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Cover 4 封面4
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476975
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引用次数: 0
A New Way to Paint Color: Dial up Hues on Demand 一种新的方式来画颜色：拨号色调的需求
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476981
Sandesh Manik
{"title":"A New Way to Paint Color: Dial up Hues on Demand","authors":"Sandesh Manik","doi":"10.1109/MSPEC.2026.11476981","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476981","url":null,"abstract":"We're all familiar with mixing red, yellow, and blue paint in various ratios to instantly make all kinds of colors. This works great for oils or water-colors, but fails when it comes to cans of spray paint. The paint droplets can't be blended once they are aerosolized. Consequently, although spray cans are great for applying even coats of paint to large areas very quickly, spray-paint artists need a separate can for every color they want to use—until now.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"16-18"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cover 3 覆盖3
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476989
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引用次数: 0
What will it Take to Build the World's Largest Data Center?: Meta's 5-Gigawatt AI Data Center is Forcing Engineers to Throw Out the Rule Book 建造世界上最大的数据中心需要什么？Meta的5千兆瓦人工智能数据中心正迫使工程师们抛弃规则手册
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476980
Matthew S. Smith
{"title":"What will it Take to Build the World's Largest Data Center?: Meta's 5-Gigawatt AI Data Center is Forcing Engineers to Throw Out the Rule Book","authors":"Matthew S. Smith","doi":"10.1109/MSPEC.2026.11476980","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476980","url":null,"abstract":"The undying thirst for smarter (historically, that means larger) AI models and greater adoption of the ones we already have has led to an explosion in data-center construction projects, unparalleled both in number and scale. Chief among them is Meta's planned 5-gigawatt data center in Louisiana, called Hyperion, announced in June of 2025. Meta CEO Mark Zuckerberg said Hyperion will “cover a significant part of the footprint of Manhattan,” and the first phase—a 2-GW version—will be completed by 2030.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"22-27"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Careers: U.S. Engineering Ph.D. Programs are Under Strain: Enrollment is Down Amid Funding and Immigration Uncertainty 职业：美国工程博士项目面临压力：由于资金和移民的不确定性，入学人数下降
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476832
Aaron Mok
{"title":"Careers: U.S. Engineering Ph.D. Programs are Under Strain: Enrollment is Down Amid Funding and Immigration Uncertainty","authors":"Aaron Mok","doi":"10.1109/MSPEC.2026.11476832","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476832","url":null,"abstract":"U.S. doctoral programs in electrical engineering form the foundation of technological advancement, training the brightest minds in the world to research, develop, and design next-generation electronics, software, electrical infrastructure, and other hightech products and systems. Elite institutions have long served as launchpads for the engineers behind tomorrow's technology.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"19-20"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11476832","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Data: Where Everybody Knows Your Face… 数据：每个人都知道你的脸……
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476985
Lucas Laursen
{"title":"The Data: Where Everybody Knows Your Face…","authors":"Lucas Laursen","doi":"10.1109/MSPEC.2026.11476985","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476985","url":null,"abstract":"Facial-recognition technology (FRT) dates back 60 years. Just over a decade ago, deep-learning methods tipped the technology into more useful—and menacing—territory. Now, retailers, your neighbors, and law enforcement are all storing your face and building up a fragmentary photo album of your life.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"14-15"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665531","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
AI is a Memory Hog: Its Demand Threatens Whole Categories of Electronics 人工智能是一个内存大户：它的需求威胁到整个电子产品类别
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476974
Samuel K. Moore
{"title":"AI is a Memory Hog: Its Demand Threatens Whole Categories of Electronics","authors":"Samuel K. Moore","doi":"10.1109/MSPEC.2026.11476974","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476974","url":null,"abstract":"If it feels these days as if everything in technology is about AI, that's because it is. And nowhere is that more true than in the market for computer memory. Demand, and profitability, for the type of DRAM used to feed GPUs and other accelerators in AI data centers is so huge that it's diverting memory away from the supply needed for other uses and causing prices to skyrocket. According to Counter-point Research, DRAM prices rose at least 80 to 90 percent in the first quarter of 2026. • The largest AI hardware companies are likely first in line for new memory, but that leaves everybody else—makers of PCs, smartphones, TVs, and everything else that needs to temporarily store billions of bits—scrambling to deal with scarce supply and inflated prices. • How did the electronics industry get into this mess, and even more important, how will it get out? IEEE Spectrum asked economists and memory experts to explain. Today's situation, they say, is the result of a collision between the DRAM industry's historic boom-and-bust cycle and an AI hardware infrastructure build-out that's without precedent in its scale. And, barring some major collapse in the AI sector, it will take years for new capacity and new technology to bring supply in line with demand. Even then, prices might stay high. • To understand both the supply and the demand ends of this episode, you need to understand its main culprit: high-bandwidth memory, or HBM.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"28-33"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Past Forward: All Alone in the Abyss 前瞻：孤独的深渊
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476966
Allison Marsh
{"title":"Past Forward: All Alone in the Abyss","authors":"Allison Marsh","doi":"10.1109/MSPEC.2026.11476966","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476966","url":null,"abstract":"Deep Rover was a one-person submersible designed to satisfy human curiosity about the underwater world. As the rover moved freely through the water down to depths of 1,000 meters, its operator sat in relative comfort in the cab, inside a clear acrylic bubble with panoramic views–an inverted fishbowl, with the human immersed in breathable air while the sea creatures looked in.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"48-48"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11476966","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Smart Pill That Can Sense, Sample, and Treat: Ingestible Electronics will Deliver Drugs and Take Biopsies 一种可以感知、取样和治疗的智能药丸：可消化的电子产品将输送药物并进行活检
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476978
Reza Ghodssi;Justin Stine;Luke Beardslee
{"title":"A Smart Pill That Can Sense, Sample, and Treat: Ingestible Electronics will Deliver Drugs and Take Biopsies","authors":"Reza Ghodssi;Justin Stine;Luke Beardslee","doi":"10.1109/MSPEC.2026.11476978","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476978","url":null,"abstract":"One day soon, a doctor might prescribe a pill that doesn't just deliver medicine but also reports back on what it finds inside you—and then takes actions based on its findings.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"34-39"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
5 Questions: Michael Roan: EV Sounds are a Surprisingly Complicated Science Michael Roan: EV的声音是一门非常复杂的科学
IF 2.4 4区 工程技术
IEEE Spectrum Pub Date : 2026-04-01 Epub Date: 2026-04-07 DOI: 10.1109/MSPEC.2026.11476836
Aaron Mok
{"title":"5 Questions: Michael Roan: EV Sounds are a Surprisingly Complicated Science","authors":"Aaron Mok","doi":"10.1109/MSPEC.2026.11476836","DOIUrl":"https://doi.org/10.1109/MSPEC.2026.11476836","url":null,"abstract":"As more EVs hit the roads, pedestrians face a challenge: hearing them. Regulators in the United States, Europe, and elsewhere require EVs to emit warning sounds at low speeds. What may seem like a simple safety measure is a complex web of acoustics, signal design, and human perception.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"63 4","pages":"21-21"},"PeriodicalIF":2.4,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11476836","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147665508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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