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Robotic Bees' Swarm Autonomy 机器蜜蜂的蜂群自主性
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589701
Willie D. Jones
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引用次数: 0
Is the Future of Moore's Law in a Particle Accelerator?: Wiggling Electrons Could Turbocharge EUV Lithography 摩尔定律的未来在粒子加速器中吗? 摆动的电子可为超紫外光刻技术提供动力
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589684
John Boyd
{"title":"Is the Future of Moore's Law in a Particle Accelerator?: Wiggling Electrons Could Turbocharge EUV Lithography","authors":"John Boyd","doi":"10.1109/MSPEC.2024.10589684","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589684","url":null,"abstract":"As Intel, Samsung, TSMC, and Japan's upcoming advanced foundry Rapidus each make their separate preparations to cram more and more transistors into every square millimeter of silicon, one thing they all have in common is that the extreme ultraviolet (EUV) lithography technology underpinning their efforts is extremely complex, extremely expensive, and extremely costly to operate. A prime reason is that the source of this system's 13.5-nanometer light is the precise and costly process of blasting flying droplets of molten tin with the most powerful commercial lasers on the planet.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Birding at Night > Detect Migrating Birds with a Plastic Dish and a Cheap Microphone 夜间观鸟 > 用塑料碟和廉价麦克风探测迁徙鸟类
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589678
David Schneider
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引用次数: 0
Careers: Aakhilesh Singhania: This Bosch Engineer Speeds Hybrid Race Cars to the Finish Line 职业生涯Aakhilesh Singhania:这位博世工程师将混合动力赛车带向终点
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589679
Edd Gent
{"title":"Careers: Aakhilesh Singhania: This Bosch Engineer Speeds Hybrid Race Cars to the Finish Line","authors":"Edd Gent","doi":"10.1109/MSPEC.2024.10589679","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589679","url":null,"abstract":"When it comes to motorsports, the need for speed isn't only on the racetrack. Engineers who support race teams also need to work at a breakneck pace to fix problems, and that's something Aakhilesh Singhania relishes.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10589679","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Path to a 1-Trillion-Transistor GPU: AI's Boom Demands New Chip Technology 通往十亿晶体管 GPU 的道路:人工智能的蓬勃发展需要新的芯片技术
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589682
Mark Liu;H.-S. Philip Wong
{"title":"The Path to a 1-Trillion-Transistor GPU: AI's Boom Demands New Chip Technology","authors":"Mark Liu;H.-S. Philip Wong","doi":"10.1109/MSPEC.2024.10589682","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589682","url":null,"abstract":"In 1997 the IBM Deep Blue supercomputer defeated world chess champion Garry Kasparov. It was a ground-breaking demonstration of supercomputer technology and a first glimpse into how high-performance computing might one day overtake human-level intelligence. In the 10 years that followed, we began to use artificial intelligence for many practical tasks, such as facial recognition, language translation, and recommending movies and merchandise.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
5 Questions: Scott Best: Prepping Today's Systems for Tomorrow's Post-Quantum Cryptography 5 个问题:斯科特-贝斯特:让今天的系统为明天的后量子密码学做好准备
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589686
Rahul Rao
{"title":"5 Questions: Scott Best: Prepping Today's Systems for Tomorrow's Post-Quantum Cryptography","authors":"Rahul Rao","doi":"10.1109/MSPEC.2024.10589686","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589686","url":null,"abstract":"Today's cryptographic protocols rely on mathematical techniques like finding the prime factors of very large numbers. But large enough quantum computers would have a powerful tool called Shor's algorithm, which can quickly factor colossal integers.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10589686","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Shrink in Your Pocket 口袋里的收缩器
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589685
Gwendolyn Rak
{"title":"The Shrink in Your Pocket","authors":"Gwendolyn Rak","doi":"10.1109/MSPEC.2024.10589685","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589685","url":null,"abstract":"NEARLY EVERY DAY since she was a child, Alex Leow, a psychiatrist and computer scientist at the University Chicago, has played the piano. Some days she of Illinois plays well and other days her tempo lags and her fingers hit the wrong keys. Over the years, she noticed a pattern: How well she plays depends on her mood. A bad mood or lack of sleep almost always leads to sluggish, mistake-prone music.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Spent But Not Trashed: An Italian Startup Recovers Valuable Materials from Old Solar Panels 废而不弃:一家意大利初创公司从旧太阳能电池板中回收有价值的材料
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589681
Emily Waltz;Luigi Avantaggiato
{"title":"Spent But Not Trashed: An Italian Startup Recovers Valuable Materials from Old Solar Panels","authors":"Emily Waltz;Luigi Avantaggiato","doi":"10.1109/MSPEC.2024.10589681","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589681","url":null,"abstract":"INSIDE a shipping container in an industrial area of Venice, the Italian startup 9-Tech is taking a crack at a looming global problem: how to responsibly recycle the 54 million to 160 million tonnes of solar modules that are expected to reach the end of their productive lives by 2050. Recovering the materials won't be easy. Solar panels are built to withstand any environment on Earth for 20 to 30 years, and even after sitting in the sun for three decades, the hardware is difficult to dismantle. In fact, most recycling facilities trash the silicon, silver, and copper—the most valuable but least accessible materials in old solar panels—and recover only the aluminum frames and glass panes.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Moore on Chip Scaling: Scaling Compute to Satiate AI's Appetite Will Take Extreme Measures 芯片上的摩尔扩展:扩大计算规模以满足人工智能的胃口需要采取极端措施
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589680
Harry Goldstein
{"title":"Moore on Chip Scaling: Scaling Compute to Satiate AI's Appetite Will Take Extreme Measures","authors":"Harry Goldstein","doi":"10.1109/MSPEC.2024.10589680","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589680","url":null,"abstract":"Fifty years ago, DRAM inventor and IEEE Medal of Honor recipient Robert Dennard created what essentially became the semiconductor industry's path to perpetually increasing transistor density and chip performance. That path became known as Dennard scaling, and it helped codify Gordon Moore's postulate about device dimensions shrinking by half every 18 to 24 months. For decades it compelled engineers to push the physical limits of semiconductor devices.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10589680","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583596","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cover 3 封面 3
IF 2.6 4区 工程技术
IEEE Spectrum Pub Date : 2024-07-09 DOI: 10.1109/MSPEC.2024.10589689
{"title":"Cover 3","authors":"","doi":"10.1109/MSPEC.2024.10589689","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10589689","url":null,"abstract":"","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":null,"pages":null},"PeriodicalIF":2.6,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10589689","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141583553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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