IEEE Spectrum最新文献

筛选
英文 中文
Cover 3 封面 3
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491397
{"title":"Cover 3","authors":"","doi":"10.1109/MSPEC.2024.10491397","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491397","url":null,"abstract":"","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"CV3-CV3"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491397","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Why Bloat is Still Software's Biggest Vulnerability: A 2024 plea for lean software 为什么臃肿仍然是软件的最大弱点?2024 年对精益软件的呼吁
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491389
Bert Hubert
{"title":"Why Bloat is Still Software's Biggest Vulnerability: A 2024 plea for lean software","authors":"Bert Hubert","doi":"10.1109/MSPEC.2024.10491389","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491389","url":null,"abstract":"SOME YEARS AGO I DID A TALK at a local university on cybersecurity, titled” Cyber and Infor-mation Security: Have We All Gone Mad?” It is still worth reading today since we have gone quite mad collectively.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"22-50"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cover 4 封面 4
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491396
{"title":"Cover 4","authors":"","doi":"10.1109/MSPEC.2024.10491396","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491396","url":null,"abstract":"","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"CV4-CV4"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491396","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News: Open-Source Hardware Secures a Win > sprung From Risc-v's Roots, the First Open Security Chip Hits the Market 新闻:开源硬件赢得胜利 > 源自 Risc-v 的首款开放式安全芯片投放市场
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491400
Dina Genkina
{"title":"News: Open-Source Hardware Secures a Win > sprung From Risc-v's Roots, the First Open Security Chip Hits the Market","authors":"Dina Genkina","doi":"10.1109/MSPEC.2024.10491400","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491400","url":null,"abstract":"The first commercial silicon chip that includes open-source, built-in hardware security was announced in February by the OpenTitan coalition.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"6-13"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491400","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inkjets Are for More Than Just Printing: They can Build DNA Arrays, 3D Structures, and Much More 喷墨打印机的用途不仅仅是打印:它们能构建 DNA 阵列、三维结构等更多内容
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491386
Phillip W. Barth;Leslie A. Field
{"title":"Inkjets Are for More Than Just Printing: They can Build DNA Arrays, 3D Structures, and Much More","authors":"Phillip W. Barth;Leslie A. Field","doi":"10.1109/MSPEC.2024.10491386","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491386","url":null,"abstract":"IN THE EARLY 1980s, offices were noisy places, filled with the sound of metal striking inked ribbons to mark characters on paper. IBM Selectric typewriters clacked, daisy wheel printers clattered, and dot-matrix printers made loud ripping sounds.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"32-37"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Software Sucks, But It Doesn't Have To: How to make leaner, greener software 软件糟透了,但不必如此:如何制作更精简、更环保的软件
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491394
Asim Hussain
{"title":"Software Sucks, But It Doesn't Have To: How to make leaner, greener software","authors":"Asim Hussain","doi":"10.1109/MSPEC.2024.10491394","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491394","url":null,"abstract":"You can't see, hear, taste, feel, or smell it, but software is everywhere around us. It underpins modern civilization even while consuming more energy, wealth, and time than it needs to and burping out a significant amount of carbon dioxide into the atmosphere. The software industry and the code it ships need to be much more efficient in order to minimize the emissions attributable to programs running in data centers and over transmission networks. Two approaches to software development featured in this issue can help us get there.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"2-2"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Most Hackable Handheld Ham Radio Yet > The UV-K5 can be modded at the click of a mouse 迄今为止最易改装的手持式 Ham 无线电设备 > 轻点鼠标即可改装 UV-K5
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491276
Stephen Cass
{"title":"The Most Hackable Handheld Ham Radio Yet > The UV-K5 can be modded at the click of a mouse","authors":"Stephen Cass","doi":"10.1109/MSPEC.2024.10491276","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491276","url":null,"abstract":"All right, confession time. I don't use my handheld ham radio for much more than eavesdrop-ping on the subway dispatcher when my train rumbles to a mysterious halt in a dark tunnel. But even I couldn't help but hear the buzz surrounding a new handheld, Quansheng's UV-K5.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"16-18"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mechanical Megatalent 机械巨塔
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491398
{"title":"Mechanical Megatalent","authors":"","doi":"10.1109/MSPEC.2024.10491398","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491398","url":null,"abstract":"In late 2023, researchers at Georgia Tech in Atlanta unveiled a robotic performance sculpture they named Medusai. It is modeled after Medusa, the mythological Gorgon who turned anyone who looked at her to stone. The bot has snakelike arms that allow it to simultaneously play percussion and strings and interactively “dance” with observers. “The eerie and uncanny notion of AI-driven robotic snakes following and threatening humans is balanced by the sculpture's potential to inspire humans to push the boundaries of their creativity and expression,” explains Gil Weinberg, the professor at Georgia Tech's Center for Music Technology who heads the team that created Medusai.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"14-15"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10491398","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Messy Reality Behind a Silicon Valley Unicorn 硅谷独角兽背后的混乱现实
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491393
Benjamin Shestakofsky
{"title":"The Messy Reality Behind a Silicon Valley Unicorn","authors":"Benjamin Shestakofsky","doi":"10.1109/MSPEC.2024.10491393","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491393","url":null,"abstract":"A VC-backed startup's push for growth left little time for actual engineering","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"44-49"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140346735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
We Need to Decarbonize Software: The Way We Write Software has Unappreciated Environmental Impacts 我们需要让软件去碳化:我们编写软件的方式对环境的影响尚未得到重视
IF 3.1 4区 工程技术
IEEE Spectrum Pub Date : 2024-04-04 DOI: 10.1109/MSPEC.2024.10491388
Rina Diane Caballar
{"title":"We Need to Decarbonize Software: The Way We Write Software has Unappreciated Environmental Impacts","authors":"Rina Diane Caballar","doi":"10.1109/MSPEC.2024.10491388","DOIUrl":"https://doi.org/10.1109/MSPEC.2024.10491388","url":null,"abstract":"SOFTWARE MAY BE EATING THE WORLD, but it is also heating it. In December 2023, representatives from nearly 200 countries gathered in Dubai for COP28, the U.N.'s climate-change conference, to discuss the urgent need to lower emissions. Meanwhile, COP28's website produced 3.69 grams of carbon dioxide (CO\u0000<inf>2</inf>\u0000) per page load, according to the website sustainability scoring tool Ecograder. That appears to be a tiny amount, but if the site gets 10,000 views each month for a year, its emissions would be a little over that of a one-way flight from San Francisco to Toronto.","PeriodicalId":13249,"journal":{"name":"IEEE Spectrum","volume":"61 4","pages":"26-31"},"PeriodicalIF":3.1,"publicationDate":"2024-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140348360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信