity of hole size and circularity all over the 50×50 mm2 scan field.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128387342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Challenge to advanced materials processing with lasers in Japan 日本对先进材料激光加工的挑战
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486592
I. Miyamoto
{"title":"Challenge to advanced materials processing with lasers in Japan","authors":"I. Miyamoto","doi":"10.1117/12.486592","DOIUrl":"https://doi.org/10.1117/12.486592","url":null,"abstract":"Japan is one of the most advanced countries in manufacturing technology, and lasers have been playing an important role for advancement of manufacturing technology in a variety of industrial fields. Contribution of laser materials processing to Japanese industry is significant for both macroprocessing and microprocessing. The present paper describes recent trend and topics of industrial applications in terms of the hardware and the software to show how Japanese industry challenges to advanced materials processing using lasers, and national products related to laser materials processing are also briefly introduced.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124119386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Effects of wavelengths on processing indium tin oxide thin films using diode-pumped Nd:YLF laser 波长对二极管泵浦Nd:YLF激光器加工氧化铟锡薄膜的影响
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486570
R. Tanaka, T. Takaoka, H. Mizukami, T. Arai, Y. Iwai
{"title":"Effects of wavelengths on processing indium tin oxide thin films using diode-pumped Nd:YLF laser","authors":"R. Tanaka, T. Takaoka, H. Mizukami, T. Arai, Y. Iwai","doi":"10.1117/12.486570","DOIUrl":"https://doi.org/10.1117/12.486570","url":null,"abstract":"In order to examine the dependence of ITO(Indium Tin Oxide) thin films on wavelengths of laser at ablation, the first, second, third and fourth harmonic of diode-pumped Nd:YLF laser were employed respectively. Patterning was performed successfully at any wavelength. The laser fluence was controlled by defocusing of beam. We made comparisons with each fluence for ablating ITO layer on substrate glass, and observed surface of the glass and edge of groove formed by laser etching. Near the groove, much debris was deposited. So we examined the effects of various sealed gases having molecular weight (e.g. He, N2, Ar). The amount of debris was reduced by only He gas. Additionally we measured index of absorption by ITO and substrate glass for lights. The range for wavelengths was swept from ultraviolet to infrared. In conclusion, we recognized that the removal of ITO was more efficient with increase of absorption of lights.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128594219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
How to sensitively measure the rate of neutral free radical production by photo-deionization of negative ion beams 如何灵敏地测量负离子光束的光去离子化中性自由基的生成速率
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486564
Keiji Hayashi, H. Konno, H. Kojima, M. Minato, T. Oseki, Y. Kawamura, Kenji Kameko, T. Kanayama
{"title":"How to sensitively measure the rate of neutral free radical production by photo-deionization of negative ion beams","authors":"Keiji Hayashi, H. Konno, H. Kojima, M. Minato, T. Oseki, Y. Kawamura, Kenji Kameko, T. Kanayama","doi":"10.1117/12.486564","DOIUrl":"https://doi.org/10.1117/12.486564","url":null,"abstract":"Two measurement methods to determine the rate of neutral free radical production by the photo-deionization of negative ion beams ( PDINIB ) are introduced. These methods, namely, photoelectron-current measurement by low-frequency electro-modulation probe ( PMMP ) and measurement of decrease in the negative-ion beam current ( DNIC ) were employed to evaluate the production rate in a trail surface-processing apparatus developed in the author’s laboratory utilizing a steady-flux refined beam of neutral free radicals produced by the PDINIB procedure. A 63Cu- negative ion beam of kinetic energy Ei varied up to 15 keV was irradiated with a 514.5 nm visible light beam from a 25 W CW Ar+ ion laser. The detection limit of the production rate by the PMMP setup was as high as 6×109/s under the condition that Ei = 15keV, the negative ion beam current Ii = 4 μA, and the laser power P = 6W. The DNIC method is simpler but less reliable than the PMMP method owing to larger uncertainty resulting from the fluctuation of the negative-ion beam current.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132774744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of multi layer ceramic capacitor by pulsed laser deposition 脉冲激光沉积多层陶瓷电容器的研制
International Congress on Laser Advanced Materials Processing Pub Date : 2003-02-21 DOI: 10.1117/12.486580
Satoshi Tsuyuguchi, S. Mustofa, T. Araki, M. Nishida, T. Hino
{"title":"Development of multi layer ceramic capacitor by pulsed laser deposition","authors":"Satoshi Tsuyuguchi, S. Mustofa, T. Araki, M. Nishida, T. Hino","doi":"10.1117/12.486580","DOIUrl":"https://doi.org/10.1117/12.486580","url":null,"abstract":"A thin film is a very attractive material in applications for capacitor material. Since the capacitance of multi layer capacitor is proportional to the number of dielectric layer and it is inversely as thickness, making thickness of film thin has a double advantage, in order to enlarge the capacitance. This research was performed thin film sizing and growth control of BaTiO3, which are used as a dielectric. The increase of capacitance is predominant over the present value of 1nF.","PeriodicalId":159280,"journal":{"name":"International Congress on Laser Advanced Materials Processing","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117328142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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